DE60004173D1 - Induktives elektronisches bauteil, und herstellungsverfahren - Google Patents

Induktives elektronisches bauteil, und herstellungsverfahren

Info

Publication number
DE60004173D1
DE60004173D1 DE60004173T DE60004173T DE60004173D1 DE 60004173 D1 DE60004173 D1 DE 60004173D1 DE 60004173 T DE60004173 T DE 60004173T DE 60004173 T DE60004173 T DE 60004173T DE 60004173 D1 DE60004173 D1 DE 60004173D1
Authority
DE
Germany
Prior art keywords
electronic component
production method
machining
conductive tracks
inductive electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60004173T
Other languages
English (en)
Other versions
DE60004173T2 (de
Inventor
Martin Gijs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ecole Polytechnique Federale de Lausanne EPFL
Original Assignee
Ecole Polytechnique Federale de Lausanne EPFL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ecole Polytechnique Federale de Lausanne EPFL filed Critical Ecole Polytechnique Federale de Lausanne EPFL
Publication of DE60004173D1 publication Critical patent/DE60004173D1/de
Application granted granted Critical
Publication of DE60004173T2 publication Critical patent/DE60004173T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49071—Electromagnet, transformer or inductor by winding or coiling
DE60004173T 1999-01-22 2000-01-21 Induktives elektronisches bauteil, und herstellungsverfahren Expired - Lifetime DE60004173T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP99101187 1999-01-22
EP99101187A EP1022750A1 (de) 1999-01-22 1999-01-22 Diskretes elektronisches induktives Bauteil, und Herstellungsverfahren solcher Bauteile
PCT/EP2000/000460 WO2000044008A2 (fr) 1999-01-22 2000-01-21 Composant electronique discret de type inductif, et procede de realisation de tels composants

Publications (2)

Publication Number Publication Date
DE60004173D1 true DE60004173D1 (de) 2003-09-04
DE60004173T2 DE60004173T2 (de) 2004-05-27

Family

ID=8237392

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60004173T Expired - Lifetime DE60004173T2 (de) 1999-01-22 2000-01-21 Induktives elektronisches bauteil, und herstellungsverfahren

Country Status (7)

Country Link
US (3) US6704994B1 (de)
EP (2) EP1022750A1 (de)
AT (1) ATE246396T1 (de)
AU (1) AU2542800A (de)
DE (1) DE60004173T2 (de)
ES (1) ES2204507T3 (de)
WO (1) WO2000044008A2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6882890B2 (en) * 2000-08-03 2005-04-19 Siemens Aktiengesellschaft Industrial controller based on distributable technology objects
DE10055168A1 (de) * 2000-08-03 2002-02-21 Siemens Ag Industrielle Steuerung auf der Basis verteilbarer Technologischer Objekte
US6768409B2 (en) 2001-08-29 2004-07-27 Matsushita Electric Industrial Co., Ltd. Magnetic device, method for manufacturing the same, and power supply module equipped with the same
WO2005055363A1 (en) * 2003-12-08 2005-06-16 Cochlear Limited Cochlear implant assembly
DE102004046763A1 (de) * 2004-09-24 2006-03-30 Schmitz-Gotha Fahrzeugwerke Gmbh Fahrzeug-Leuchtenanordnung, insbesondere für Anhänger
FR2885739B1 (fr) * 2005-05-11 2012-07-20 Sonceboz Sa Procede de connexion sans soudure d'un actionneur electrique, notamment pour application aux tableaux de bord automobile, a un circuit imprime
US7432793B2 (en) * 2005-12-19 2008-10-07 Bose Corporation Amplifier output filter having planar inductor
DE102006034261A1 (de) * 2006-07-18 2008-01-24 Würth Elektronik eiSos Gmbh & Co. KG Koplanare Montage
US7332993B1 (en) 2007-04-10 2008-02-19 Bose Corporation Planar transformer having fractional windings
WO2009009827A1 (en) * 2007-07-17 2009-01-22 Cochlear Limited Method and apparatus for forming an electrically insulating structure having holes for feedthroughs
KR101420797B1 (ko) * 2007-08-31 2014-08-13 삼성전자주식회사 전기적 신호 연결 유니트, 안테나 장치 및 이를 갖는 이동통신 단말기
CN101970041B (zh) 2007-11-16 2013-12-04 耳蜗有限公司 制造用于刺激医疗设备的电极阵列
JP4484934B2 (ja) * 2008-02-26 2010-06-16 富士通メディアデバイス株式会社 電子部品及びその製造方法
CN107204235B (zh) * 2016-03-17 2019-05-07 台达电子企业管理（上海）有限公司 变压器单元及电源转换电路
TWI655884B (zh) * 2017-09-15 2019-04-01 欣興電子股份有限公司 載板結構

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3443254A (en) * 1961-11-13 1969-05-06 Amp Inc Tape mounted magnetic core assembly
US4342143A (en) * 1974-02-04 1982-08-03 Jennings Thomas A Method of making multiple electrical components in integrated microminiature form
JPS5642949A (en) * 1979-09-17 1981-04-21 Tokyo Shibaura Electric Co Shielddbeam type bulb and production thereof
JPS61174708A (ja) * 1985-01-30 1986-08-06 Meiji Natl Ind Co Ltd 電磁コイル装置
US4959630A (en) * 1989-08-07 1990-09-25 General Electric Company High-frequency transformer
US5010314A (en) * 1990-03-30 1991-04-23 Multisource Technology Corp. Low-profile planar transformer for use in off-line switching power supplies
US5175525A (en) * 1991-06-11 1992-12-29 Astec International, Ltd. Low profile transformer
JPH0636933A (ja) * 1992-07-15 1994-02-10 Matsushita Electric Works Ltd 平面トランス
JPH0689828A (ja) * 1992-09-08 1994-03-29 Tdk Corp コイル部品の製造方法
JPH06151179A (ja) * 1992-11-02 1994-05-31 Murata Mfg Co Ltd コイル
US5321380A (en) * 1992-11-06 1994-06-14 Power General Corporation Low profile printed circuit board
US5565837A (en) * 1992-11-06 1996-10-15 Nidec America Corporation Low profile printed circuit board
DE69512324T2 (de) * 1994-06-21 2000-04-13 Sumitomo Spec Metals Herstellungsverfahren für Substrat mit mehrschichtigen gedruckten Spulen
EP0735551B1 (de) * 1995-03-29 2002-02-27 Valeo Electronique Transformatoreinrichtung, insbesondere für eine Versorgungseinrichtung von Entladungslampen in Kraftfahrzeugen
EP0741395A1 (de) * 1995-05-04 1996-11-06 AT&T IPM Corp. Anschluss-montierbare planare magnetischen Vorrichtung und ihr Herstellungsverfahren
JP2723838B2 (ja) * 1995-06-20 1998-03-09 静岡日本電気株式会社 無線選択呼出受信機
US5631822A (en) * 1995-08-24 1997-05-20 Interpoint Corporation Integrated planar magnetics and connector
US5729917A (en) * 1996-01-04 1998-03-24 Hyde Athletic Industries, Inc. Combination midsole stabilizer and enhancer
US5852866A (en) * 1996-04-04 1998-12-29 Robert Bosch Gmbh Process for producing microcoils and microtransformers
FI962803A0 (fi) * 1996-07-10 1996-07-10 Nokia Telecommunications Oy Planartransformator
US5781093A (en) * 1996-08-05 1998-07-14 International Power Devices, Inc. Planar transformer
GB9620356D0 (en) * 1996-09-27 1996-11-13 Lucas Ind Plc Electromagnetic structure
EP0869518B1 (de) * 1996-10-24 2008-12-10 Panasonic Corporation Drosselspule
US6252486B1 (en) * 1997-06-13 2001-06-26 Philips Electronics North America Corp. Planar winding structure and low profile magnetic component having reduced size and improved thermal properties
US6028500A (en) * 1999-02-12 2000-02-22 Lucent Technologies Inc. Audible noise suppressor for planar magnetic devices
US6278352B1 (en) * 1999-07-26 2001-08-21 Taiwan Semiconductor Manufacturing Company High efficiency thin film inductor
US6429763B1 (en) * 2000-02-01 2002-08-06 Compaq Information Technologies Group, L.P. Apparatus and method for PCB winding planar magnetic devices

Also Published As

Publication number Publication date
US20040088841A1 (en) 2004-05-13
EP1022750A1 (de) 2000-07-26
US20040090299A1 (en) 2004-05-13
EP1157395B1 (de) 2003-07-30
WO2000044008A3 (fr) 2001-05-31
WO2000044008A2 (fr) 2000-07-27
ES2204507T3 (es) 2004-05-01
DE60004173T2 (de) 2004-05-27
AU2542800A (en) 2000-08-07
ATE246396T1 (de) 2003-08-15
US6933826B2 (en) 2005-08-23
EP1157395A2 (de) 2001-11-28
US6704994B1 (en) 2004-03-16
US6844804B2 (en) 2005-01-18

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Legal Events

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8364 No opposition during term of opposition