DE202005003502U1 - Aluminum-copper composite fin heat sink for cooling exothermic electric/electronic components in computer processors/power electronics has an integrated heat-conducting pipe - Google Patents
Aluminum-copper composite fin heat sink for cooling exothermic electric/electronic components in computer processors/power electronics has an integrated heat-conducting pipe Download PDFInfo
- Publication number
- DE202005003502U1 DE202005003502U1 DE200520003502 DE202005003502U DE202005003502U1 DE 202005003502 U1 DE202005003502 U1 DE 202005003502U1 DE 200520003502 DE200520003502 DE 200520003502 DE 202005003502 U DE202005003502 U DE 202005003502U DE 202005003502 U1 DE202005003502 U1 DE 202005003502U1
- Authority
- DE
- Germany
- Prior art keywords
- heat
- aluminum
- heat pipe
- electronic components
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Die
vorliegende Erfindung betrifft einen Finnen-Kühlkörper aus Aluminium-Kupfer-Verbundwerkstoff
mit integriertem Wärmeleitrohr
zur Kühlung von
wärmeabgebenden
elektrischen und elektronischen Bauteilen insbesondere von Computerprozessoren
oder Leistungselektroniken und ist eine Weiterentwicklung des Gebrauchsmusters
Viele elektronische Bauelemente, insbesondere CPU-Prozessoren und Leistungselektroniken arbeiten in einem begrenzten Temperaturbereich und zeigen Fehlfunktionen, wenn die Temperatur außerhalb dieses Bereichs liegt. Außerdem erzeugen sie Wärme während ihres Betriebes. Um nun die richtige Betriebstemperatur aufrechtzuerhalten muss die während des Betriebs der elektronischen Bauelemente erzeugte Wärme abgeführt werden.Lots electronic components, in particular CPU processors and power electronics work in a limited temperature range and show malfunction, if the temperature is outside this area lies. Furthermore they generate heat while their business. In order to maintain the correct operating temperature must be during the the heat generated by the operation of the electronic components are dissipated.
Zur Kühlung von wärmeerzeugenden Bauteilen von elektrischen und elektronischen Komponenten sind eine Vielzahl von Kühlvorrichtungen bekannt. Vor allem werden die Bauteile durch thermischen Anschluss eines Kühlkörpers aus Aluminium oder Aluminiumlegierung an das wärmeerzeugende Teil gekühlt. Da jedoch Aluminium eine niedrige Wärmeleitfähigkeit hat, ist die Wärmeableitung unzureichend, so dass kein ausreichender Kühleffekt erzielt wird.to cooling of heat-producing Components of electrical and electronic components are one Variety of cooling devices known. Above all, the components are thermally connected a heat sink Aluminum or aluminum alloy cooled to the heat-generating part. There however, aluminum has a low thermal conductivity has, is the heat dissipation insufficient so that a sufficient cooling effect is not achieved.
So
ist in
In
Die meisten Kühlvorrichtungen für Prozessoren und Leistungselektroniken basieren auf einem Aluminiumkühlkörper mit Rippen und angeflanschtem Lüfter. Kühlkörper aus Kupfer wären von der Wärmeleitung her wesentlich besser, sie sind jedoch sehr schwer und teuer. Des weiteren sind Kühlkörper aus Aluminium mit Kupferkern, z. B. geschraubte Kupferplatte auf Aluminiumkühlkörper oder Extrusionsprofil aus Aluminium mit Kupfer-Inlet u. a. bekannt, wobei das Kupfer im Innern für eine bessere Wärmeableitung sorgt und das Aluminium für einen guten Übergang an die Luft zuständig ist. Hier sind immer Aluminiumkühlkörper mit Lüftern im Einsatz. Nachteilig ist auch hier der Einsatz von Lüftern.The most cooling devices for processors and power electronics are based on an aluminum heat sink with Ribs and flanged fan. Heat sink off Copper would be from the heat conduction Much better, but they are very heavy and expensive. Of others are heat sink off Aluminum with copper core, z. B. screwed copper plate on aluminum heat sink or Extrusion profile made of aluminum with copper inlet u. a. known, where the copper inside for a better heat dissipation ensures and the aluminum for a good transition responsible for the air is. Here are always aluminum heat sink with fans in use. Another disadvantage is the use of fans.
Zur Kühlung der elektronischen Komponenten sind weitere zahlreiche Kühlkörper aus Aluminium mit und/oder ohne Lüfter vorgeschlagen und entwickelt worden. Nachteilig bei diesen Lösungen ist zum einen der Geräuschpegel sowie die begrenzte Lebensdauer der Lüfter. Außerdem benötigt diese Art der Kühlung einen großen Platzbedarf, ist in ihrer Herstellung sehr teuer und lässt die abgeführte Wärme mittels Konvektion im Gehäuse, so dass weitere Lüfter zur Wärmeabfuhr der entstehenden Wärme aus dem Gehäuse heraus erforderlich sind. Des weiteren sind Kühler mit in den Kühlrippen integrierten Flüssigkeitskühlern und Lüftern bekannt. Nachteilig bei diesen Kühlern ist, dass, dadurch dass der Flüssigkeitskühler eine bestimmte Länge zur einwandfreien Funktion benötigt, diese aber bei den bekannten Kühlern nicht realisierbar, es nicht möglich ist, die kalte Zone des Flüssigkeitskühlers auch kalt zu halten. Denn der Kühlblock des Kühlers wird schnell warm und der Lüfter kühlt die Kühlrippen noch schlechter ab. Die kalte Zone erwärmt sich somit und der gewünschte Effekt bleibt aus. Auch diese Kühler benötigen Lüfter zur Wärmeabfuhr aus dem Gehäuse heraus.to cooling The electronic components are more numerous heatsinks made Aluminum with and / or without fan been proposed and developed. A disadvantage of these solutions is the one of the noise levels as well as the limited life of the fans. In addition, this type of cooling requires one huge Required space, is very expensive in their production and leaves the dissipated Heat by means of Convection in the housing, leaving more fans for heat dissipation the resulting heat the housing are required out. Furthermore, coolers are in the cooling fins integrated liquid coolers and fans known. A disadvantage of these coolers is that, in that the liquid cooler a certain length needed for proper function, but these in the known coolers not realizable, it is not possible is, the cold zone of the chiller too to keep cold. Because the cooling block the radiator gets hot quickly and the fan that cools cooling fins even worse off. The cold zone thus heats up and the desired effect Stay off. Also these coolers need Fan for heat dissipation out of the case out.
In
Außerdem sind Finnenkühlkörper mit Kupferlamellen bekannt. Nachteilig bei diesen Kühlkörpern ist das hohe Gewicht des Kühlkörpers und die Herstellungskosten.Besides, they are Finned heat sink with Copper fins known. A disadvantage of these heat sinks is the high weight of the heat sink and the manufacturing costs.
Dadurch, dass die wärmeerzeugenden Bauteile immer mehr verkleinert werden und immer mehr Wärme erzeugen, die abgeführt werden muss liegt der Erfindung die Aufgabe zugrunde, einen Finnen-Kühlkörper aus Aluminum-Kupfer-Verbundwerkstoff mit integriertem Wärmeleitrohr zur Kühlung von wärmeabgebenden elektrischen und elektronischen Bauteilen der eingangs genannten Art zu schaffen, der es erlaubt, die in den elektrischen und elektronischen Bauteilen entstehende Wärme ohne Lüfter abzuführen und ohne Lüfter mit einem kompakten Kühlkörper mit ausgezeichneten Wärmeabstrahlungseigenschaften an die Umgebung abzugeben, wobei der Kühlkörper in seinen Abmessungen klein gehalten wird und intern und/oder extern in Gehäusen eingesetzt werden kann und in der Herstellung äußerst preiswert ist und kein hohes Gewicht aufweist.Thereby, that the heat-producing Components are getting smaller and smaller and producing more and more heat, the dissipated The object of the invention is to provide a fin heat sink Aluminum-copper composite with integrated heat pipe for cooling of exhaling heat electrical and electronic components of the aforementioned To create a kind that allows in the electrical and electronic Heat generated by components without fan dissipate and without a fan with a compact heat sink with excellent Heat radiation properties To give to the environment, the heat sink in its dimensions is kept small and used internally and / or externally in housings can be and is extremely inexpensive to manufacture and no has high weight.
Diese Aufgabe wird mit den Merkmalen des Anspruchs 1 gelöst. Hierbei ist also vorgesehen, dass ein Finnen-Kühlkörper so gestaltet wird, dass er aus einer und/oder mehreren parallel zueinander angeordneter Finnen, die aus einem Aluminium-Kupfer-Verbundwerkstoff bestehen, und wobei die Finnen Bohrungen zur Aufnahme der wärmeabgebenden Enden der Wärmeleitrohre aufweisen, und die Bohrungen mit und/oder ohne Ränder ausgeführt sind und die Finnen auf das wärmeabgebende Ende der Wärmeleitrohre gepresst und/oder gelötet sind und dass das und/oder die wärmeaufnehmenden Ende der Wärmeleitrohre mittels ein- und/oder mehrteiligen Adaptersystemen, die aus Kupfer und/oder Aluminium und/oder Graphit und/oder deren Legierungen hergestellt sind, an den wärmeabgebenden elektrischen und elektronischen Bauteilen mittels Spannvorrichtungen befestigt sind.These The object is achieved with the features of claim 1. in this connection Thus, it is envisaged that a fin heat sink is designed so that he from one and / or more parallel to each other Finns made of aluminum-copper composite and wherein the fins have bores for receiving the heat-emitting Ends of the heat pipes have, and the holes are executed with and / or without edges and the fins on the heat-emitting End of the heat pipes pressed and / or soldered are and that and / or the heat-absorbing end the heat pipes by means of single and / or multi-part adapter systems made of copper and / or aluminum and / or graphite and / or their alloys are, at the heat-emitting electric and electronic components attached by means of clamping devices are.
Eine einfache bevorzugte Ausführung der Erfindung weist eine Befestigung einer und/oder mehreren Finnen am Gehäuse auf.A simple preferred embodiment The invention has a fastening of one and / or more fins on the housing on.
Vorteilhaft weist sich auch eine schwingungsgedämpfte Befestigung des wärmeabgebenden Endes des Wärmeleitrohres zur zusätzlichen Befestigung der Kühleinheit aus.Advantageous also has a vibration-damped attachment of the heat-emitting End of the heat pipe for additional Fixing the cooling unit out.
Eine Vereinfachung ergibt sich dadurch, dass die Finnen mit dem wärmeabgebenden Ende der Wärmeleitrohre verklebt werden.A Simplification results from the fact that the Finns with the heat-emitting End of the heat pipes be glued.
Das wärmeaufnehmende Ende des Wärmeleitrohres wird mittels eines Adaptersystems an dem wärmeabgebenden elektrischen oder elektronischen Bauteiles befestigt, wobei das Adaptersystem dem Bauteil angepasst ist und mittels Spannklammern, Schrauben o. ä. Komponenten fest und/oder federnd am Bauteil angeordnet ist.The heat-absorbing End of the heat pipe is by means of an adapter system to the heat-emitting electrical or electronic components attached, the adapter system the component is adapted and by means of clamps, screws o. Ä. Components fixed and / or resiliently arranged on the component.
Die Erfindung wird nachfolgend anhand eines Ausführungsbeispiels unter Bezugnahme auf die Zeichnungen näher erläutert. Es zeigen:The Invention will now be described with reference to an embodiment with reference closer to the drawings explained. Show it:
In
In
Claims (25)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200520003502 DE202005003502U1 (en) | 2005-03-04 | 2005-03-04 | Aluminum-copper composite fin heat sink for cooling exothermic electric/electronic components in computer processors/power electronics has an integrated heat-conducting pipe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200520003502 DE202005003502U1 (en) | 2005-03-04 | 2005-03-04 | Aluminum-copper composite fin heat sink for cooling exothermic electric/electronic components in computer processors/power electronics has an integrated heat-conducting pipe |
Publications (1)
Publication Number | Publication Date |
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DE202005003502U1 true DE202005003502U1 (en) | 2005-06-09 |
Family
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Family Applications (1)
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DE200520003502 Expired - Lifetime DE202005003502U1 (en) | 2005-03-04 | 2005-03-04 | Aluminum-copper composite fin heat sink for cooling exothermic electric/electronic components in computer processors/power electronics has an integrated heat-conducting pipe |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014006751A1 (en) | 2014-05-08 | 2015-03-26 | Diehl Aircabin Gmbh | Composite assembly and method of manufacturing the composite assembly |
DE102014014393A1 (en) | 2014-10-02 | 2016-04-07 | E E T Energie-Effizienz Technologie GmbH | heat exchangers |
-
2005
- 2005-03-04 DE DE200520003502 patent/DE202005003502U1/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014006751A1 (en) | 2014-05-08 | 2015-03-26 | Diehl Aircabin Gmbh | Composite assembly and method of manufacturing the composite assembly |
DE102014014393A1 (en) | 2014-10-02 | 2016-04-07 | E E T Energie-Effizienz Technologie GmbH | heat exchangers |
WO2016050457A1 (en) | 2014-10-02 | 2016-04-07 | E E T Energie-Effizienz Technologie GmbH | Heat exchanger |
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Legal Events
Date | Code | Title | Description |
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R207 | Utility model specification |
Effective date: 20050714 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20080411 |
|
R151 | Utility model maintained after payment of second maintenance fee after six years |
Effective date: 20110420 |
|
R158 | Lapse of ip right after 8 years |
Effective date: 20131001 |