ATE453878T1 - Nicht-invasives system und verfahren zur diagnostizierung von möglichen fehlern in baugruppen von anlagen zur halbleiterherstellung - Google Patents

Nicht-invasives system und verfahren zur diagnostizierung von möglichen fehlern in baugruppen von anlagen zur halbleiterherstellung

Info

Publication number
ATE453878T1
ATE453878T1 AT00910106T AT00910106T ATE453878T1 AT E453878 T1 ATE453878 T1 AT E453878T1 AT 00910106 T AT00910106 T AT 00910106T AT 00910106 T AT00910106 T AT 00910106T AT E453878 T1 ATE453878 T1 AT E453878T1
Authority
AT
Austria
Prior art keywords
data signal
assemblies
transducer
signal
production systems
Prior art date
Application number
AT00910106T
Other languages
English (en)
Inventor
Roger Bottemfield
Original Assignee
Signalysis L L C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Signalysis L L C filed Critical Signalysis L L C
Application granted granted Critical
Publication of ATE453878T1 publication Critical patent/ATE453878T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612Production flow monitoring, e.g. for increasing throughput
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H1/00Measuring characteristics of vibrations in solids by using direct conduction to the detector
    • G01H1/003Measuring characteristics of vibrations in solids by using direct conduction to the detector of rotating machines
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709Vibration, e.g. vibration detection, compensation, suppression or isolation

Landscapes

  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Of Devices, Machine Parts, Or Other Structures Thereof (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Elimination Of Static Electricity (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
AT00910106T 1999-02-09 2000-02-08 Nicht-invasives system und verfahren zur diagnostizierung von möglichen fehlern in baugruppen von anlagen zur halbleiterherstellung ATE453878T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/247,143 US6195621B1 (en) 1999-02-09 1999-02-09 Non-invasive system and method for diagnosing potential malfunctions of semiconductor equipment components
PCT/US2000/003224 WO2000047953A1 (en) 1999-02-09 2000-02-08 A non-invasive system and method for diagnosing potential malfunctions of semiconductor equipment components

Publications (1)

Publication Number Publication Date
ATE453878T1 true ATE453878T1 (de) 2010-01-15

Family

ID=22933756

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00910106T ATE453878T1 (de) 1999-02-09 2000-02-08 Nicht-invasives system und verfahren zur diagnostizierung von möglichen fehlern in baugruppen von anlagen zur halbleiterherstellung

Country Status (6)

Country Link
US (2) US6195621B1 (de)
EP (1) EP1192421B1 (de)
AT (1) ATE453878T1 (de)
AU (1) AU3225300A (de)
DE (1) DE60043615D1 (de)
WO (1) WO2000047953A1 (de)

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US7165011B1 (en) 2005-09-01 2007-01-16 Tokyo Electron Limited Built-in self test for a thermal processing system
US7248975B2 (en) * 2005-09-20 2007-07-24 Tech Semiconductor Singapore Pte Ltd Real time monitoring of particulate contamination in a wafer processing chamber
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CN101678407A (zh) * 2007-05-25 2010-03-24 应用材料股份有限公司 用于减量系统的有效操作的方法与装置
JP2010528475A (ja) * 2007-05-25 2010-08-19 アプライド マテリアルズ インコーポレイテッド 電子デバイス製造システムを組み立てる及び運転する方法及び装置
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CN102023100A (zh) * 2010-04-19 2011-04-20 东莞市罗尔机电科技有限公司 设备故障预警系统及方法
US20110267190A1 (en) * 2010-05-03 2011-11-03 Irvine Sensors Corporation Anti-Tampering Detection Using Target Circuit RF Signature
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BR102015011438B1 (pt) * 2015-05-19 2020-08-18 Universidade Federal De Santa Catarina Sistema e método para identificar características de uma máquina elétrica
DE102017204685B4 (de) * 2017-03-21 2021-11-11 Carl Zeiss Smt Gmbh Verfahren zur Lokalisierung von Montagefehlern sowie Projektionsbelichtungsanlage
TWI765285B (zh) * 2019-06-21 2022-05-21 美商瓦特洛威電子製造公司 用於監測動態系統的情況之系統及方法
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Also Published As

Publication number Publication date
EP1192421A4 (de) 2006-04-19
US20010008993A1 (en) 2001-07-19
WO2000047953A1 (en) 2000-08-17
EP1192421A1 (de) 2002-04-03
AU3225300A (en) 2000-08-29
DE60043615D1 (de) 2010-02-11
EP1192421B1 (de) 2009-12-30
US6195621B1 (en) 2001-02-27

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