DE60039823D1 - Herstellungsverfahren einer silicium schicht auf einem träger für optische zwecke und dessen umsetzung zur herstellung von optischen komponenten - Google Patents

Herstellungsverfahren einer silicium schicht auf einem träger für optische zwecke und dessen umsetzung zur herstellung von optischen komponenten

Info

Publication number
DE60039823D1
DE60039823D1 DE60039823T DE60039823T DE60039823D1 DE 60039823 D1 DE60039823 D1 DE 60039823D1 DE 60039823 T DE60039823 T DE 60039823T DE 60039823 T DE60039823 T DE 60039823T DE 60039823 D1 DE60039823 D1 DE 60039823D1
Authority
DE
Germany
Prior art keywords
optical
implementation
carrier
manufacturing
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60039823T
Other languages
English (en)
Inventor
Emmanuel Hadji
Jean-Louis Pautrat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Application granted granted Critical
Publication of DE60039823D1 publication Critical patent/DE60039823D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0054—Processes for devices with an active region comprising only group IV elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/10—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
    • H01L33/105—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector with a resonant cavity structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
    • H01S5/021—Silicon based substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/3027—IV compounds
    • H01S5/3031—Si
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/3223—IV compounds
    • H01S5/3224—Si
DE60039823T 1999-02-10 2000-02-07 Herstellungsverfahren einer silicium schicht auf einem träger für optische zwecke und dessen umsetzung zur herstellung von optischen komponenten Expired - Lifetime DE60039823D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9901559A FR2789517B1 (fr) 1999-02-10 1999-02-10 Procede de formation sur un support d'une couche de silicium a usage optique et mise en oeuvre du procede pour la realisation de composants optiques
PCT/FR2000/000278 WO2000048278A1 (fr) 1999-02-10 2000-02-07 Procede de formation sur un support d'une couche de silicium a usage optique et mise en oeuvre du procede pour la realisation de composants optiques

Publications (1)

Publication Number Publication Date
DE60039823D1 true DE60039823D1 (de) 2008-09-25

Family

ID=9541824

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60039823T Expired - Lifetime DE60039823D1 (de) 1999-02-10 2000-02-07 Herstellungsverfahren einer silicium schicht auf einem träger für optische zwecke und dessen umsetzung zur herstellung von optischen komponenten

Country Status (5)

Country Link
EP (1) EP1070371B1 (de)
JP (1) JP4514964B2 (de)
DE (1) DE60039823D1 (de)
FR (1) FR2789517B1 (de)
WO (1) WO2000048278A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436614B1 (en) * 2000-10-20 2002-08-20 Feng Zhou Method for the formation of a thin optical crystal layer overlying a low dielectric constant substrate
FR2855910B1 (fr) * 2003-06-06 2005-07-15 Commissariat Energie Atomique Procede d'obtention d'une couche tres mince par amincissement par auto-portage provoque
FR2855908B1 (fr) * 2003-06-06 2005-08-26 Soitec Silicon On Insulator Procede d'obtention d'une structure comprenant au moins un substrat et une couche ultramince
WO2005020305A2 (en) * 2003-08-12 2005-03-03 Massachusetts Institute Of Technology Optical device comprising crystalline semiconductor layer and reflective element
US7084460B2 (en) * 2003-11-03 2006-08-01 International Business Machines Corporation Method for fabricating SiGe-on-insulator (SGOI) and Ge-on-insulator (GOI) substrates
US7825006B2 (en) * 2004-05-06 2010-11-02 Cree, Inc. Lift-off process for GaN films formed on SiC substrates and devices fabricated using the method
US8617997B2 (en) 2007-08-21 2013-12-31 Cree, Inc. Selective wet etching of gold-tin based solder
JP5381065B2 (ja) * 2008-12-10 2014-01-08 信越半導体株式会社 Ｓｏｉウェーハの検査方法及びｓｏｉウェーハの製造方法
FR2946435B1 (fr) 2009-06-04 2017-09-29 Commissariat A L'energie Atomique Procede de fabrication d'images colorees avec une resolution micronique enfouies dans un support tres robuste et tres perenne
GB2549951B (en) * 2016-05-03 2019-11-20 Metodiev Lavchiev Ventsislav Light emitting structures and systems on the basis of group-IV material(s) for the ultra violet and visible spectral range
FR3061803B1 (fr) * 2017-01-11 2019-08-16 Soitec Substrat pour capteur d'image de type face avant et procede de fabrication d'un tel substrat

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2681472B1 (fr) * 1991-09-18 1993-10-29 Commissariat Energie Atomique Procede de fabrication de films minces de materiau semiconducteur.
US5249195A (en) * 1992-06-30 1993-09-28 At&T Bell Laboratories Erbium doped optical devices
US5363398A (en) * 1993-09-30 1994-11-08 At&T Bell Laboratories Absorption resonant rare earth-doped micro-cavities

Also Published As

Publication number Publication date
JP4514964B2 (ja) 2010-07-28
JP2002536708A (ja) 2002-10-29
WO2000048278A1 (fr) 2000-08-17
FR2789517A1 (fr) 2000-08-11
EP1070371A1 (de) 2001-01-24
FR2789517B1 (fr) 2001-03-09
EP1070371B1 (de) 2008-08-13

Similar Documents

Publication Publication Date Title
DE59803595D1 (de) Verfahren zur herstellung von Silicium
DE60023639D1 (de) Verfahren zur Herstellung von Körpern mit einer Schicht von aufgebrachten Teilchen
DE69908990D1 (de) Verfahren zur Herstellung von geschlichteten beschichteten keramischen Fasern
DE69518548T2 (de) Verfahren zur Herstellung eines keramischen Substrates
DE59700843D1 (de) Verfahren zur Herstellung von Halbleiterscheiben aus Silicium mit geringer Defektdichte
DE10082520T1 (de) Verfahren zur Herstellung einer ein Glassubstrat enthaltenden Magnetplatte
DE69900076T2 (de) Verfahren zur Herstellung von fluorierten diamantartigen Beschichtungen
DE59406949D1 (de) Verfahren zur Herstellung keramischer Mikrostrukturen aus polymeren Precursoren
DE69513459D1 (de) Verfahren zur Herstellung einer Al-Ge Legierung mit einer WGe Polierstoppschicht
DE60039744D1 (de) Verfahren zur Hersltellung einer Siliziumschicht
DE60039823D1 (de) Herstellungsverfahren einer silicium schicht auf einem träger für optische zwecke und dessen umsetzung zur herstellung von optischen komponenten
DE60238399D1 (de) Verfahren zur herstellung von silicium
DE69218072T2 (de) Gebundene faserige Substrate für Hülle und Verfahren zur Herstellung davon
DE69806519T2 (de) Verfahren zur Herstellung von Siliziumkarbidfasern
DE60100514D1 (de) Verfahren zur Herstellung einer vernetzten Silikonpartikelsuspension
DE69812056D1 (de) Verfahren zur Herstellung von Siliciumkarbidfasern
DE69526286T2 (de) Verfahren zur Herstellung eines keramischen Substrates
DE59902444D1 (de) Verfahren zur Herstellung von beschichteten Kurzfasern
DE60024210D1 (de) Verfahren zur Herstellung von Zahnrädern
DE60021928D1 (de) Verfahren zur Herstellung einer Cordieriet-Keramik mit Wabenstruktur
DE69509594D1 (de) Verfahren zur Herstellung einer Diamantschicht
DE60104753D1 (de) Verfahren zur Herstellung einer dünnen Schicht auf einem Halbleitersubstrat
DE69919788D1 (de) Verfahren zur Herstellung einer Dünnschicht aus Titan- und Siliziumdioxid
ATA167791A (de) Beschichtetes glas und verfahren zur herstellung desselben
DE69903297D1 (de) Verfahren zur Herstellung einer keramischen Folie

Legal Events

Date Code Title Description
8364 No opposition during term of opposition