DE4414970C2 - Mikromechanisches Bauteil mit einem Schaltelement als beweglicher Struktur, Mikrosystem und Herstellverfahren - Google Patents
Mikromechanisches Bauteil mit einem Schaltelement als beweglicher Struktur, Mikrosystem und HerstellverfahrenInfo
- Publication number
- DE4414970C2 DE4414970C2 DE4414970A DE4414970A DE4414970C2 DE 4414970 C2 DE4414970 C2 DE 4414970C2 DE 4414970 A DE4414970 A DE 4414970A DE 4414970 A DE4414970 A DE 4414970A DE 4414970 C2 DE4414970 C2 DE 4414970C2
- Authority
- DE
- Germany
- Prior art keywords
- switching element
- electrodes
- layer
- micromechanical component
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 38
- 238000000034 method Methods 0.000 claims description 49
- 238000005530 etching Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 13
- 238000001465 metallisation Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000002161 passivation Methods 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 238000001312 dry etching Methods 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 229920005591 polysilicon Polymers 0.000 description 8
- 150000004767 nitrides Chemical class 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000005380 borophosphosilicate glass Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910004028 SiCU Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000001015 X-ray lithography Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
- B81C1/0096—For avoiding stiction when the device is in use, i.e. after manufacture has been completed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00142—Bridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
- B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
- B81C1/00944—Maintaining a critical distance between the structures to be released
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H35/00—Switches operated by change of a physical condition
- H01H35/02—Switches operated by change of position, inclination or orientation of the switch itself in relation to gravitational field
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/01—Switches
- B81B2201/012—Switches characterised by the shape
- B81B2201/016—Switches characterised by the shape having a bridge fixed on two ends and connected to one or more dimples
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Micromachines (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Manufacture Of Switches (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4414970A DE4414970C2 (de) | 1994-04-28 | 1994-04-28 | Mikromechanisches Bauteil mit einem Schaltelement als beweglicher Struktur, Mikrosystem und Herstellverfahren |
| EP95106102A EP0680064B1 (de) | 1994-04-28 | 1995-04-24 | Mikromechanisches Bauteil mit einem Schaltelement als beweglicher Struktur, Mikrosystem und Herstellverfahren |
| DE59501309T DE59501309D1 (de) | 1994-04-28 | 1995-04-24 | Mikromechanisches Bauteil mit einem Schaltelement als beweglicher Struktur, Mikrosystem und Herstellverfahren |
| US08/431,491 US5637904A (en) | 1994-04-28 | 1995-04-28 | Micromechanical component with a switch element as a movable structure, microsystem, and production process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4414970A DE4414970C2 (de) | 1994-04-28 | 1994-04-28 | Mikromechanisches Bauteil mit einem Schaltelement als beweglicher Struktur, Mikrosystem und Herstellverfahren |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE4414970A1 DE4414970A1 (de) | 1995-11-02 |
| DE4414970C2 true DE4414970C2 (de) | 1996-02-22 |
Family
ID=6516750
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE4414970A Expired - Fee Related DE4414970C2 (de) | 1994-04-28 | 1994-04-28 | Mikromechanisches Bauteil mit einem Schaltelement als beweglicher Struktur, Mikrosystem und Herstellverfahren |
| DE59501309T Expired - Lifetime DE59501309D1 (de) | 1994-04-28 | 1995-04-24 | Mikromechanisches Bauteil mit einem Schaltelement als beweglicher Struktur, Mikrosystem und Herstellverfahren |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE59501309T Expired - Lifetime DE59501309D1 (de) | 1994-04-28 | 1995-04-24 | Mikromechanisches Bauteil mit einem Schaltelement als beweglicher Struktur, Mikrosystem und Herstellverfahren |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5637904A (enExample) |
| EP (1) | EP0680064B1 (enExample) |
| DE (2) | DE4414970C2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19829609B4 (de) * | 1998-07-02 | 2008-04-30 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Mikrosystems |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE179548T1 (de) * | 1995-11-14 | 1999-05-15 | Smiths Industries Plc | Schalter und schaltungssysteme |
| DE19600399C1 (de) * | 1996-01-08 | 1997-08-21 | Siemens Ag | Herstellverfahren für ein mikromechanisches Bauteil mit einer beweglichen Struktur |
| DE19600400C2 (de) * | 1996-01-08 | 2002-05-16 | Infineon Technologies Ag | Mikromechanisches Bauteil mit planarisiertem Deckel auf einem Hohlraum und Herstellverfahren |
| US6093330A (en) * | 1997-06-02 | 2000-07-25 | Cornell Research Foundation, Inc. | Microfabrication process for enclosed microstructures |
| US6054745A (en) * | 1999-01-04 | 2000-04-25 | International Business Machines Corporation | Nonvolatile memory cell using microelectromechanical device |
| EP1031736B1 (en) * | 1999-02-26 | 2004-04-28 | STMicroelectronics S.r.l. | Process for manufacturing mechanical, electromechanical and opto-electromechanical microstructures having suspended regions subject to mechanical stresses during assembly |
| US6399900B1 (en) * | 1999-04-30 | 2002-06-04 | Advantest Corp. | Contact structure formed over a groove |
| US6383945B1 (en) * | 1999-10-29 | 2002-05-07 | Advanced Micro Devices, Inc. | High selectivity pad etch for thick topside stacks |
| JP4295883B2 (ja) * | 1999-12-13 | 2009-07-15 | 株式会社ワコー | 力検出装置 |
| US6578436B1 (en) | 2000-05-16 | 2003-06-17 | Fidelica Microsystems, Inc. | Method and apparatus for pressure sensing |
| US7316167B2 (en) * | 2000-05-16 | 2008-01-08 | Fidelica, Microsystems, Inc. | Method and apparatus for protection of contour sensing devices |
| US6824278B2 (en) * | 2002-03-15 | 2004-11-30 | Memx, Inc. | Self-shadowing MEM structures |
| US7009124B2 (en) * | 2004-05-13 | 2006-03-07 | Motorola, Inc. | Acceleration switch |
| EP1967317A1 (en) * | 2007-03-07 | 2008-09-10 | Fujitsu Limited | Method for separating a workpiece and laser processing apparatus |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3955356A (en) * | 1974-03-19 | 1976-05-11 | Texas Instruments Incorporated | Watch having positioned controlled display actuator |
| US5430597A (en) * | 1993-01-04 | 1995-07-04 | General Electric Company | Current interrupting device using micromechanical components |
-
1994
- 1994-04-28 DE DE4414970A patent/DE4414970C2/de not_active Expired - Fee Related
-
1995
- 1995-04-24 EP EP95106102A patent/EP0680064B1/de not_active Expired - Lifetime
- 1995-04-24 DE DE59501309T patent/DE59501309D1/de not_active Expired - Lifetime
- 1995-04-28 US US08/431,491 patent/US5637904A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19829609B4 (de) * | 1998-07-02 | 2008-04-30 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Mikrosystems |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0680064B1 (de) | 1998-01-21 |
| DE59501309D1 (de) | 1998-02-26 |
| DE4414970A1 (de) | 1995-11-02 |
| EP0680064A3 (enExample) | 1995-11-29 |
| US5637904A (en) | 1997-06-10 |
| EP0680064A2 (de) | 1995-11-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |