DE561548C - Plate-shaped dry rectifier element - Google Patents
Plate-shaped dry rectifier elementInfo
- Publication number
- DE561548C DE561548C DES94870D DES0094870D DE561548C DE 561548 C DE561548 C DE 561548C DE S94870 D DES94870 D DE S94870D DE S0094870 D DES0094870 D DE S0094870D DE 561548 C DE561548 C DE 561548C
- Authority
- DE
- Germany
- Prior art keywords
- plate
- rectifier element
- dry rectifier
- shaped dry
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 241000530268 Lycaena heteronea Species 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Coating By Spraying Or Casting (AREA)
Description
Plattenförmiges Trockengleichrichter-Element Bei plattenförmigen Elementen von Trockengleichrichtern, z. B. Kupferoxydgleichrichtern, die beiderseits mit einer den Sitz der Ventilwirkung darstellenden Oxydschicht versehen sind, ist es bekannt, die Stromzuführung zur Oxydschicht durch einen Spritzinetallüberzug zu vermitteln, der zu beiden Seiten der Platte auf die Oxvdschicht aufgebracht wird. Es erübrigt sich dadurch die Anordnung plattenförmiger Gegenelektroden, die unter Vermittlung einer Zwischenlage aus Bleifolie o. dgl. gegen die Oxvdschicht angepreßt werden. Zur leitenden Verbindung der beiderseitigen Spritzmetallüberzüge miteinander und mit der Wechselstromquelle dienten bei der vorerwähnten Einrichtung am Plattenrande angeordnete Blech- oder Drahtklaminern; der Gleichstrom wurde, beispielsweise an einer Durchbohrung der Platte, unmittelbar vom Mutterkupfer abgenommen.Plate-shaped dry rectifier element For plate-shaped elements of dry rectifiers, e.g. B. copper oxide rectifiers, both sides with a the seat of the valve action is provided with an oxide layer, it is known to convey the power supply to the oxide layer through a spray metal coating, which is applied to the oxide layer on both sides of the plate. There is no need thereby the arrangement of plate-shaped counter-electrodes, which under mediation an intermediate layer of lead foil or the like. Be pressed against the oxide layer. For the conductive connection of the two-sided spray metal coatings with each other and with the alternating current source were used in the above-mentioned device on the edge of the plate arranged sheet metal or wire staples; the direct current was on, for example a perforation in the plate, taken directly from the mother copper.
Gemäß der Erfindung können nun die Blech- oder Drahtklammern oder sonstige stromleitende Verbindungsglieder wegfallen und trotzdem beide Plattenseiten für die Gleichrichterwirkung ausgenutzt werden. Dies geschieht dadurch, daß am Rande der Platte zwischen den Oxydschichten und dein die Plattenkante umfassenden Spritzmetallüberzug eine elektrisch isolierende Zwischenschicht so angeordnet ist, daß sie den Plattenrand und die benachbarten Zonen der Plattenseiten bedeckt. Stellt man die isolierende Zwischenschicht durch Auftragen von Zellonlack auf die Oxydschicht her, so erhält man als vorteilhafte Nebenwirkung eine Verbesserung der Haftfestigkeit des Spritzmetalles auf der darunterliegenden Metalloxydschicht.According to the invention, the sheet metal or wire clips or no other electrically conductive connecting elements and still both sides of the plate can be used for the rectifier effect. This is done by being on the edge the plate between the oxide layers and the spray metal coating surrounding the edge of the plate an electrically insulating intermediate layer is arranged so that it is the edge of the plate and covers the adjacent zones of the plate sides. If you put the isolating Interlayer is obtained by applying Zellon lacquer to the oxide layer one advantageous side effect is an improvement in the adhesive strength of the spray metal on the underlying metal oxide layer.
Als Ergebnis einer großen Reihe von Versuchen hat sich herausgestellt, daß zur Herstellung der isolierenden Zwischenschicht gerade Zellonlack in ganz hervorragendem Maße geeignet ist. Hierzu trägt außer der hohen dielektrischen Durchschlagsfestigkeit, welche diesem Lack eigen ist, der Umstand bei, daß er wie kein anderer befähigt ist, die Haftfestigkeit des Spritzmetallüberzuges auf den darunterliegenden Oxy dschichten zu erhöhen.As a result of a large number of experiments, it has been found that for the production of the insulating intermediate layer just Zellonlack in very excellent Dimensions is suitable. In addition to the high dielectric strength, which is peculiar to this lacquer, the fact that it enables like no other is the adhesive strength of the spray metal coating on the underlying oxy to increase layers.
Die Anordnung einer Zellonschicht ist bei Trockengleichrichtern an sich bekannt. Eine derartige Schicht dient bei der bekannten Einrichtung jedoch- lediglich dem Zweck, den Trockengleichrichter gegen äußere Einwirkungen, insbesondere gegen die Einflüsse der atmosphärischen Feuchtigkeit zu schützen.The arrangement of a cellular layer is on with dry rectifiers known. Such a layer is used in the known device, however- only for the purpose of protecting the dry rectifier against external influences, in particular to protect against the influences of atmospheric moisture.
Die Stromzuleitung zu dem Spritzmetallüber7ug kann durch einen mit dem Metallüberzug durch Lötung oder auf andere Weise verbundenen Kupferdraht bewirkt werden.The power line to the spray metal cover can be connected through a the metal coating by soldering or otherwise connected copper wire will.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES94870D DE561548C (en) | 1929-11-10 | 1929-11-10 | Plate-shaped dry rectifier element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES94870D DE561548C (en) | 1929-11-10 | 1929-11-10 | Plate-shaped dry rectifier element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE561548C true DE561548C (en) | 1932-10-15 |
Family
ID=7518999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DES94870D Expired DE561548C (en) | 1929-11-10 | 1929-11-10 | Plate-shaped dry rectifier element |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE561548C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE934423C (en) * | 1942-07-02 | 1955-10-20 | Int Standard Electric Corp | Selenium dry rectifier |
| DE974772C (en) * | 1939-01-22 | 1961-04-20 | Int Standard Electric Corp | Selenium rectifier that avoids compressive stress on the barrier layer |
| DE976574C (en) * | 1939-10-17 | 1963-11-21 | Standard Elek K Lorenz Ag | Process for the manufacture of dry rectifier plates |
-
1929
- 1929-11-10 DE DES94870D patent/DE561548C/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE974772C (en) * | 1939-01-22 | 1961-04-20 | Int Standard Electric Corp | Selenium rectifier that avoids compressive stress on the barrier layer |
| DE976574C (en) * | 1939-10-17 | 1963-11-21 | Standard Elek K Lorenz Ag | Process for the manufacture of dry rectifier plates |
| DE934423C (en) * | 1942-07-02 | 1955-10-20 | Int Standard Electric Corp | Selenium dry rectifier |
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