DE59809935D1 - Versorgungssystem für chemikalien und dessen verwendung - Google Patents

Versorgungssystem für chemikalien und dessen verwendung

Info

Publication number
DE59809935D1
DE59809935D1 DE59809935T DE59809935T DE59809935D1 DE 59809935 D1 DE59809935 D1 DE 59809935D1 DE 59809935 T DE59809935 T DE 59809935T DE 59809935 T DE59809935 T DE 59809935T DE 59809935 D1 DE59809935 D1 DE 59809935D1
Authority
DE
Germany
Prior art keywords
supply system
chemicals
useful
system allows
prepared directly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE59809935T
Other languages
English (en)
Inventor
Ulrich Finkenzeller
Claus Dusemund
Thomas Schwortschik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
Merck Patent GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Application granted granted Critical
Publication of DE59809935D1 publication Critical patent/DE59809935D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Catching Or Destruction (AREA)
DE59809935T 1997-04-17 1998-04-08 Versorgungssystem für chemikalien und dessen verwendung Expired - Fee Related DE59809935D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19715974A DE19715974A1 (de) 1997-04-17 1997-04-17 Versorgungssystem für Chemikalien und dessen Verwendung
PCT/EP1998/002035 WO1998047661A1 (de) 1997-04-17 1998-04-08 Versorgungssystem für chemikalien und dessen verwendung

Publications (1)

Publication Number Publication Date
DE59809935D1 true DE59809935D1 (de) 2003-11-20

Family

ID=7826736

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19715974A Withdrawn DE19715974A1 (de) 1997-04-17 1997-04-17 Versorgungssystem für Chemikalien und dessen Verwendung
DE59809935T Expired - Fee Related DE59809935D1 (de) 1997-04-17 1998-04-08 Versorgungssystem für chemikalien und dessen verwendung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19715974A Withdrawn DE19715974A1 (de) 1997-04-17 1997-04-17 Versorgungssystem für Chemikalien und dessen Verwendung

Country Status (6)

Country Link
EP (1) EP1009589B1 (de)
JP (1) JP2001520589A (de)
AT (1) ATE251969T1 (de)
DE (2) DE19715974A1 (de)
TW (1) TW392248B (de)
WO (1) WO1998047661A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6241586B1 (en) 1998-10-06 2001-06-05 Rodel Holdings Inc. CMP polishing slurry dewatering and reconstitution
US6447375B2 (en) * 2000-04-19 2002-09-10 Rodel Holdings Inc. Polishing method using a reconstituted dry particulate polishing composition
DE10060697B4 (de) * 2000-12-07 2005-10-06 Siltronic Ag Doppelseiten-Polierverfahren mit reduzierter Kratzerrate und Vorrichtung zur Durchführung des Verfahrens
US7778721B2 (en) 2003-01-27 2010-08-17 Applied Materials, Inc. Small lot size lithography bays
US7221993B2 (en) 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US7720557B2 (en) 2003-11-06 2010-05-18 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US7218983B2 (en) 2003-11-06 2007-05-15 Applied Materials, Inc. Method and apparatus for integrating large and small lot electronic device fabrication facilities
TWI316044B (en) 2004-02-28 2009-10-21 Applied Materials Inc Methods and apparatus for material control system interface
US7274971B2 (en) 2004-02-28 2007-09-25 Applied Materials, Inc. Methods and apparatus for electronic device manufacturing system monitoring and control
TWI290875B (en) 2004-02-28 2007-12-11 Applied Materials Inc Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility
DE102009058436A1 (de) 2009-12-16 2011-01-20 Siltronic Ag Verfahren zur beidseitigen Politur einer Halbleiterscheibe

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2082255A5 (de) * 1970-03-09 1971-12-10 Barragan Jacques
DE2336735A1 (de) * 1973-07-19 1975-02-06 Licentia Gmbh Verfahren zum herstellen eines poliermittels fuer halbleiteroberflaechen
US4678119A (en) * 1982-10-12 1987-07-07 Buehler Ltd. Abrasive slurry supply system for use in metallographic sample preparation
KR930008856B1 (ko) * 1991-05-15 1993-09-16 금성일렉트론 주식회사 혼합용액의 일정비율 혼합장치
TW402542B (en) * 1994-10-24 2000-08-21 Motorola Inc Improvements in timing and location for mixing polishing fluid in a process of polishing a semiconductor substrate

Also Published As

Publication number Publication date
TW392248B (en) 2000-06-01
EP1009589A1 (de) 2000-06-21
WO1998047661A1 (de) 1998-10-29
DE19715974A1 (de) 1998-10-22
ATE251969T1 (de) 2003-11-15
JP2001520589A (ja) 2001-10-30
EP1009589B1 (de) 2003-10-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: BASF AG, 67063 LUDWIGSHAFEN, DE

8327 Change in the person/name/address of the patent owner

Owner name: BASF SE, 67063 LUDWIGSHAFEN, DE

8339 Ceased/non-payment of the annual fee