ATE453878T1 - Nicht-invasives system und verfahren zur diagnostizierung von möglichen fehlern in baugruppen von anlagen zur halbleiterherstellung - Google Patents
Nicht-invasives system und verfahren zur diagnostizierung von möglichen fehlern in baugruppen von anlagen zur halbleiterherstellungInfo
- Publication number
- ATE453878T1 ATE453878T1 AT00910106T AT00910106T ATE453878T1 AT E453878 T1 ATE453878 T1 AT E453878T1 AT 00910106 T AT00910106 T AT 00910106T AT 00910106 T AT00910106 T AT 00910106T AT E453878 T1 ATE453878 T1 AT E453878T1
- Authority
- AT
- Austria
- Prior art keywords
- data signal
- assemblies
- transducer
- signal
- production systems
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0612—Production flow monitoring, e.g. for increasing throughput
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H1/00—Measuring characteristics of vibrations in solids by using direct conduction to the detector
- G01H1/003—Measuring characteristics of vibrations in solids by using direct conduction to the detector of rotating machines
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
Landscapes
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Of Devices, Machine Parts, Or Other Structures Thereof (AREA)
- Tests Of Electronic Circuits (AREA)
- Elimination Of Static Electricity (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- General Factory Administration (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/247,143 US6195621B1 (en) | 1999-02-09 | 1999-02-09 | Non-invasive system and method for diagnosing potential malfunctions of semiconductor equipment components |
| PCT/US2000/003224 WO2000047953A1 (en) | 1999-02-09 | 2000-02-08 | A non-invasive system and method for diagnosing potential malfunctions of semiconductor equipment components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE453878T1 true ATE453878T1 (de) | 2010-01-15 |
Family
ID=22933756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT00910106T ATE453878T1 (de) | 1999-02-09 | 2000-02-08 | Nicht-invasives system und verfahren zur diagnostizierung von möglichen fehlern in baugruppen von anlagen zur halbleiterherstellung |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6195621B1 (de) |
| EP (1) | EP1192421B1 (de) |
| AT (1) | ATE453878T1 (de) |
| AU (1) | AU3225300A (de) |
| DE (1) | DE60043615D1 (de) |
| WO (1) | WO2000047953A1 (de) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6556881B1 (en) * | 1999-09-09 | 2003-04-29 | Advanced Micro Devices, Inc. | Method and apparatus for integrating near real-time fault detection in an APC framework |
| JP3609982B2 (ja) * | 2000-04-20 | 2005-01-12 | リオン株式会社 | 故障診断方法及びその装置 |
| JP2002023839A (ja) | 2000-07-13 | 2002-01-25 | Hitachi Ltd | 機器管理システムと機器管理方法及び監視装置、データベース装置とデータベースクライアント装置並びに記録媒体 |
| JP4044443B2 (ja) * | 2001-04-27 | 2008-02-06 | 東京エレクトロン株式会社 | 半導体製造装置の遠隔保守システム,工場側クライアント,ベンダ側サーバ,記憶媒体,プログラムおよび半導体製造装置の遠隔保守方法 |
| US6537834B2 (en) * | 2001-07-24 | 2003-03-25 | Promos Technologies, Inc. | Method and apparatus for determining and assessing chamber inconsistency in a tool |
| JP3601709B2 (ja) * | 2001-11-01 | 2004-12-15 | プロモス テクノロジーズ インコーポレイテッド | 信号振動についての警報方法 |
| DE10205517A1 (de) * | 2002-02-08 | 2003-08-14 | Orga Kartensysteme Gmbh | Verfahren zur Erkennung von Beschädigungen an IC-Bauelementen |
| US20050288898A1 (en) * | 2004-06-14 | 2005-12-29 | Canh Le | Systems and methods for analyzing machine failure |
| US7173539B2 (en) * | 2004-09-30 | 2007-02-06 | Florida Power And Light Company | Condition assessment system and method |
| US7838072B2 (en) * | 2005-01-26 | 2010-11-23 | Tokyo Electron Limited | Method and apparatus for monolayer deposition (MLD) |
| US7444572B2 (en) * | 2005-09-01 | 2008-10-28 | Tokyo Electron Limited | Built-in self test for a thermal processing system |
| US7165011B1 (en) | 2005-09-01 | 2007-01-16 | Tokyo Electron Limited | Built-in self test for a thermal processing system |
| US7248975B2 (en) * | 2005-09-20 | 2007-07-24 | Tech Semiconductor Singapore Pte Ltd | Real time monitoring of particulate contamination in a wafer processing chamber |
| KR20080104372A (ko) * | 2006-03-16 | 2008-12-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 전자 장치 제조 시스템의 압력 제어 방법 및 장치 |
| US8026113B2 (en) * | 2006-03-24 | 2011-09-27 | Tokyo Electron Limited | Method of monitoring a semiconductor processing system using a wireless sensor network |
| US20070221125A1 (en) * | 2006-03-24 | 2007-09-27 | Tokyo Electron Limited | Semiconductor processing system with wireless sensor network monitoring system incorporated therewith |
| US7406644B2 (en) * | 2006-03-30 | 2008-07-29 | Tokyo Electron Limited | Monitoring a thermal processing system |
| US7340377B2 (en) * | 2006-03-31 | 2008-03-04 | Tokyo Electron Limited | Monitoring a single-wafer processing system |
| US7519885B2 (en) * | 2006-03-31 | 2009-04-14 | Tokyo Electron Limited | Monitoring a monolayer deposition (MLD) system using a built-in self test (BIST) table |
| US7526699B2 (en) * | 2006-03-31 | 2009-04-28 | Tokyo Electron Limited | Method for creating a built-in self test (BIST) table for monitoring a monolayer deposition (MLD) system |
| US7302363B2 (en) * | 2006-03-31 | 2007-11-27 | Tokyo Electron Limited | Monitoring a system during low-pressure processes |
| CN101678407A (zh) * | 2007-05-25 | 2010-03-24 | 应用材料股份有限公司 | 用于减量系统的有效操作的方法与装置 |
| JP2010528475A (ja) * | 2007-05-25 | 2010-08-19 | アプライド マテリアルズ インコーポレイテッド | 電子デバイス製造システムを組み立てる及び運転する方法及び装置 |
| US20090018688A1 (en) * | 2007-06-15 | 2009-01-15 | Applied Materials, Inc. | Methods and systems for designing and validating operation of abatement systems |
| JP2011501102A (ja) * | 2007-10-26 | 2011-01-06 | アプライド マテリアルズ インコーポレイテッド | 改良された燃料回路を使用した高性能な除害の方法及び装置 |
| CN102023100A (zh) * | 2010-04-19 | 2011-04-20 | 东莞市罗尔机电科技有限公司 | 设备故障预警系统及方法 |
| US20110267190A1 (en) * | 2010-05-03 | 2011-11-03 | Irvine Sensors Corporation | Anti-Tampering Detection Using Target Circuit RF Signature |
| US20120330577A1 (en) * | 2011-06-22 | 2012-12-27 | Honeywell International Inc. | Vibration severity analysis apparatus and method for rotating machinery |
| BR102015011438B1 (pt) * | 2015-05-19 | 2020-08-18 | Universidade Federal De Santa Catarina | Sistema e método para identificar características de uma máquina elétrica |
| DE102017204685B4 (de) * | 2017-03-21 | 2021-11-11 | Carl Zeiss Smt Gmbh | Verfahren zur Lokalisierung von Montagefehlern sowie Projektionsbelichtungsanlage |
| TWI765285B (zh) * | 2019-06-21 | 2022-05-21 | 美商瓦特洛威電子製造公司 | 用於監測動態系統的情況之系統及方法 |
| US11269003B2 (en) * | 2020-02-11 | 2022-03-08 | Nanya Technology Corporation | System and method for monitoring semiconductor manufacturing equipment via analysis unit |
| DE102022115787A1 (de) * | 2022-06-24 | 2024-01-04 | Krohne Messtechnik Gmbh | Verfahren zum Betreiben eines magnetisch-induktiven Durchflussmessgeräts und ein entsprechendes magnetisch-induktives Durchflussmessgerät |
| CN120143559B (zh) * | 2025-04-07 | 2025-11-07 | 无锡旭电科技有限公司 | 卷对卷高精度投影式曝光机的精度优化方法及系统 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4184205A (en) * | 1977-11-25 | 1980-01-15 | Ird Mechanalysis, Inc. | Data acquisition system |
| JPS55138634A (en) | 1979-04-16 | 1980-10-29 | Kansai Electric Power Co Inc:The | Fault diagnosis apparatus of apparatus |
| US4402054A (en) * | 1980-10-15 | 1983-08-30 | Westinghouse Electric Corp. | Method and apparatus for the automatic diagnosis of system malfunctions |
| US4380172A (en) | 1981-02-19 | 1983-04-19 | General Electric Company | On-line rotor crack detection |
| JPS6021423A (ja) | 1983-07-15 | 1985-02-02 | Mitsubishi Electric Corp | 振動監視装置 |
| US4520674A (en) | 1983-11-14 | 1985-06-04 | Technology For Energy Corporation | Vibration monitoring device |
| US4885707A (en) | 1987-02-19 | 1989-12-05 | Dli Corporation | Vibration data collecting and processing apparatus and method |
| US4805457A (en) | 1987-05-28 | 1989-02-21 | General Electric Company | Shaft to impeller integrity determination in assembled pumps by remote sensing |
| US4980844A (en) | 1988-05-27 | 1990-12-25 | Victor Demjanenko | Method and apparatus for diagnosing the state of a machine |
| US5251151A (en) | 1988-05-27 | 1993-10-05 | Research Foundation Of State Univ. Of N.Y. | Method and apparatus for diagnosing the state of a machine |
| JP2631395B2 (ja) * | 1988-09-09 | 1997-07-16 | キヤノン株式会社 | 露光装置の制御方法 |
| US4894644A (en) | 1988-10-04 | 1990-01-16 | General Electric Company | Tool break/wear detection using a tracking minimum of detected vibrational signal |
| US5058434A (en) | 1990-02-27 | 1991-10-22 | Carl Schenck Ag | Process for early detection of damage to machine parts |
| US5481481A (en) * | 1992-11-23 | 1996-01-02 | Architectural Engergy Corporation | Automated diagnostic system having temporally coordinated wireless sensors |
| US5642296A (en) | 1993-07-29 | 1997-06-24 | Texas Instruments Incorporated | Method of diagnosing malfunctions in semiconductor manufacturing equipment |
| US5808903A (en) * | 1995-09-12 | 1998-09-15 | Entek Scientific Corporation | Portable, self-contained data collection systems and methods |
| US5610339A (en) | 1994-10-20 | 1997-03-11 | Ingersoll-Rand Company | Method for collecting machine vibration data |
| US6119074A (en) * | 1998-05-20 | 2000-09-12 | Caterpillar Inc. | Method and apparatus of predicting a fault condition |
-
1999
- 1999-02-09 US US09/247,143 patent/US6195621B1/en not_active Expired - Lifetime
-
2000
- 2000-02-08 EP EP00910106A patent/EP1192421B1/de not_active Expired - Lifetime
- 2000-02-08 AT AT00910106T patent/ATE453878T1/de not_active IP Right Cessation
- 2000-02-08 AU AU32253/00A patent/AU3225300A/en not_active Abandoned
- 2000-02-08 DE DE60043615T patent/DE60043615D1/de not_active Expired - Lifetime
- 2000-02-08 WO PCT/US2000/003224 patent/WO2000047953A1/en not_active Ceased
-
2001
- 2001-02-27 US US09/795,239 patent/US20010008993A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1192421A4 (de) | 2006-04-19 |
| US20010008993A1 (en) | 2001-07-19 |
| WO2000047953A1 (en) | 2000-08-17 |
| EP1192421A1 (de) | 2002-04-03 |
| AU3225300A (en) | 2000-08-29 |
| DE60043615D1 (de) | 2010-02-11 |
| EP1192421B1 (de) | 2009-12-30 |
| US6195621B1 (en) | 2001-02-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |