DE60108078D1 - Heizungsanlage und Verfahren zur Heizung für einen Reaktor - Google Patents
Heizungsanlage und Verfahren zur Heizung für einen ReaktorInfo
- Publication number
- DE60108078D1 DE60108078D1 DE60108078T DE60108078T DE60108078D1 DE 60108078 D1 DE60108078 D1 DE 60108078D1 DE 60108078 T DE60108078 T DE 60108078T DE 60108078 T DE60108078 T DE 60108078T DE 60108078 D1 DE60108078 D1 DE 60108078D1
- Authority
- DE
- Germany
- Prior art keywords
- heating
- reactor
- heating system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/005—Oxydation
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01109164A EP1256973B1 (de) | 2001-04-12 | 2001-04-12 | Heizungsanlage und Verfahren zur Heizung für einen Reaktor |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60108078D1 true DE60108078D1 (de) | 2005-02-03 |
DE60108078T2 DE60108078T2 (de) | 2005-12-01 |
Family
ID=8177130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60108078T Expired - Fee Related DE60108078T2 (de) | 2001-04-12 | 2001-04-12 | Heizungsanlage und Verfahren zur Heizung für einen Reaktor |
Country Status (8)
Country | Link |
---|---|
US (1) | US6802712B2 (de) |
EP (1) | EP1256973B1 (de) |
JP (1) | JP2004529497A (de) |
KR (1) | KR100561120B1 (de) |
CN (1) | CN1288713C (de) |
DE (1) | DE60108078T2 (de) |
TW (1) | TW541576B (de) |
WO (1) | WO2002084711A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7220312B2 (en) * | 2002-03-13 | 2007-05-22 | Micron Technology, Inc. | Methods for treating semiconductor substrates |
FR2847714B1 (fr) | 2002-11-27 | 2005-02-18 | Soitec Silicon On Insulator | Procede et dispositif de recuit de tranche de semiconducteur |
FR2858715B1 (fr) | 2003-08-04 | 2005-12-30 | Soitec Silicon On Insulator | Procede de detachement de couche de semiconducteur |
US8053324B2 (en) * | 2007-08-01 | 2011-11-08 | Texas Instruments Incorporated | Method of manufacturing a semiconductor device having improved transistor performance |
CN102969220A (zh) * | 2011-09-02 | 2013-03-13 | 上海华虹Nec电子有限公司 | 使用炉管进行工艺加工的方法 |
US10741426B2 (en) * | 2017-09-27 | 2020-08-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for controlling temperature of furnace in semiconductor fabrication process |
TWI750749B (zh) * | 2020-07-28 | 2021-12-21 | 華邦電子股份有限公司 | 化學氣相沉積製程及膜層的形成方法 |
CN114308947A (zh) * | 2020-09-30 | 2022-04-12 | 中国科学院微电子研究所 | 多晶硅生产设备的清洗方法、清洗装置及多晶硅生产设备 |
CN112941489A (zh) * | 2021-01-27 | 2021-06-11 | 长鑫存储技术有限公司 | 薄膜沉积方法以及薄膜沉积装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960001160B1 (ko) * | 1987-07-31 | 1996-01-19 | 도오교오 에레구토론 가부시끼가이샤 | 가열로(加熱爐) |
US5259883A (en) * | 1988-02-16 | 1993-11-09 | Kabushiki Kaisha Toshiba | Method of thermally processing semiconductor wafers and an apparatus therefor |
US5436172A (en) * | 1991-05-20 | 1995-07-25 | Texas Instruments Incorporated | Real-time multi-zone semiconductor wafer temperature and process uniformity control system |
US5387557A (en) * | 1991-10-23 | 1995-02-07 | F. T. L. Co., Ltd. | Method for manufacturing semiconductor devices using heat-treatment vertical reactor with temperature zones |
US5418885A (en) * | 1992-12-29 | 1995-05-23 | North Carolina State University | Three-zone rapid thermal processing system utilizing wafer edge heating means |
US5775889A (en) * | 1994-05-17 | 1998-07-07 | Tokyo Electron Limited | Heat treatment process for preventing slips in semiconductor wafers |
EP1093664A4 (de) * | 1998-05-11 | 2003-07-09 | Semitool Inc | Temperaturkontrollsystem für thermoreaktor |
ATE279784T1 (de) * | 1998-12-17 | 2004-10-15 | Vishay Semiconductor Itzehoe G | Verfahren zur bor-dotierung von wafern unter einsatz eines vertikalofensystems |
EP1187188A4 (de) * | 2000-02-18 | 2004-05-26 | Tokyo Electron Ltd | Waferverarbeitungsverfahren |
US6495805B2 (en) * | 2000-06-30 | 2002-12-17 | Tokyo Electron Limited | Method of determining set temperature trajectory for heat treatment system |
US6572371B1 (en) * | 2002-05-06 | 2003-06-03 | Messier-Bugatti | Gas preheater and process for controlling distribution of preheated reactive gas in a CVI furnace for densification of porous annular substrates |
-
2001
- 2001-04-12 DE DE60108078T patent/DE60108078T2/de not_active Expired - Fee Related
- 2001-04-12 EP EP01109164A patent/EP1256973B1/de not_active Expired - Lifetime
-
2002
- 2002-04-11 WO PCT/EP2002/004060 patent/WO2002084711A1/en active Application Filing
- 2002-04-11 KR KR1020037013355A patent/KR100561120B1/ko not_active IP Right Cessation
- 2002-04-11 CN CNB028081706A patent/CN1288713C/zh not_active Expired - Fee Related
- 2002-04-11 JP JP2002581563A patent/JP2004529497A/ja active Pending
- 2002-04-12 TW TW091107447A patent/TW541576B/zh not_active IP Right Cessation
-
2003
- 2003-10-14 US US10/685,062 patent/US6802712B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1559079A (zh) | 2004-12-29 |
KR100561120B1 (ko) | 2006-03-15 |
EP1256973B1 (de) | 2004-12-29 |
EP1256973A1 (de) | 2002-11-13 |
CN1288713C (zh) | 2006-12-06 |
DE60108078T2 (de) | 2005-12-01 |
KR20040018352A (ko) | 2004-03-03 |
US6802712B2 (en) | 2004-10-12 |
JP2004529497A (ja) | 2004-09-24 |
WO2002084711A1 (en) | 2002-10-24 |
TW541576B (en) | 2003-07-11 |
US20040157183A1 (en) | 2004-08-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: INFINEON TECHNOLOGIES SC300 GMBH & CO. OHG, 01099 Owner name: AVIZA TECHNOLOGY, INC., SCOTTS VALLEY, CALIF., US |
|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |