DE60043615D1 - NICHT-INVASIVES SYSTEM UND VERFAHREN ZUR DIAGNOSTIZIERUNG VON MöGLICHEN FEHLERN IN BAUGRUPPEN VON ANLAGEN ZUR HALBLEITERHERSTELLUNG - Google Patents

NICHT-INVASIVES SYSTEM UND VERFAHREN ZUR DIAGNOSTIZIERUNG VON MöGLICHEN FEHLERN IN BAUGRUPPEN VON ANLAGEN ZUR HALBLEITERHERSTELLUNG

Info

Publication number
DE60043615D1
DE60043615D1 DE60043615T DE60043615T DE60043615D1 DE 60043615 D1 DE60043615 D1 DE 60043615D1 DE 60043615 T DE60043615 T DE 60043615T DE 60043615 T DE60043615 T DE 60043615T DE 60043615 D1 DE60043615 D1 DE 60043615D1
Authority
DE
Germany
Prior art keywords
semiconductor manufacturing
manufacturing equipment
data signal
assemblies
transducer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60043615T
Other languages
English (en)
Inventor
Roger L Bottemfield
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SIGNALYSIS LLC
Original Assignee
SIGNALYSIS LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SIGNALYSIS LLC filed Critical SIGNALYSIS LLC
Application granted granted Critical
Publication of DE60043615D1 publication Critical patent/DE60043615D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H1/00—Measuring characteristics of vibrations in solids by using direct conduction to the detector
    • G01H1/003—Measuring characteristics of vibrations in solids by using direct conduction to the detector of rotating machines
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Testing Of Devices, Machine Parts, Or Other Structures Thereof (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Elimination Of Static Electricity (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
DE60043615T 1999-02-09 2000-02-08 NICHT-INVASIVES SYSTEM UND VERFAHREN ZUR DIAGNOSTIZIERUNG VON MöGLICHEN FEHLERN IN BAUGRUPPEN VON ANLAGEN ZUR HALBLEITERHERSTELLUNG Expired - Lifetime DE60043615D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/247,143 US6195621B1 (en) 1999-02-09 1999-02-09 Non-invasive system and method for diagnosing potential malfunctions of semiconductor equipment components
PCT/US2000/003224 WO2000047953A1 (en) 1999-02-09 2000-02-08 A non-invasive system and method for diagnosing potential malfunctions of semiconductor equipment components

Publications (1)

Publication Number Publication Date
DE60043615D1 true DE60043615D1 (de) 2010-02-11

Family

ID=22933756

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60043615T Expired - Lifetime DE60043615D1 (de) 1999-02-09 2000-02-08 NICHT-INVASIVES SYSTEM UND VERFAHREN ZUR DIAGNOSTIZIERUNG VON MöGLICHEN FEHLERN IN BAUGRUPPEN VON ANLAGEN ZUR HALBLEITERHERSTELLUNG

Country Status (6)

Country Link
US (2) US6195621B1 (de)
EP (1) EP1192421B1 (de)
AT (1) ATE453878T1 (de)
AU (1) AU3225300A (de)
DE (1) DE60043615D1 (de)
WO (1) WO2000047953A1 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6556881B1 (en) * 1999-09-09 2003-04-29 Advanced Micro Devices, Inc. Method and apparatus for integrating near real-time fault detection in an APC framework
JP3609982B2 (ja) * 2000-04-20 2005-01-12 リオン株式会社 故障診断方法及びその装置
JP2002023839A (ja) * 2000-07-13 2002-01-25 Hitachi Ltd 機器管理システムと機器管理方法及び監視装置、データベース装置とデータベースクライアント装置並びに記録媒体
WO2002089189A1 (fr) * 2001-04-27 2002-11-07 Tokyo Electron Limited Procede et systeme de maintenance a distance
US6537834B2 (en) * 2001-07-24 2003-03-25 Promos Technologies, Inc. Method and apparatus for determining and assessing chamber inconsistency in a tool
JP3601709B2 (ja) * 2001-11-01 2004-12-15 プロモス テクノロジーズ インコーポレイテッド 信号振動についての警報方法
DE10205517A1 (de) * 2002-02-08 2003-08-14 Orga Kartensysteme Gmbh Verfahren zur Erkennung von Beschädigungen an IC-Bauelementen
US20050288898A1 (en) * 2004-06-14 2005-12-29 Canh Le Systems and methods for analyzing machine failure
US7173539B2 (en) * 2004-09-30 2007-02-06 Florida Power And Light Company Condition assessment system and method
US7838072B2 (en) * 2005-01-26 2010-11-23 Tokyo Electron Limited Method and apparatus for monolayer deposition (MLD)
US7444572B2 (en) * 2005-09-01 2008-10-28 Tokyo Electron Limited Built-in self test for a thermal processing system
US7165011B1 (en) 2005-09-01 2007-01-16 Tokyo Electron Limited Built-in self test for a thermal processing system
US7248975B2 (en) * 2005-09-20 2007-07-24 Tech Semiconductor Singapore Pte Ltd Real time monitoring of particulate contamination in a wafer processing chamber
JP6030278B2 (ja) * 2006-03-16 2016-11-24 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 電子デバイス製造システムの操作を改善する方法及び装置
US20070221125A1 (en) * 2006-03-24 2007-09-27 Tokyo Electron Limited Semiconductor processing system with wireless sensor network monitoring system incorporated therewith
US8026113B2 (en) * 2006-03-24 2011-09-27 Tokyo Electron Limited Method of monitoring a semiconductor processing system using a wireless sensor network
US7406644B2 (en) * 2006-03-30 2008-07-29 Tokyo Electron Limited Monitoring a thermal processing system
US7302363B2 (en) * 2006-03-31 2007-11-27 Tokyo Electron Limited Monitoring a system during low-pressure processes
US7340377B2 (en) * 2006-03-31 2008-03-04 Tokyo Electron Limited Monitoring a single-wafer processing system
US7526699B2 (en) * 2006-03-31 2009-04-28 Tokyo Electron Limited Method for creating a built-in self test (BIST) table for monitoring a monolayer deposition (MLD) system
US7519885B2 (en) * 2006-03-31 2009-04-14 Tokyo Electron Limited Monitoring a monolayer deposition (MLD) system using a built-in self test (BIST) table
KR101560705B1 (ko) * 2007-05-25 2015-10-16 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조 시스템들을 조립하고 작동시키는 방법들 및 장치
CN101678407A (zh) * 2007-05-25 2010-03-24 应用材料股份有限公司 用于减量系统的有效操作的方法与装置
US20090018688A1 (en) * 2007-06-15 2009-01-15 Applied Materials, Inc. Methods and systems for designing and validating operation of abatement systems
CN101835521A (zh) * 2007-10-26 2010-09-15 应用材料公司 利用改进燃料线路的用于智能减废的方法与设备
CN102023100A (zh) * 2010-04-19 2011-04-20 东莞市罗尔机电科技有限公司 设备故障预警系统及方法
US20110267190A1 (en) * 2010-05-03 2011-11-03 Irvine Sensors Corporation Anti-Tampering Detection Using Target Circuit RF Signature
US20120330577A1 (en) * 2011-06-22 2012-12-27 Honeywell International Inc. Vibration severity analysis apparatus and method for rotating machinery
BR102015011438B1 (pt) * 2015-05-19 2020-08-18 Universidade Federal De Santa Catarina Sistema e método para identificar características de uma máquina elétrica
DE102017204685B4 (de) * 2017-03-21 2021-11-11 Carl Zeiss Smt Gmbh Verfahren zur Lokalisierung von Montagefehlern sowie Projektionsbelichtungsanlage
TWI807790B (zh) * 2019-06-21 2023-07-01 美商瓦特洛威電子製造公司 用於監測動態系統的情況之系統及方法
US11269003B2 (en) * 2020-02-11 2022-03-08 Nanya Technology Corporation System and method for monitoring semiconductor manufacturing equipment via analysis unit
DE102022115787A1 (de) * 2022-06-24 2024-01-04 Krohne Messtechnik Gmbh Verfahren zum Betreiben eines magnetisch-induktiven Durchflussmessgeräts und ein entsprechendes magnetisch-induktives Durchflussmessgerät

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4184205A (en) * 1977-11-25 1980-01-15 Ird Mechanalysis, Inc. Data acquisition system
JPS55138634A (en) 1979-04-16 1980-10-29 Kansai Electric Power Co Inc:The Fault diagnosis apparatus of apparatus
US4402054A (en) * 1980-10-15 1983-08-30 Westinghouse Electric Corp. Method and apparatus for the automatic diagnosis of system malfunctions
US4380172A (en) 1981-02-19 1983-04-19 General Electric Company On-line rotor crack detection
JPS6021423A (ja) 1983-07-15 1985-02-02 Mitsubishi Electric Corp 振動監視装置
US4520674A (en) 1983-11-14 1985-06-04 Technology For Energy Corporation Vibration monitoring device
US4885707A (en) 1987-02-19 1989-12-05 Dli Corporation Vibration data collecting and processing apparatus and method
US4805457A (en) 1987-05-28 1989-02-21 General Electric Company Shaft to impeller integrity determination in assembled pumps by remote sensing
US5251151A (en) 1988-05-27 1993-10-05 Research Foundation Of State Univ. Of N.Y. Method and apparatus for diagnosing the state of a machine
US4980844A (en) 1988-05-27 1990-12-25 Victor Demjanenko Method and apparatus for diagnosing the state of a machine
JP2631395B2 (ja) * 1988-09-09 1997-07-16 キヤノン株式会社 露光装置の制御方法
US4894644A (en) 1988-10-04 1990-01-16 General Electric Company Tool break/wear detection using a tracking minimum of detected vibrational signal
US5058434A (en) 1990-02-27 1991-10-22 Carl Schenck Ag Process for early detection of damage to machine parts
US5481481A (en) * 1992-11-23 1996-01-02 Architectural Engergy Corporation Automated diagnostic system having temporally coordinated wireless sensors
US5642296A (en) 1993-07-29 1997-06-24 Texas Instruments Incorporated Method of diagnosing malfunctions in semiconductor manufacturing equipment
US5808903A (en) * 1995-09-12 1998-09-15 Entek Scientific Corporation Portable, self-contained data collection systems and methods
US5610339A (en) 1994-10-20 1997-03-11 Ingersoll-Rand Company Method for collecting machine vibration data
US6119074A (en) * 1998-05-20 2000-09-12 Caterpillar Inc. Method and apparatus of predicting a fault condition

Also Published As

Publication number Publication date
AU3225300A (en) 2000-08-29
WO2000047953A1 (en) 2000-08-17
US20010008993A1 (en) 2001-07-19
ATE453878T1 (de) 2010-01-15
EP1192421A1 (de) 2002-04-03
US6195621B1 (en) 2001-02-27
EP1192421A4 (de) 2006-04-19
EP1192421B1 (de) 2009-12-30

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