DE4231122A1 - Heat sink for air cooled semiconductor - has diecast metal unit with plate form having radial fins across which forced air flows - Google Patents

Heat sink for air cooled semiconductor - has diecast metal unit with plate form having radial fins across which forced air flows

Info

Publication number
DE4231122A1
DE4231122A1 DE19924231122 DE4231122A DE4231122A1 DE 4231122 A1 DE4231122 A1 DE 4231122A1 DE 19924231122 DE19924231122 DE 19924231122 DE 4231122 A DE4231122 A DE 4231122A DE 4231122 A1 DE4231122 A1 DE 4231122A1
Authority
DE
Germany
Prior art keywords
heat sink
fan
cooling
fins
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19924231122
Other languages
German (de)
Other versions
DE4231122C2 (en
Inventor
Heinrich Ing Grad Cap
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Papst Licensing GmbH and Co KG
Original Assignee
Heinrich Ing Grad Cap
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heinrich Ing Grad Cap filed Critical Heinrich Ing Grad Cap
Priority to DE19924231122 priority Critical patent/DE4231122C2/en
Priority to DE9219058U priority patent/DE9219058U1/en
Publication of DE4231122A1 publication Critical patent/DE4231122A1/en
Application granted granted Critical
Publication of DE4231122C2 publication Critical patent/DE4231122C2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Effective cooling is provided by forced convection of air from a blower being passed across an effective heat sink surface. The heat sink, which is in contact with the devices is produced as a diecasting. The form of the heat sink is such that air is received axially and is deflected through 90 deg. to flow across cooling fins. The fins are arranged to project radially from a hub section. USE/ADVANTAGE - E.g. for computer processor chips. Compact, improved cooling action w.r.t. artificial ventilation provided by fan.

Description

Stand der TechnikState of the art

Durch den Fortschritt in der Halbleiter-Technologie ist es möglich die Packungsdichte pro integriertem Schaltkreis laufend zu steigern. Das bedeutet, daß auf der gleichen Halbleiter­ fläche mehr Bauelemente unterbringbar sind, aber auch daß die Halbleiterfläche (Chipfläche) insgesamt gesteigert wurde.Because of the progress in semiconductor technology it is possible the packing density per integrated circuit continuously to increase. That means that on the same semiconductor surface more components can be accommodated, but also that the Semiconductor area (chip area) was increased overall.

Obwohl gleichzeitig die Leistungsaufnahme einzelner Schaltungen in der Vergangenheit gesenkt werden konnte, stieg die Leistungsaufnahme pro komplettem Schaltkreis erheblich, weil einfach viel mehr Funktionen auf einer Chipfläche untergebracht wurden. Die Leistungsaufnahme stieg aber auch, weil bei taktenden Schaltungen die Taktfrequenz laufend gesteigert wurde und dadurch die dynamischen Verluste anstiegen.Although at the same time the power consumption of individual circuits could be lowered in the past, the rose Power consumption per complete circuit considerably because simply put a lot more functions on one chip surface were. The power consumption also increased because at clocking circuits the clock frequency was continuously increased and thereby the dynamic losses increased.

Ganz besonders deutlich macht sich die höhere Leistungsaufnahme bei den Prozessoren und Coprozessoren in Computern bemerkbar. Moderne Prozessoren entwickeln so viel Verlustleistung, daß das Gehäuse (Fig. 2) nicht mehr ausreicht um die entstehende Ver­ lustwärme abzuführen, es muß ein Kühlkörper aufgesetzt werden.The higher power consumption of processors and coprocessors in computers is particularly noticeable. Modern processors develop so much power loss that the housing ( Fig. 2) is no longer sufficient to dissipate the resulting heat heat, a heat sink must be put on.

Auf der zur Verfügung stehenden Fläche der quadratischen oder rechteckigen Gehäuse der integrierten Schaltungen können nur relativ kleine Kühlkörper montiert werden, deren thermischer Übergangswiderstand nicht immer zur Kühlung des Schaltkreises ausreicht (Fig. 1).Only relatively small heat sinks can be mounted on the available surface of the square or rectangular housing of the integrated circuits, the thermal contact resistance of which is not always sufficient to cool the circuit ( FIG. 1).

Es wurden deshalb lüfterunterstützte Kühlkörper entwickelt. Diese bestehen aus einem Kühlkörper mit aufgesetztem Lüfter.For this reason, fan-assisted heat sinks have been developed. These consist of a heat sink with a fan attached.

Bekannte Anordnungen enthalten einen stranggepreßten Kühlkörper mit parallelen Längsrippen zur Vergrößerung der Oberfläche, die künstlich mit dem aufgesetztem Kühlkörper von Luft umströmt werden. Die mit dieser Kombination abzuführende Verlustleistung ist um den Faktor 3-10 größer als bei einem einfachen Kühl­ körper (Fig. 3).Known arrangements contain an extruded heat sink with parallel longitudinal ribs to increase the surface area, which air flows around artificially with the attached heat sink. The power loss to be dissipated with this combination is larger by a factor of 3-10 than with a simple heat sink ( Fig. 3).

Die oben beschriebenen Kühlkörper sind quadratisch aufgebaut, z. B. 42×42 mm, und wird mit der glatten Fläche auf das zu kühlende IC-Gehäuse mit einem wärmeleitenden Kleber aufgeklebt. Die andere Fläche trägt mehrere Längskühlrippen. Ein Axial­ lüfter liegt flach auf den Rippen. Die Luft wird senkrecht auf die Rippen geblasen, um 90° abgelenkt und kann seitlich in nur zwei Richtungen abfließen.The heat sinks described above have a square structure, e.g. B. 42 × 42 mm, and is with the smooth surface to Cooling IC case glued on with a heat-conducting adhesive. The other surface has several longitudinal cooling fins. An axial fan lies flat on the ribs. The air gets vertical the ribs are blown, deflected by 90 ° and can be moved sideways in only flow in two directions.

Es entstehen Luftverwirbelungen, die den Luftdurchsatz wesent­ lich behindern. Ideal umspült wird nur die mittlere Rippe, die näher zum Außenrand liegenden Rippen werden nur schlecht belüftet. Die erfindungsgemäße Anordnung vermeidet diesen Nachteil.Air turbulence occurs, which is essential for the air throughput hinder. Ideally, only the middle rib, the Ribs closer to the outer edge only become bad ventilated. The arrangement according to the invention avoids this Disadvantage.

Beschreibung der ErfindungDescription of the invention

Eine optimale Steigerung der Kühlleistung eines Kühlkör­ pers durch künstliche Belüftung mittels eines Lüfters erfor­ dert zwingend eine Anpassung der Geometrie des Kühlkörpers an das Lüfteraggregat, unter Berücksichtigung der Einbaumög­ lichkeiten.An optimal increase in the cooling capacity of a heat sink pers by artificial ventilation using a fan changes the geometry of the heat sink to the fan unit, taking into account the installation options options.

Die Erfindung sieht die Anordnung eines Kühlkörpers mit sternförmig angeordneten Kühlrippen vor. Nur bei einer sol­ chen Konstruktion kann die vom Lüfter angesaugte Luft voll wirksam über alle Rippen streichen und es kann eine bessere Kühlwirkung erreicht werden. Die Luft kann radial in allen Richtungen ohne Verwirbelungen abfließen. Ein Beispiel für einen solchen Kühlkörper ist in Fig. 4 zu sehen.The invention provides for the arrangement of a heat sink with cooling fins arranged in a star shape. Only with such a construction can the air drawn in by the fan sweep effectively across all the fins and a better cooling effect can be achieved. The air can flow radially in all directions without turbulence. An example of such a heat sink can be seen in FIG. 4.

Eine Anordnung als Druckgußteil ermöglicht nicht nur op­ timale, an die jeweilige Lüftergröße angepaßte Abmessungen, sondern auch die kostenneutrale Anbringung von Montageboh­ rungen zur Montage des Lüfters und zur Montage des Kühlkör­ pers im Gerät. Weiter erhält man gegenüber einem strangge­ preßten Teil die konstruktive Freiheit, die Kühlrippen auch um den Lüfter herum anzuordnen, was die Wirksamkeit weiter erhöht.An arrangement as a die-cast part enables not only op timely dimensions adapted to the respective fan size, but also the cost-neutral installation of assembly bores for mounting the fan and mounting the heat sink pers in the device. Next you get to a strand some pressed the constructive freedom, the cooling fins too to arrange around the fan, which further increases the effectiveness elevated.

Die höhere Kühlleistung der Anordnung mit dem erfindungs­ gemäßen Kühlkörper erlaubt den Einsatz langsam drehender Lüfter, die leiser sind und eine höhere Lebensdauer besit­ zen, beides sehr wesentliche Merkmale.The higher cooling capacity of the arrangement with the Invention modern heat sink allows the use of slowly rotating Fans that are quieter and have a longer service life zen, both very essential features.

Durch die kostenneutrale Anbringung von mitgegossenen Montagebohrungen werden die Herstellkosten gesenkt, weil der Arbeitsgang Bohren oder Stanzen von Löchern entfällt.Through the cost-neutral attachment of co-cast Mounting holes will reduce manufacturing costs because of Drilling or punching holes is not required.

Der Kühlkörper kann bei Bedarf auch zur Gänze oder teilweise über das zu kühlende Element hinausragen. In den überstehenden Zonen kann man weitere Bohrungen vorsehen und mitgießen, womit der Kühlkörper anschraubbar wird. Befestigt man z. B. den Kühlkörper so auf der Leiterplatte, so daß das IC-Gehäuse bedeckt wird, kann man auf die teure und umständliche Verklebung mit wärmeleitendem Kleber verzichten. Es genügt die Anbringung von Wärmeleitpaste oder einer einfachen Wärmeleitfolie zwischen Gehäuse und Kühlkörper.If necessary, the heat sink can also be wholly or partially protrude beyond the element to be cooled. In the protruding ones Zones can be provided for additional holes and cast with what the heat sink can be screwed on. If you attach z. B. the heat sink so on the circuit board so that the IC package is covered you can on the expensive and cumbersome gluing with dispense with heat-conducting adhesive. It is sufficient to attach Thermal paste or a simple thermal foil between Housing and heat sink.

Ein Beispiel für diese Kühlkörperausführung zeigt Fig. 5.An example of this heat sink design is shown in FIG. 5.

Claims (10)

1. Kühlkörper, der mit einem Lüfter so zu einem Kühlaggregat ergänzt wird, daß der Lüfter senkrecht in Richtung der Kühlrippen bläst und der Luftstrom dabei um 90° abge­ lenkt wird, dadurch gekennzeichnet, daß der Kühlkör­ per radial um einen Mittelpunkt angeordnete Kühlrippen trägt.1. Heatsink, which is supplemented with a fan to form a cooling unit, that the fan blows vertically in the direction of the cooling fins and the air flow is deflected by 90 °, characterized in that the heat sink carries radially arranged around a center fins. 2. Anspruch nach 1, dadurch gekennzeichnet, daß mindes­ tens 2 Durchgangs- oder Sackbohrungen angebracht sind, die zur Befestigung des Lüfters mittels selbstschneiden­ den Schrauben dienen; diese Bohrungen sind vorzugsweise in der Mitte von Kühlstegen angeordnet, die im Bereich der Bohrungen verdickt sind.2. Claim according to 1, characterized in that at least at least 2 through or blind holes are drilled, the self-cutting to attach the fan serve the screws; these holes are preferred arranged in the middle of cooling bars, which in the Area of the holes are thickened. 3. Anspruch nach 1 und 2, dadurch gekennzeichnet, daß die Kühlrippen nicht in der gleichen Höhe bis zu ihrem Zentrum durchgezogen sind, sondern im Bereich innerhalb des Innendurchmessers der Lüfterflügel enden und gerade, schräg oder gekrümmt bis zum Kühlkörperboden geführt werden.3. Claim according to 1 and 2, characterized in that the cooling fins are not at the same height up to theirs Center are solid, but in the area within of the inner diameter of the fan blades end and straight, led obliquely or curved to the heat sink bottom will. 4. Anspruch nach 1 bis 3, dadurch gekennzeichnet, daß mindestens 2 weitere Bohrungen außerhalb der Fläche, die der Lüfter oder ein zu kühlendes Element bedecken, vorge­ sehen sind.4. Claim according to 1 to 3, characterized in that at least 2 more holes outside of the area that cover the fan or an element to be cooled, pre are seen. 5. Anspruch nach 1 bis 4, dadurch gekennzeichnet, daß die Rippenenden allseitig strömungstechnisch geformt sind, im einfachsten Fall Radien mit der Abmessung von mindestens der halben Wanddicke tragen.5. Claim according to 1 to 4, characterized in that the fin ends are fluidically shaped on all sides are, in the simplest case, radii with the dimension of Wear at least half the wall thickness. 6. Anspruch nach 1 bis 5, dadurch gekennzeichnet, daß die Kühlrippen des Kühlkörpers über die Umrißkanten des Lüfters hinausragen.6. Claim according to 1 to 5, characterized in that the cooling fins of the heat sink over the outline of the Protrude fan. 7. Anspruch nach 1 bis 6, dadurch gekennzeichnet, daß die Kühlrippen außerhalb der Umrißkanten des Lüfters mit größerer Höhe, vorzugsweise bis zur Oberkante des Lüf­ ters geführt werden.7. Claim according to 1 to 6, characterized in that the cooling fins outside the outline of the fan greater height, preferably up to the upper edge of the Lüf ters. 8. Anspruch nach 1 bis 7, dadurch gekennzeichnet, daß der Kühlkörper eloxiert, lackiert oder aufgerauht ist.8. Claim according to 1 to 7, characterized in that the heat sink is anodized, painted or roughened. 9. Anspruch nach 1 bis 8, dadurch gekennzeichnet, daß der Kühlkörper im Druckgußverfahren hergestellt wird.9. Claim according to 1 to 8, characterized in that the heat sink is manufactured by die casting. 10. Anspruch nach 1 bis 6, dadurch gekennzeichnet, daß der Kühlkörper im Fließpreßverfahren hergestellt wird.10. Claim according to 1 to 6, characterized in that the heat sink is manufactured using the extrusion process.
DE19924231122 1992-09-17 1992-09-17 Heatsink with fan Expired - Fee Related DE4231122C2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE19924231122 DE4231122C2 (en) 1992-09-17 1992-09-17 Heatsink with fan
DE9219058U DE9219058U1 (en) 1992-09-17 1992-09-17 Heatsink with fan

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19924231122 DE4231122C2 (en) 1992-09-17 1992-09-17 Heatsink with fan

Publications (2)

Publication Number Publication Date
DE4231122A1 true DE4231122A1 (en) 1993-07-01
DE4231122C2 DE4231122C2 (en) 1997-05-22

Family

ID=6468186

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19924231122 Expired - Fee Related DE4231122C2 (en) 1992-09-17 1992-09-17 Heatsink with fan

Country Status (1)

Country Link
DE (1) DE4231122C2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19506373A1 (en) * 1994-02-24 1995-08-31 Mitsubishi Materials Corp Gas cooling system for electronic module
US5597034A (en) * 1994-07-01 1997-01-28 Digital Equipment Corporation High performance fan heatsink assembly
DE19701938A1 (en) * 1996-02-01 1997-08-07 Hewlett Packard Co Fan-assisted heat sink element
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
DE102004046473A1 (en) * 2004-09-23 2006-04-06 Sew-Eurodrive Gmbh & Co. Kg Linear motor comprising heat sink and primary is designed to enhance thermal contact between them by selective machining for controlled localized roughness and planarity
DE102006019310A1 (en) * 2006-04-26 2007-10-31 Robert Bosch Gmbh Heat sink for the controller of an electric machine
DE102015209375A1 (en) 2014-05-23 2015-11-26 Fronius International Gmbh Cooling device and inverter housing with such a cooling device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202007003846U1 (en) 2007-03-13 2007-05-24 Jet Computer Products Gmbh Fan for e.g. microprocessor of computer system, has fan blade extending radially outwards from rotor units inclined to rotation axis, where free end of blade opposite to rotor units is curved downwards in direction of air suction side

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3803469A1 (en) * 1988-02-05 1989-08-17 Digatec Electronic Systems Electronic device having a heat sink and having components fastened to the latter
DE3918767A1 (en) * 1988-06-22 1989-12-28 Magneti Marelli Spa RECTIFIER BRIDGE FOR AC GENERATORS OF MOTOR VEHICLES
DE9000533U1 (en) * 1990-01-18 1990-03-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
US4935864A (en) * 1989-06-20 1990-06-19 Digital Equipment Corporation Localized cooling apparatus for cooling integrated circuit devices
US5019880A (en) * 1988-01-07 1991-05-28 Prime Computer, Inc. Heat sink apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019880A (en) * 1988-01-07 1991-05-28 Prime Computer, Inc. Heat sink apparatus
DE3803469A1 (en) * 1988-02-05 1989-08-17 Digatec Electronic Systems Electronic device having a heat sink and having components fastened to the latter
DE3918767A1 (en) * 1988-06-22 1989-12-28 Magneti Marelli Spa RECTIFIER BRIDGE FOR AC GENERATORS OF MOTOR VEHICLES
US4935864A (en) * 1989-06-20 1990-06-19 Digital Equipment Corporation Localized cooling apparatus for cooling integrated circuit devices
DE9000533U1 (en) * 1990-01-18 1990-03-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19506373A1 (en) * 1994-02-24 1995-08-31 Mitsubishi Materials Corp Gas cooling system for electronic module
US5597034A (en) * 1994-07-01 1997-01-28 Digital Equipment Corporation High performance fan heatsink assembly
DE19701938A1 (en) * 1996-02-01 1997-08-07 Hewlett Packard Co Fan-assisted heat sink element
US5975194A (en) * 1996-02-01 1999-11-02 Hewlett Packard Company Fan assisted heat sink device
DE19701938B4 (en) * 1996-02-01 2004-12-23 Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto Fan-assisted heat sink element
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
DE102004046473A1 (en) * 2004-09-23 2006-04-06 Sew-Eurodrive Gmbh & Co. Kg Linear motor comprising heat sink and primary is designed to enhance thermal contact between them by selective machining for controlled localized roughness and planarity
DE102004046473B4 (en) 2004-09-23 2023-04-27 Sew-Eurodrive Gmbh & Co Kg linear motor
DE102006019310A1 (en) * 2006-04-26 2007-10-31 Robert Bosch Gmbh Heat sink for the controller of an electric machine
US8371364B2 (en) 2006-04-26 2013-02-12 Robert Bosch Gmbh Cooling body for a voltage regulator
DE102015209375A1 (en) 2014-05-23 2015-11-26 Fronius International Gmbh Cooling device and inverter housing with such a cooling device
US10104808B2 (en) 2014-05-23 2018-10-16 Fronius International Gmbh Heat sink and housing for an inverter with such a heat sink
DE102015209375B4 (en) 2014-05-23 2021-09-16 Fronius International Gmbh Cooling device and inverter housing with such a cooling device

Also Published As

Publication number Publication date
DE4231122C2 (en) 1997-05-22

Similar Documents

Publication Publication Date Title
US6450250B2 (en) Stackable heat sink for electronic components
DE60315911T2 (en) Heat sink with multiple surface enlargement
US4695924A (en) Two piece heat sink with serrated coupling
DE4231122A1 (en) Heat sink for air cooled semiconductor - has diecast metal unit with plate form having radial fins across which forced air flows
CN212463902U (en) Porous heat sink
DE112022001274T5 (en) HEAT SINK (HEAT SINK) WITH LANES OUTSIDE A BOARD
DE102011006779A1 (en) Arrangement for cooling electronic components and / or assemblies
DE10310568A1 (en) Heat-sink arrangement for electronic component esp. high-power microprocessor, has thermal tube joined via evaporation zone in cooling-medium tight fashion to contact
DE10332770A1 (en) Cooling device for dissipating heat loss from an electrical or electronic component or assembly
DE202005003502U1 (en) Aluminum-copper composite fin heat sink for cooling exothermic electric/electronic components in computer processors/power electronics has an integrated heat-conducting pipe
DE202005009081U1 (en) Effective cooling for computer electronics is in form of carrier having fan and heat sink and sits on mother board
WO2022270024A1 (en) Electronic device
DE10311526A1 (en) Modular housing system for a fanless display-computer, has an integrated multi-layer passive cooling system that connects to the housing so that heat is dissipated over the whole housing
DE10259191A1 (en) Industrial computer has components within heat dissipating metal housing with fluid heat pipes to transfer heat energy
DE202004001331U1 (en) Cooler as tangential bladed blower has submounted concave or convex surfaced base with inbuilt heat-exchange elements as cooling fingers to dissipate operating heat assisted by base surface shape.
KR960000159Y1 (en) Heat structure for transistor
DE202012001283U1 (en) cooling module
DE202005017450U1 (en) Cooling module for e.g. central processing unit, has cooling fan provided with housing that comprises air inlet and outlet sides, and hook provided at inner side of casing to hook to edge of inlet or outlet side
DE20315034U1 (en) Easy-to-install housing for silently-operating computer has side walls and roof of square housing used as cooling surfaces with integrated cooling ribs
DE102004033334A1 (en) Cooling device for central processing unit of desktop computer, has air ducts provided between cooling fins of cooler, where turbulators are provided in air ducts and moved by air stream of cooling fan
DE102007017701B3 (en) Water cooled heat dissipating device for interface card, has hollow base on which interface card is fixed, and processor chip along with memory chip contact interface card
DE20316199U1 (en) Cooling of electronic devices, using an internal primary cooler coupled to a secondary external cooler
DE202004017271U1 (en) Cooler for integrated electronic circuit module has heat sink that is easily fixed to frame of cooling fan
DE20208670U1 (en) Heatsink with improved airflow efficiency
DE202004000625U1 (en) Radiator for liquid-cooled computer, esp. water-cooled PC, has at least two finned tubes flowed through by liquid successively, or in parallel

Legal Events

Date Code Title Description
OAV Applicant agreed to the publication of the unexamined application as to paragraph 31 lit. 2 z1
8122 Nonbinding interest in granting licenses declared
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PAPST LICENSING GMBH & CO. KG, 78549 SPAICHINGEN,

8381 Inventor (new situation)

Free format text: CAP, HEINRICH,ING.(GRAD.), 78112 ST GEORGEN, DE

8320 Willingness to grant licenses declared (paragraph 23)
8327 Change in the person/name/address of the patent owner

Owner name: PAPST LICENSING GMBH & CO. KG, 78112 ST. GEORGEN,

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20120403