DE60021979D1 - Bei niedriger Temperatur härtbares Material zur Verbindung einer anisotropisch elektrisch leitfähigen Verbindung - Google Patents

Bei niedriger Temperatur härtbares Material zur Verbindung einer anisotropisch elektrisch leitfähigen Verbindung

Info

Publication number
DE60021979D1
DE60021979D1 DE60021979T DE60021979T DE60021979D1 DE 60021979 D1 DE60021979 D1 DE 60021979D1 DE 60021979 T DE60021979 T DE 60021979T DE 60021979 T DE60021979 T DE 60021979T DE 60021979 D1 DE60021979 D1 DE 60021979D1
Authority
DE
Germany
Prior art keywords
bonding
low temperature
curable material
temperature curable
anisotropically electroconductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60021979T
Other languages
English (en)
Other versions
DE60021979T2 (de
Inventor
Tomoyuki Ishimatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Application granted granted Critical
Publication of DE60021979D1 publication Critical patent/DE60021979D1/de
Publication of DE60021979T2 publication Critical patent/DE60021979T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Graft Or Block Polymers (AREA)
DE60021979T 1999-10-22 2000-10-20 Bei niedriger Temperatur härtbares Material zur Verbindung einer anisotropisch elektrisch leitfähigen Verbindung Expired - Lifetime DE60021979T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30146199 1999-10-22
JP30146199 1999-10-22

Publications (2)

Publication Number Publication Date
DE60021979D1 true DE60021979D1 (de) 2005-09-22
DE60021979T2 DE60021979T2 (de) 2006-07-06

Family

ID=17897185

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60021979T Expired - Lifetime DE60021979T2 (de) 1999-10-22 2000-10-20 Bei niedriger Temperatur härtbares Material zur Verbindung einer anisotropisch elektrisch leitfähigen Verbindung

Country Status (4)

Country Link
US (1) US6527984B1 (de)
EP (1) EP1094474B1 (de)
KR (1) KR100925361B1 (de)
DE (1) DE60021979T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184487A (ja) * 2000-12-15 2002-06-28 Sony Chem Corp 異方性導電接着剤
US20030234443A1 (en) * 2001-10-26 2003-12-25 Staktek Group, L.P. Low profile stacking system and method
AU2003289411A1 (en) * 2002-12-17 2004-07-09 Bridgestone Corporation Image display panel manufacturing method, image display device manufacturing method, and image display device
KR100714794B1 (ko) * 2005-07-26 2007-05-04 새한미디어주식회사 저온 속경화형 이방성 도전 필름, 및 그 제조방법
KR100673778B1 (ko) * 2005-08-19 2007-01-24 제일모직주식회사 저온 속경화형 이방성 도전 필름용 조성물, 그로부터제조된 이방성 도전 필름 및 그 제조방법
US20090173919A1 (en) * 2005-11-22 2009-07-09 Ndsu Researcvh Foundation Conductive Ink Compositions
US7727423B2 (en) * 2006-12-29 2010-06-01 Cheil Industries, Inc. Anisotropic conductive film composition and film including the same
KR101683312B1 (ko) * 2008-09-30 2016-12-06 데쿠세리아루즈 가부시키가이샤 이방성 도전 접착제 및 그것을 사용한 접속 구조체의 제조 방법
US9464658B2 (en) * 2012-06-11 2016-10-11 Board Of Trustees Of Michigan State University Hybrid fastener
JP6123547B2 (ja) * 2013-07-26 2017-05-10 日立化成株式会社 回路接続材料、回路接続構造体、回路接続構造体の製造方法、接着剤組成物、及び接着剤シート
US20230287222A1 (en) * 2020-07-15 2023-09-14 Denka Company Limited Composition and cured product thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6241277A (ja) * 1985-08-16 1987-02-23 Shin Etsu Polymer Co Ltd 異方導電性接着剤
JP3231814B2 (ja) 1991-07-12 2001-11-26 ミネソタ マイニング アンド マニュファクチャリング カンパニー 異方性導電膜
JPH10147762A (ja) * 1996-11-20 1998-06-02 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JPH10168412A (ja) * 1996-12-10 1998-06-23 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JPH10338860A (ja) 1997-06-06 1998-12-22 Bridgestone Corp 異方性導電フィルム
TW459032B (en) 1998-03-18 2001-10-11 Sumitomo Bakelite Co An anisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesive
JP2001049228A (ja) 1999-08-12 2001-02-20 Sony Chem Corp 低温硬化型接着剤及びこれを用いた異方導電性接着フィルム

Also Published As

Publication number Publication date
KR20010051145A (ko) 2001-06-25
DE60021979T2 (de) 2006-07-06
KR100925361B1 (ko) 2009-11-09
EP1094474A3 (de) 2002-05-15
US6527984B1 (en) 2003-03-04
EP1094474A2 (de) 2001-04-25
EP1094474B1 (de) 2005-08-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition