DE19506373A1 - Gas cooling system for electronic module - Google Patents

Abstract

A cooling module is used with electronic units (900) and is mounted in direct contact with the housing. The cooling module has a box shape with a labyrinth shaped channel (113) through which the cooling gas is drawn. The underside of the top cover is used to mount a miniature motor driven fan (131) that provides the required circulation rate to achieve the necessary cooling effect.

Description

The present invention relates to a device for cooling electronic parts, and in particular, however not exclusive, to a device for cooling half lead terchips.

There is a great demand for size reduction, and after an increase in the operating speed of various information devices, such as computers and peripheral facilities and also of different electronic institutions, eg. B. measuring instruments and tax or Control equipment. In the near past, the Integra tion scale and operating speed of such apparatus and facilities remarkably increased due to the ongoing rapid development in semiconductor technology, thereby the demand for size reduction and increased operation speed can be met.

The speed increase and the size reduction or reduction, d. H. the improved integration scale and increased te operating speed, is the current demand On the one hand fair, but on the other hand it meets Problem in the sense that the heat generation rate uner wishes to be increased because of the power or power consumption the semiconductor chips. Processor chips, like those in CPU te, more often have in particular temperature increases to 100 ° C. or higher, wherein a large electric power, for. B. 10 W or more is consumed.

One of the provisions for effectively cooling such semiconductor chips uses, as shown in FIG. 1, a heat radiating fin block 910 which is mounted on the rear side of a semiconductor chip 900 and has a fan Compressor engine 920 carries. In operation, the blower motor 920 is operated to generate a flow of cooling gas which forcibly cools the semiconductor chip.

This type or this type of cooling device, which an on however, can use a blower mounted on a cooling structure not a suitable or satisfactory cooling effect provide.

In particular, sucks and ejects or releases the fan in this type of cooling device the cooling gas in one direction, in particular perpendicular to the semiconductor chip, during the heat radiating rib block under the fan tabular or tubular rib walls or rod-shaped Wärmedis has sipationsvorsprünge, which are not suitable for Heat exchange with the above flow direction of the cooling gas. In particular, turbulence is in the Flow of the cooling gas generated in the rib blocks, so that the cooling gas not along the heat dissipation surfaces or surfaces of the heat radiating fins flow ßen, whereby a good cooling effect is not provided can be.

It should be noted that generally the housing of an Informationapparats of the type described above is provided with a cooling fan for cooling the whole or Ren inherent structure, which is included within the housing. This blower generates a flow of cooling gas around the semiconductor chip. Meanwhile, the semiconductor chip cooling device of the type shown in FIG. 1 which is also enclosed in the housing causes the cooling gas to be sucked down and discharged horizontally from all four sides of the semiconductor chip. Accordingly, the flow of cooling gas generated by the cooling fan interferes with the flow of cooling gas generated by the semiconductor chip cooling fan, thereby causing turbulence in the cooling gas and thus inefficient cooling.

The turbulence in the flow of cooling gas within the Housing is used to cause stagnation or accumulation the cooling gas, with the result that heat dissipation of the inside of the case, the unit and the circuit board prevents the cooling of other electroni worsened or damaged.

In addition meets the described cooling device, which placed on a heat radiating rib block Blower motor includes, on a problem that the entire Struk as well as the semiconductor chip and the cooling device Meidbar has a high altitude and thus a large space which makes it difficult to resize an appara to reduce what such a semiconductor chip beinhal tet. The current design or layout of personal computers and workstations occupy a smaller spacing Printed circuit boards on, d. H. a higher density of printed circuit boards in the case, to the overall dimensions or overall to reduce dimensions. The described cooling arrangement, which placed one on the heat radiating rib block Blower motor used, undesirably occupies a space a, which otherwise record two or three circuit boards could. As a consequence, the described half lead allows terchipkühleinrichtung not a dense and efficient Mon days or arrangement of printed circuit boards, which makes it difficult is to reduce the overall dimensions of the apparatus.

The object of the invention is to provide a cooling device for a electronic device, for example, a semiconductor chip provide, which both in height and in volume is small, suck the cooling gas in any desired direction or suck in and out or can eject and a cooling Gas effectively and thus the electronic device can cool efficiently, and in particular a device for  Cooling to provide an electronic device, the is improved so that it turbulence or stagnation in the flow or flow of the cooling gas to the electronic Preventing setup around while everyone unwanted Effect of cooling other electronic devices mini is placed, which are arranged in the same housing.

Cooling device for electronic parts according to a first Aspect of the invention

According to a first aspect of the invention is a Kühleinrich provided for cooling an electronic part, in which a heat radiating fin block or assembly defines a refrigerant gas flow passage which communicates with it Cooling gas allowed, in the form of a laminar flow or River to flow or flow and in the case of a miniature motor arranged with a fan in the flow passage is to direct a flow of cooling gas along the stream passage in any desired direction.

Such a cooling device may typically include: a base with a surface or surface, which in Kon clock with a heat radiation surface of the electronic Partially kept in contact; at least one Wärmeabstrah lunging device which opposes the surface of the base set to the area contacting the electronic part, wherein the heat radiating means comprises a passage for defines a cooling gas; and at least a miniature motor, which is arranged in the flow passage and a Rotor shaft which extends in the direction of the flow passage extends and to which a fan is mounted.

The heat radiating device may be a rib or a cooling rib which is provided on the base and the Strö defined passage of passage, and further a lid, which is arranged above or at the upper end of the rib to Close the open top of the flow passage  or to obscure.

The flow defined in the heat radiating device Passage can be open to the outside.

The heat radiating device and the base may be integral be formed with each other or molded or poured, so that they have a through hole formed therein and the Define flow passage.

The miniature motor with the blower can be fixed to the base or be attached and arranged in the flow passage his.

If the cooling device has the lid, the minia turmotor with the fan to be fixed to the lid to be disposed within the flow passage when the Lid is arranged to the open upper end of Strö close passage.

Alternatively, the miniature motor with the fan on the rib fixed to be disposed within the flow passage or to be positioned.

The cooling device may be constructed such that the Cooling passage comprises a single flow channel, which winds over the entire surface or surface of the base or extends and is opposite to a pair or diagonal corners of the base opens, the engine with the fan near at least one of the openings of the fan single flow channel is arranged.

The cooling device may further comprise an opening, which in the base is essentially at the center of the base is formed to make a passage for sucking or leaking or to provide expulsion of the cooling gas.  

The flow passage can be a variety of parallel Include flow channels, which extend from one to the others of a pair of opposite sides of the base extend, wherein the engine with the fan at least be arranged one end of each of the flow channels can.

In the cooling device for an electronic part according to the The first aspect is thus a heat radiating fin or ribs formed to a flow passage for the Defined cooling gas or cooling gas and one with a fan provided motor is disposed in the flow passage to Forcibly cooling gas along the flow passage to sow and emit. The cooling gas is thus forced along and through the flow passage directly through the effect or the operation of the cooling fan in a desired Rich tion to flow, with a gentle or smooth te or continuous laminar flow is formed, which the effectively cools the entire semiconductor chip. Consequently, a effective forced cooling or forced cooling performed be without the requirement of a cooling fan, which above or at the top of the heat Radiator rib or ribs is mounted so that the total height as well as the volume of the entire structure including of the electronic part and the cooling device significantly or significantly reduced. A specific high Cooling effect can be achieved when the cooling gas flow passage to the exterior is open.

In the cooling device for an electronic part according to the first aspect, the cooling gas is forced along and through to flow a flow passage, which is defined by a rib or ribs, so that a Forced cooling or forced cooling is caused. The Directions of sucking and discharging from the cooling gas can therefore freely set or elected, by suitably selecting the directions in which the heat dissipates  radiant rib or ribs is directed or are. It is therefore possible to construct the cooling device in such a way that sucked the cooling gas in any desired direction or is omitted or is, causing the arrangement to adapted to be cooled electronic part around, namely by using a rib or ribs containing the cooling gas flow passage defines which open ends to suck or ejection, which in the desired directions are aligned.

In other words, the inventors have a cooling arrangement worked, in which a cooling gas passage is formed by heat radiating fins or cooling fins to with Adjust the flow direction of the cooling gas, creating a efficient cooling with a reduced cooling gas flow rate is allowed.

Cooling device for an electronic part according to a two th aspect of the invention

According to the second aspect of the present invention a device for cooling an electronic part: a first heat radiator, which is adjacent to a heat radiating surface or surface of an electronic Is arranged part and a cooling gas flow passage or Flow passage for a first cooling flow formed therein has, at least one miniature fan, which in the Strö mungsdurchgang is arranged to generate a flow of Cooling gas from one end towards the other end of the Strömungsdurchganges, and a second heat radiator, which opposes on the side of the first heat radiator set to the electronic part is provided and grooves or passage grooves, which is substantially senk right or orthogonal on or to the flow passage are arranged, wherein the passage grooves of the second Wär meabstrahlers in the direction of a second flow or Flow of cooling gas are oriented or aligned.  

The flow passage in the first heat radiator comprises preferably a plurality of parallel linear tubular Channels that move from one to the other of a paa res from opposite sides of the heat radiating void surface or surface, and wherein at least one Mi Niaturgebläse at least one end of each of the cooling channels is arranged.

It is also preferred that the passage grooves or grooves in the second heat radiator have ends which at a downstream portion or region of the second Flow of cooling gas are arranged, with an opening in the lower part or side of at least one of the grooves is formed adjacent to the end to the Strö tion passage in the first heat radiator to open.

The arrangement may preferably be such that the flow passage has end openings, which in places, be neighbor to one and the other of a pair of opposite Open set sides of a heat radiating surface and be such or wavy or winden that they have a Pass through surface or pass by her, which ge velvet surface of the heat radiating surface of the electroni corresponding part.

In the cooling device for an electronic part according to the second aspect is at least one microblower in an unge covered or uncovered tubular cooling gas flow Passage arranged to a flow of cooling gas along and directly through the flow passage. Dement speaking, the cooling gas can smoothly or steadily through the cooling Gas flow passage to flow or flow, in shape a laminar flow, allowing efficient cooling of the electronic device, eg. B. a semiconductor chip he is enough.

Since the passage grooves or grooves in the second heat diss  radiator in a direction of external flow the cooling gas are aligned or oriented, d. H. the second direction, becomes a significant or noticeable Cooling effect also by this external or second flow of Cooling gas achieved. The tubular in the first Wärmeabstrah The formed flow passage and the flow channels in the second heat radiator, which through the grooves or Passage grooves are provided are ge from each other separates and perpendicular to each other.

The flow of the cooling gas, which through the micro fan of the Cooling device is generated, and the external flow of the Cooling gases do not inferieren thus, namely what the cooling of the cooled by the cooling device electro relates to the niche part. The cooling effect, which inherent achieved by the first heat radiator or includes and that of the second heat radiator are in others Words come together or put together or superimposed without deteriorating from each other.

The flow of cooling gas generated by the microblower and the external or second flow of the cooling gas go into each other, and immediately downstream of the Outlet opening of the flow passage in the first heat radiator. This can be a slight change in the rich tions of these flows of the cooling gas in a region or Create area where they meet, however it does not generate any turbulence or stagnation which generates can be, if these two separate Strömun conditions of cooling gases opposite or aligned tet are. Thus, merging or merging creates do not add significantly to two separate flows Partial effects for the cooling performance or efficiency.

The inventors have thus found that effective cooling can be performed when the miniature fan of the cooling device generates a flow of cooling gas, which the  Direction of the flow of the gas follows, which by the Ge blower is generated. In particular, the inventors have found that the cooling efficiency is worse when the direction of the Flow of the cooling gas, which through the miniature fan of the Cooling device is generated, opposite to the direction the flow of the cooling gas is through which the housing attached or added blower is generated. It was also found that if the same flow of cooling gas, like those generated by the housing blower, directly as the Cooling gas flow is used, which is independent on each Cooling device is used for an electronic part, the effect of providing such an independent cooling device is made worse or rendered ineffective. In This knowledge the inventors have a small or small dimensioned miniature motor and blower developed, which a cooling device for an electronic part according to the second aspect of the invention is provided.

Cooling device for an electronic part according to a third th aspect of the invention

According to the third aspect of the present invention a device for cooling an electronic part at least one cooling gas flow passage an opening adjacent to a side of the heat radiating surface or surface is arranged, wherein the flow passage has a cross-sectional area, which is minimal, but wide enough or big enough to make it to allow a cooling gas to flow therethrough or to flow SEN; at least one introduction passage or flow, wel is provided with an opening which adjacent to formed on another side of the heat radiating surface is, and has an area that is larger than that of Flow passage, wherein the insertion passage with the Flow passage is connected during its transverse cut progressively decreases or decreases to to pass smoothly or steadily into the flow transition  flow together; and at least a miniature blower, which in the vicinity of the opening of the insertion passage is so is ordered to force cooling gas from the opening of the one passage to the end of the flow passage to strö or flow.

The arrangement is preferably such that a part or the Entity of a wall, which opposite to the heat radiating surface and defines the insertion passage, is inclined or angled to progressively the heat radiating surface in a direction away from the Öff approaching the insertion passage, causing the cross cutting surface of the insertion passage progressively reduced becomes.

The arrangement may also be such that a part or the entirety of a pair of walls, which are perpendicular to the heat radiating surface stand and the insertion passage define, are inclined or bent to be progressive one another in a direction away from the opening of the introducer approaching, thereby increasing the cross sectional area of the Introductory passage progressively reduced or reduced becomes.

The angle of inclination of the wall or wall with respect to the Flow direction of the cooling gas is preferably in the range from 30 ° to 60 °.

The cooling device may further comprise at least one heat radiating member, which on the outer surface or Surface of the inclined wall is provided, which the Introductory passage defined, and opposite to the Face opposite or facing of the one lead passage, as well as on the outer surface of the wall, which defines the refrigerant gas flow passage, continuous Lich from the outer surface of the wall, which the introduction passage defined.  

The cooling gas flow passage may also be of the type which is the same cher a variety of flow or flow channels for the Includes cooling gas, and the insertion passage can also a lot number of insertion channels, which with the respective or corresponding flow channels are connected, each the introduction channels progressively in its cross-sectional area over part or all of its length in the direction to the connection to the associated or the corresponding one Flow channel decreases or decreases, the miniature Blower for each of the insertion channels near the opening the insertion channel is arranged.

The refrigerant gas flow passage may be of the type which comprises a plurality of flow channels for the cooling gas, and the insertion passage can also at least one introduction Channel, which is progressive in its cross-section area over part or all of its length in Direction of the flow channels decreases and the cooling gas Kollek tiv to the plurality of flow channels, or over There, the miniature fan for each of these, at least an insertion channel is arranged.

At least the wall perpendicular to the heat radiating surface, which defines the cooling gas passage, preferably has a corrugation or ondulation of a desired configuration.

Alternatively, at least the wall is perpendicular to the heat jet surface, which defines the cooling gas passage, a ge corrugated or ribbed louvre or louver rib structure or cooling rib structure.

The cooling device for an electronic part or Bauele ment according to a third aspect of the present invention offers the following advantages. Since the cooling gas around the elec tron part through an opening of a predetermined area is sucked through the operation of a miniature blower, it is possible to obtain a flow of the cooling gas whose Strö  mation rate is equivalent to that of conventional refrigerators obligations. The cooling gas then flows or flows through a Öff tion, whose cross-sectional area progressively decreases or klei ner, so that the flow rate of the gas he is increased to the rate of heat transfer or heat transfer coefficients of a unit area of the passage to increase defining wall, whereby the heat transfer fi ciency is increased and, accordingly, the rate of heat sipation. Therefore, a cooling effect can be obtained which at least equivalent to that of conventional refrigeration equipment gene, despite reduced heat dissipation area because of the reduced or reduced height of Wall, which defines the flow passage. Apparently he it allows the smaller cross-sectional area of the flow through ganges to reduce the overall volume of the cooling device, causing a reduction in the volume of the entire Arrangement including the electronic part and the Cooling device contributes.

The reduction in volume provides a new space for the Installation of additional heat radiating ribs or Cooling fins, resulting in a greater cooling efficiency or performance of the cooling device with a given volume or Size for an electronic part offers.

According to the invention, a structure is proposed which the Height and width of the cooling gas flow passage in the cooling minimized device, and thereby the size or the dimensions reduce the cooling device without simultaneously a significant deterioration of the cooling capacity or ability to effect.

Cooling device for an electronic part according to a four th aspect of the invention

According to the fourth aspect of the present invention is a Device for cooling an electronic part bereitge  represents, where the device at the heat radiating Surface or surface of the electronic part is mounted and provided with a cooling gas flow passage, wherein the improvement is that the cooling gas flow passage comprises a first section, which at its one end is open in the side of the cooling device, which corresponds to one side of the heat radiating surface, wherein the first section comprises a miniature blower for Cause a cooling gas through the first section flows; a second section, which at its one end opened in another side of the cooling device, which another side of the heat radiating surface corresponds, wherein the second section is a Querschnittsflä which is smaller than that of the first Ab section; and a third section, which is the other one End of the first section with the other end of the second Section connects or bridges or among each other connects, wherein the lower surface or bottom surface of the cooling gas flow passage adjacent to the heat radiating Surface is inclined so that the cross-sectional area of the third section from the first section in the direction of second section progressively decreases or decreases.

The cooling gas flow passage preferably includes a plurality flow channels, each having an Ab cut a large cross-sectional area according to the first section, a section of a small cross-section area according to the second section, and a Zwi section or intermediate section between the Sections of a large and a small cross-sectional area che.

The arrangement may preferably be such that the second Section of the cooling gas passage comprises a plurality of Flow channels and the first section comprises at least a flow channel from or through which the cooling gas collectively into a plurality of flow channels of the second  Section is introduced, each of the flow channels of the second section at least a miniature fan indicates that causing cooling gas thereby in the second Section flows.

The angle of inclination of the lower part or bottom of the cooling gas flow passage of the third section with respect to Flow direction of the cooling gas is preferably between 30 ° and 60 °.

It is also preferred that the cross-sectional area of the second Portion of the cooling gas flow passage between 0.25 to 0.75 times larger than the cross-sectional area of the first Section of the cooling gas flow passage.

At least the wall perpendicular to the heat or the heat loin surface defining the cooling gas flow passage, preferably has a curl or ondulation of any desired Configuration.

The arrangement may also be such that at least the Wall which is perpendicular to the heat radiating surface and the cooling gas flow passage defines a corrugated one or ribbed louvre or louver rib structure has.

In the cooling device for an electronic part according to a fourth aspect of the invention penetrates through Miniature fan generated flow of the cooling gas through a Flow passage whose cross-sectional area is progressive decreases, so that the speed of the flowing air or Fluids is increased accordingly. The progressive reduction in the cross-sectional area is achieved by tilting or Angling the bottom wall of the flow passage, d. H. the Wall closest to the heat radiating surface of the electronic part is. Accordingly, the Geschwin temperature of the cooling gas highest in the boundary layer or  layer, which is the bottom wall of the flow passage touches or rests on this, where the tempera is most critical. Accordingly, the heat metransferkoeffizient of the surface or surface of bottom wall is increased to the flowing cooling gas, so that the Heat or heat, which by the electronic part as a heat source is generated, effectively by the cooling gas carried away or can be carried out, resulting in a Ver improvement in cooling efficiency.

It is therefore possible, a cooling device for an electroni nice part to receive, which is an electronic part, z. B. a semiconductor chip can cool efficiently without an increase to condition or require the volume of the cooling device gene.

The invention enables a high heat transfer efficiency of the heat radiator to the cooling gas by using a spe specific structure of the flow passage.

Brief description of the drawings

Fig. 1 is an elevational perspective view illustrating a conventional electronic parts cooling apparatus according to the prior art;

Figs. 2 to 7 are perspective elevational views, which each represent cooling means for electronic parts according to embodiments of the present invention;

Fig. 8 is a partially broken perspective view showing an electronic parts cooling device according to another embodiment of the present invention;

Figs. 9 to 11 are perspective views each showing cooling means for electronic parts according to further embodiments of the present invention;

Figures 12 to 15 are partly broken perspective views, each showing cooling means for electronic parts according to further embodiments of the present invention;

Fig. 16 is a schematic sectional view taken along the line XVI-XVI of Fig. 15;

Fig. 17A is a front perspective view illustrating an electronic parts cooling device according to another embodiment of the present invention;

Fig. 17B is a rear perspective view illustrating the cooling device shown in Fig. 17A;

Fig. 18 is a perspective view illustrating the cooling device shown in Figs. 17A and 17B, which is mounted on a semiconductor chip;

Fig. 19A is a front perspective view illustrating an electronic parts cooling device according to another embodiment of the present invention;

Fig. 19B is a rear perspective view of the cooling device shown in Fig. 19A;

Fig. 19C is a schematic sectional view taken along the line XIXC-XIXC of Fig. 19A;

Fig. 20A is a front perspective view illustrating an electronic parts cooling device according to another embodiment of the present invention;

Fig. 20B is a rear perspective view illustrating the cooling device shown in Fig. 20A;

Fig. 20C is a perspective view illustrating the cooling device shown in Figs. 20A and 20B, which is mounted on a semiconductor chip;

Fig. 20D is a plan view of the cooling device shown in Fig. 20C;

Fig. 21A is a front perspective view showing an electronic parts cooling device according to another embodiment of the present invention;

Fig. 21B is a rear perspective view illustrating the cooling device shown in Fig. 21A;

Fig. 22A is a front perspective view illustrating an electronic parts cooling device according to another embodiment of the present invention;

Fig. 22B is a rear perspective view illustrating the cooling device shown in Fig. 22A;

Fig. 23A is a front perspective view showing an electronic parts cooling device according to another embodiment of the present invention;

Fig. 23B is a rear perspective view illustrating the cooling device shown in Fig. 23A;

Fig. 24A shows an example of changes of walls of a cooling device;

Fig. 24B illustrates another example of changes of walls;

Fig. 25A is a front perspective view illustrating an electronic parts cooling device according to another embodiment of the present invention;

Fig. 25B is a rear perspective view illustrating the cooling device shown in Fig. 25A;

Fig. 25C is a partially broken perspective view illustrating the cooling device shown in Figs. 25A and 25B;

Fig. 26 is a schematic sectional view taken along the line IIXVI-IIXVI of Fig. 25A;

Fig. 27 illustrates the cooling device shown in Figs. 25A to 25C mounted on a semiconductor chip;

Figs. 28 to 30 are diagrams showing the heat transfer characteristics of the cooling device shown in Figs. 25A to 25C;

Fig. 31A is a front perspective view showing an electronic parts cooling device according to another embodiment of the present invention;

Fig. 31B is a rear perspective view illustrating the cooling device shown in Fig. 31A;

Fig. 31C is a schematic sectional view taken along the line IIIXIC-IIIXIC of Fig. 31A;

Fig. 31D is a schematic sectional view taken along the line IIIXID-IIIXID of Fig. 31A;

Fig. 32 is a perspective view illustrating an electronic parts cooling device according to another embodiment of the present invention;

Fig. 33 is a perspective view illustrating an electronic parts cooling device according to another embodiment of the present invention; and

FIG. 34 is a schematic sectional view taken along the line IIIXIV-IIIXIV of FIG. 33. FIG .

Description of the Preferred Embodiments First embodiment

A description will be given of a cooling device 100 according to a first embodiment shown in FIG. 2.

The cooling / extracting device 100 of the first embodiment comprises a radiating fin block 110 , a fin block cover 120, and motors 130 and 131 each equipped with a fan.

The rib block 110 is recessed around rib walls back and forth with grooves or grooves to form a zigzag flow passage 113 through which a cooling gas flows, with openings 111 and 112 at two ends of the block 110 . This fin block 110 is formed by molding aluminum, copper, a copper-tungsten alloy, aluminum nitrite, or the like.

The lid 120 is a cover or a cover for closing the opened upper end of the rib block 110 . This cover 120 is arranged to close the rib block 110 so as to close the top of the through-grooved portion and to form the cooling gas flow passage 113 which is opened only at the openings 111 and 112 serving as intake and suction, respectively - And outlet openings are used. In this embodiment, this cover 120 is a printed circuit board or Schaltbau or Flachbau group, which is provided with a wiring or Beschaltungsmu art for the below mentioned motors, each of which is equipped with a blower.

The blower motors 130 and 131 are fixedly mounted at predetermined positions on the lid 120 , so that they can be disposed in the vicinity of the opening 111 and 112 , respectively, within the flow passage 113 , when the rib block 110 through the Lid 120 is closed. A miniature stepping motor, which is dimensioned to be disposed within the fin walls, or a brushless DC motor is appro net for the motors 130 and 131 for driving the blower. In this embodiment, a miniature stepper motor is used. The motors 130 and 131 and / or fans may be of the type which is provided on the lid 120 (or on the walls of the passage 113 ) according to a micromachining technique.

The rib block 110 and the lid 120 provided with the motors 130 and 131 manufactured as described above are mounted on the back surface of the semiconductor chip 900 in the order shown in FIG. Arrangement, whereby a cooling mechanism for the semiconductor chip 900 is gebil det. Specifically, the motor 130 is rotated in a direction that sucks a gas into the passage 113 while the motor 131 is rotated in a direction that discharges the gas therefrom. Accordingly, a flow of a cooling gas within the passage 113 in a direction from the opening 111 , which serves as a suction opening, to the opening 112 , which serves as an outlet opening, is generated. The gas flow absorbs heat from the rib walls as it passes through the passage 113 , so that the semicon terchip 900 can be cooled.

According to the cooling device 100 of the first embodiment, which is constructed and operated as described above, the rib block 110 has dimensions, e.g. Height and volume, which are similar to those of typical fin blocks, and yet a flow of cooling gas can be generated by the fan motors disposed between the fin walls, so that a semiconductor chip can be force-cooled. That is, the cooling device of this embodiment does not require a blower 920 while having a cooling capability comparable to a cooling mechanism according to the prior art shown in FIG. 1.

Table 1 shows a specific example of the cooling device the first embodiment.

Cooling device: basic dimensions 40 mm × 40 mm Cooling device: height 15 mm Flow passage: width 7 mm Flow passage: depth 12 mm Blower: diameter 6 mm Engine: diameter 4 mm Engine: length over all or total length 30 mm

Second embodiment

With reference to Fig. 3, a description will now be given of a second embodiment of a cooling device for elec tronic parts according to the present invention.

A cooling device 200 of the second embodiment differs from that of the first embodiment in the construction of the cooling gas flow passage formed in a radiating fin block 201 . The Kühlleinrich device 100 of the first embodiment comprises a single flow passage 113 , which is formed so as to zigzag in the entire block. The Kühlein device 200 of the second embodiment, in contrast, two flow or flow passages 206 and 207 , each of which is provided with independent suction and inlet and Auslaßöff openings. The fin block 201 of the cooling device 200 according to the second embodiment has openings 202 , 203 , 204, and 205 . The flow passage 206 is formed with the openings 202 and 203 , which are used as two ends, while the other passage 207 is formed with the openings 204 and 205 , which used as two ends who the. Blower motors 209 and 210 are fixedly mounted on a rib block cover 208 so that they are disposed in the vicinity of the opening 202 and 204 , respectively, when the lid 208 is arranged to close the rib block 201 .

The rib block 201 and the lid 208 , which are constructed as described above, are mounted on a semiconductor chip, thereby forming a cooling mechanism for the semiconductor chip. Specifically, both motors 209 and 210 are rotated in a direction that sucks a gas into each of the passages 206 and 207 , respectively. Accordingly, a flow of a cooling gas is formed within each of the passages 206 and 207 in a direction from the openings 202 and 204 , which serve as suction and inlet openings, to the outlets 203 and 205 , which serve as outlet openings. The gas flow absorbs heat from the fin walls as it passes through the passages 206 and 207 , so that the semiconductor chip can be cooled.

The cooling device 200 of the second embodiment performs the cooling operation by means of two independent flow passages, each of which is provided with a suction and a Auslaßöff, whereby the cooling efficiency or performance is increased to a higher degree compared to a device which the Cooling performed by a single pass.

In the second embodiment, both motors 209 and 210 are rotated in a direction which sucks a gas into the passages. However, they may also be rotated in a direction which discharges a gas therefrom, in which case the openings 203 and 205 are used as suction openings, while the openings 202 and 204 serve as outlet openings. With the cooling device 200 constructed as described above, the openings 203 and 205 located near the central portion of the semiconductor chip serve as suction openings, and accordingly, a low-temperature gas just drawn from the exterior flows into the central one Section of the semiconductor chip. It is thus desirable that the motors are rotated in a direction which generates the flow of a cooling gas in such a direction as to cool a semiconductor chip whose middle portion emits a larger amount of heat.

Table 2 shows a specific example of the cooling device the second embodiment.

Cooling device: basic dimensions 40 mm × 40 mm Cooling device: height 15 mm Flow passage: width 5 mm Flow passage: depth 12 mm Blower: diameter 4.5 mm Engine: diameter 4 mm Engine: total length 30 mm

Third embodiment

A third embodiment of a cooling device for electronic parts according to the present invention will now be explained with reference to FIG .

Fig. 4 is a perspective view showing a constructive Kon tion of a cooling device 300 according to the third From guide die. The cooling device 300 of the third embodiment is provided with a larger number of flow passages than the cooling device 200 of the second embodiment. The cooling device 300 includes fin walls to form five passages parallel to one another starting from a lateral surface of a radiating fin block 301 . Motors 330 and 331 are fixedly mounted on a fin block cover 320, so that they are net respectively in the vicinity of the two ends of each passage angeord when the lid 320 is arranged to block the ribs to close 310th Although the motors 330 and 331 shown in FIG. 4 are fixed to the lid 320 as those shown in the first and second embodiments, they are shown as being disposed in the rib block 310 closed by the lid 320 . and for better understanding of the presentation.

The motors 330 are rotated in a direction which sucks a gas into the passages while the motors 331 are rotated in a direction which discharges the gas therefrom. The flow of a cooling gas is thus generated within each of the passages, so that heat from the Rippenwän is absorbed, whereby a semiconductor chip is cooled.

The rib block 310 of the cooling device 300 of the third embodiment is further divided into even smaller areas than the counterpart of the cooling device 200 of the second embodiment. Thus, the cooling operation by the device 300 can be performed by the smaller areas of the fin block 310 by a gas flowing at a higher speed. As a result, it is possible to perform a sufficient cooling operation even for a semiconductor chip which emits a significantly large amount of heat.

In the third embodiment, the blower motors provided for the suction and discharge ports, ie, two motors 330 and 331 , are provided for each passage. However, any one of these motors may be sufficient in accordance with the amount of heat emitted from the semiconductor chip used.

Fourth embodiment

A fourth embodiment of a cooling device for elec tronic parts according to the present invention will now be described with reference to FIG. 5.

A cooling device 400 of the fourth embodiment is similar to the counterpart of the first embodiment in the design of the rib walls of a radiation rib block 410 and in the mounting positions of blower motors 430 and 431 on a rib block cover 420 . However, the fourth embodiment differs from the first embodiment in the fact that an opening 421 is disposed at the central portion 420 . In the fourth embodiment, both motors 430 and 431 are rotated in a direction which sucks a gas into the passage. Accordingly flows gesaug tes through the openings 411 and 412 of cooling gas within the passage of a fin block 410 to absorb the heat from the fin walls, and then to be discharged through the opening 421, which is disposed on the upper portion of the cooling device 400th

In the cooling device 400 of the fourth embodiment, a gas which has absorbed heat or absorbed heat may be omitted with respect to the upper portion of a semiconductor chip. It is thus particularly effective when a gas that has absorbed heat can not be discharged from a side surface of a device at a high temperature because another semiconductor chip is mounted around the chip disposed on the device.

Although in the fourth embodiment, both motors 430 and 431 are rotated in a direction which sucks a gas into the passage, they can be rotated in a direction who discharges the gas therefrom. In this case, the opening 421 , which is disposed opposite to the central portion of the semiconductor chip, serves as a suction opening, and thus a refrigerant gas having a low temperature, which has just been sucked from the outside through the suction opening, flows into the central portion of the semiconductor chip. It is thus desirable that the motors are rotated in such a direction as to cool a semiconductor chip whose central portion emit a larger amount of heat.

Fifth embodiment

A description will now be given with reference to FIG. 6 of a fifth embodiment of a cooling device for elec tronic parts according to the present invention.

A cooling device 500 of the fifth embodiment is an example of modifications obtained by the combination of the first to fourth embodiments. An opening 521 is block lid for a central portion of a rib provided 520, and openings are each seen before for four lateral faces of a radiation fin block 510th When the lid 520 is arranged to close the rip pen block 510 , motors 530 , 531 , 532 and 533 , which are fixedly mounted on the lid 520 , respectively disposed in the vicinity of the four openings on the side surfaces of the rib block 510 . Although the motors 530 , 531 , 532, and 533 shown in FIG. 6 and the counterparts shown in the third embodiment are fixed to the lid 520, they are disposed in the fin block 510 , which is closed by the lid 520. is hidden, for the sake of clarity of presentation.

The motors 530 , 531 , 532 and 533 are rotated in a direction which sucks a gas into the flow passage so that the flow of a cooling gas can be generated and flow from the openings adjacent to the motors to the opening 521 , which is provided at the center of the device Einrich. The gas flow absorbs heat from the fin walls as it passes through the passage so that a semiconductor chip can be cooled.

As clearly seen from the foregoing description, can the number, configuration and position of Kühlgasströ mungsdurchganges and the openings suitable as desired be adjusted or in accordance with that of the applied semiconductor chip emitted heat value or -men ge, the conditions of the parts around the chip, and indeed mounted on the circuit board, the operating conditions of the rip penblocks and the lid and the like.

Sixth embodiment

An explanation of a sixth embodiment of a cooling device for electronic parts according to the present invention will now be given with reference to FIG .

A cooling device 600 of the sixth embodiment differs from the counterparts of the first to fifth embodiments in that blower motors 630 and 631 are fixedly secured to a radiation fin block 610 . The rib block 610 , as well as the counterpart of the first embodiment form, is a press molding formed from ceramics, alumina, glass, an epoxy resin, or the like, and includes a cooling gas flow passage formed therein. However, unlike the rib block of the first embodiment, it includes insulating portions 611 and 612 which can be used for fixing the motor 630 and 631 thereto, respectively. The isolie-generating portions 611 and 612 may be formed or formed from the same materi al as the rib walls, as long as they are processed to attach the engines to it or can be refined or treated. Each of the sections 611 and 612 is preferably a printed circuit board on which a wiring arrangement for driving the motors can be designed.

A rib block cover 620 is used to close or cover the opened upper end of the rib block 610 . This cover 620 is arranged to close the fin block 610 to form a cooling mechanism for a semiconducting terchip. The cooling device 600 of the sixth embodiment operates in a similar manner to that of the first embodiment.

As can be seen from the foregoing description, can the blower motors both on the lid, as well as on the Rib block are mounted, as long as this is the shaping or casting method and the molding or casting material allow.

Seventh embodiment

A seventh embodiment of an electronic component cooling device according to the present invention will be explained with reference to FIG .

A cooling device 700 of the seventh embodiment is obtained by integrally molding an exhaust block and a fin block cover. The cooling device 700 is constructed such that blower motors 730 , 731 , 732 , 733 and 734 are installed in a cooling gas flow passage formed in a heat radiator 710 . The steel 710 is a mold formed of aluminum, copper, a copper-tungsten alloy, aluminum nitrite or the like, and includes five cylindrical through-holes, which lead to Kühlgasströ flow passage or to form these. The radiator or cooler 710 also includes insulating sections or Isola tion sections, which are processed or refined or ver works to the respective engines to fasten it conditions.

As stated above, the cooling device of the present invention by superimposing a ribs block covers are formed on a radiation rib block, so that a cooling gas flow passage is ensured. Alternatively, if the processing method he allows the cooling device in one piece in such a way be molded or that a passage in the rip penblock and the lid is formed.

Eighth embodiment

A cooling device 300 a for electronic parts according to an eighth embodiment of the present invention is constructed in a manner similar to the counterpart of the third embodiment shown in Fig. 4, with the exception that it has no rib block cover 320 .

In this embodiment, the flow passage is after open at the top, so that the cooling efficiency or performance to a higher degree is improved.

Ninth embodiment

An electronic parts refrigerator 500 a according to a ninth embodiment of the present invention is constructed in a manner similar to the counterpart of the fifth embodiment shown in FIG. 6 except that it has no fin block lid 520 .

In this embodiment, the flow passage is after open at the top, so that the cooling efficiency or performance to a higher degree is increased.

Tenth embodiment

An electronic parts cooling device 600 a according to a tenth embodiment of the present invention is constructed in a manner similar to that of the sixth embodiment shown in FIG. 7, except that it does not have a rib block cover 620 .

In this embodiment, the flow passage is after open at the top, so that the cooling efficiency to a higher degree is improved.

Eleventh Embodiment

A cooling assembly 10 of an eleventh embodiment which is shown in Fig. 12, comprises a first heat dissipator 20, micro fans or blowers or -fan or dense -ver 30 a- 30 e and 31 a-31 e, and a second Heat eliminator 40 .

An explanation of the construction of the respective components will be given.

The first heat radiator 20 includes a bottom surface held in contact with a semiconductor chip, and openings 22 a and 22 e are formed from one side of the bottom surface, while openings 23 a and 23 e are formed in the opposite side thereof are formed. Five tubular passages 21 a- 21 e, through which flows a cooling gas, are provided in the first radiator 20 so as to linearly pass through the openings 22 a- 22 e to the openings 23 a- 23 e, which lie opposite each other. This radiator 20 is formed by molding aluminum, copper, a copper-tungsten alloy, aluminum nitrite or the like.

The micro fan 30 a- 30 e and 31 a-31 e, each of which is formed by attaching or fixing a miniatu linearized blower to a miniaturized motor, are each in the vicinity of the openings 22 a- 22 e and 23 e a- 23 arranged in the respective passages 21 a- 21 e. The Mikroge blower 30 a- 30 e and 31 a-31 e are mounted on mount portions, which partially form the walls of the heat radiator and are processed or refined to isolate the motors, which can be mounted on it, thus. The micro fan 30 a- 30 e are rotated in a direction 21 a- 21 e omits a cooling gas to the exterior of the first radiator 20 from the passages in order to generate the flow and flow Wb of a cooling gas. The micro fan 31 a- 31 e, on the other hand rotated in one direction to a cooling gas in the passages 21 a- 21 e of the exterior of a first radiator 20 to suck and take in order to create a flow or a flow Wa of a cooling gas ,

The second heat spreader 40 is constructed such that six ribs or walls -wandungen 42 a- 42 f, and are installed perpendicular to the upper surface of said first radiator 20 and arranged a- five recessed grooves or through-grooves 41 41 e form. This radiator 40 is also formed by molding or molding or casting aluminum, copper, a copper-tungsten alloy, aluminum nitrite or the like.

An assembling method of the cooling device 10 will now be explained with reference to FIG .

Fig. 13 illustrates a mounting method of the cooling device 10 shown in Fig. 12 and also shows a semiconductor chip 93 comprising the cooling device 10 mounted thereon mounted on a printed circuit board 92 within the main unit of a personal computer 90 as an example ,

A fan or blower 91 for cooling the main unit of the personal computer 90 is provided to the computer 90 to draw a gas from the exterior, and thus gene to erzeu Wc of a cooling gas within the computer 90, the flow or flux. The semiconductor chip 93 with the fixed thereon A device 10 is mounted on the plate 92 within the computer 90, so that the grooves 41 a-41 e, which are formed within the second radiator 40 of the device 10, arranged parallel to the direction of flow or placed Wc are.

The semiconductor chip 93 is installed on the plate 92 as described above to allow the flow Wc generated by the outside to pass through the grooves 41 a- 41 e in the second heat radiator 40 . This construction prevents the occurrence of turbulence in the gas flow Wc, thereby achieving efficient heat radiation by the second radiator 40 and, accordingly, efficient cooling of the semiconductor chip.

In the first heat radiator 20 on the other hand, the flows Wa and Wb in the passages respectively by the micro-blower 30 a- 30 e and 31 a-31 e formed, thereby enabling an efficient heat radiation or -abführung of the walls, which the passages 21 a- Surround 21 e, and thus effi cient cooling of the semiconductor chip can be achieved.

In the embodiment shown in the eleventh embodiment Kühleinrich tung 10 are the five passages 21 a- 21 e of the first heat radiator 20 linearly from one side to the most opposite-hand side of the lower surface of the first radiator 20 gebil det, but this construction is not exclusive.

An example of variations of the passages of the first heat radiator is shown in FIG .

A first heat radiator 60 shown in Fig. 14 includes a cooling gas flow passage 61 formed to zigzag from a corner to the opposite corner, which are arranged diagonally with each other. Microblowers 64 and 65 are disposed near the openings 62 and 63 at the respective corners. As long as the micro-blowers 64 and 65 can perform a sufficient cooling operation, the first heat radiator can be constructed without causing problems. In such a case, only two micro-blowers are sufficient and it is thus possible to produce a cheap cooling device which can be easily assembled. Furthermore, only two openings, that is, the suction and exhaust port for the first heat radiator are provided, whereby an adverse influence is reduced, which acts on the flow generated by the external fan.

Twelfth embodiment

An explanation of a twelfth embodiment of a cooling device for electronic parts according to the present invention will now be given with reference to FIGS. 15 and 16. Fig. 15 is a perspective view showing a construction of a cooler 50 for elec tronic parts according to the twelfth embodiment. The cooling device 50 of the twelfth embodiment, as well as the counterpart of the eleventh embodiment comprises a first heat radiator 51 , microblowers 52 a to 52 e, microblowers (not shown), which are arranged on the opposite side to the microbulb 52 a- 52 e, and a second heat radiator 53 .

The above components are constructed in a similar manner to that of the eleventh embodiment. However, the cooling device 50 of this embodiment differs from the eleventh embodiment in that it has openings 54 a- 54 e between the first radiator and the second radiator 51 and the 53rd That is, the openings 54 a- 54 e are respectively provided in recessed grooves 55 a- 55 e of the second radiator 53 to communicate with a passage 56 a, which is arranged at the outermost end of the first heat radiator 51 , This device 50 is installed such that the passage 52 e of the first member 51 is disposed upstream of the gas flow generated from the exterior, and the openings 54 a- 54 e are located downstream thereof.

The cooling gas flow in the above-described con structed device 50 will now be explained with reference to FIG. 16.

Fig. 16 is a sectional view taken along the line XVI-XVI of Fig. 15 and illustrates the gas flow in the gezeig th in Fig. 15 cooling device 50 is.

Generally, the gas flow Wc generated by the external blower absorbs heat from the fin walls while passing through the groove 55 a in the second radiator 53 , so that the temperature of the flow Wc is increased. This would normally change the direction of the flow Wc about halfway in the groove 55 a in a downward movement in the direction shown by the arrow Wd in Fig. 16 with dashed lines Rich. The thus obtained upwardly moving flow Wd would not pass through the outlet end of the groove 55 a.

As described above, the cooling device 50 depending but with the opening 54 a provided to connect the groove 55 a and the passage 56 a with each other, in which the Strö determination Wa and Wb pass, as shown in Fig. 15. The Strö rules Wa and Wb therefore reduce the density of the flow Wc, which passes by the currents Wa and Wb through the opening 54 a, so that the possible upward-moving stream Wd is moved downwards, which is thus indicated by the arrow We in Fig. 16 shown moved.

Accordingly, the cooling gas flows through the groove 55 a to the outside of the device, whereby an efficient cooling process is performed.

The cooling device of the present invention was by means of of the eleventh and twelfth embodiments. however these are just representations and different changes  can be carried out within the invention.

For example, although in the eleventh and twelfth out five passes linearly in the first heat dissipation radiators are formed, not exclusive and through courses can be more or less than five, eg B. four or six, to be arranged properly, like him wishes to use a simple gas flow in the passages too improve or reach.

Although in previous embodiments a micro fan for each of the suction and discharge ports of each passage Seen, it can be provided for one of these openings become. Alternatively, a single micro fan at a be arranged in another position, for. B. in the middle of Flow passage. Three or more microblowers can also be arranged. It can accordingly a geeigne te number of microblowers are provided according to the Passages and blowing capacity of microblowers.

The first and second heat radiators of the cooling device According to a desired Ver be molded or molded or press-molded. each The following example procedures are acceptable: both Radiators are molded in one piece or press-molded; the first and second radiators are separately shaped and subsequently joined together; and a radiating fin block and a rib block lid are joined together to form the first To form radiator.

Thirteenth Embodiment

An electronic parts refrigerator 10 a according to a thirteenth embodiment shown in FIGS . 17A and 17B includes a refrigerant gas flow passage 11 and an introduction passage 15 . The gas flow passage 11 and the introduction passage 15 are respectively divided into five flow channels by four walls 12 a- 12 d and 13 a- 13 d. The channels of the flow passage 11 are respectively connected to the corresponding channels of the introduction passage 15 to form five cooling gas flow channels 18 a- 18 e. By an inclined portion 16 , through which the insertion passage 15 is connected to the flow passage 11 , the height of each of the channels 18 a- 18 e is gradually changed, so that the two passages 11 and 15 continuously connected to various heights can be. The inclination angle of the oblique or inclined portion 16 be wearing 45 °.

Miniature blower 17 a- 17 e are each provided in the vicinity of the Publ openings in the five channels 18 a- 18 e, and adjacent to the insertion passage 15th

As shown in FIG. 18, the cooling device 10 a constructed as described above is mounted on the back surface of a semiconductor chip 900 to form a cooling mechanism for the semiconductor chip.

In such a state, the blower 17 are rotated a- 17 e in a direction that gas in each of the channels 18 a-18 e from the outside sucks in order to generate the flow and the flow of a cooling gas within each channel. The flow thus generated increases its velocity at the inclined portion 16 because of its smaller cross-sectional area and absorbs heat from the wall surfaces as it passes through each channel of the flow passage 11 to be discharged.

In the cooling device 10 a, which as described above ben constructed and operated, the flow of a cooling gas, which was just created at the opening in the passage, adapted or suitable, by the reduced or reduced in cross section portion of the passage to to step. Thus, the height of the flow passage 11 can be made smaller while the device maintains the cooling efficiency, the construction of which contributes to the reduction in the volume of the entire cooling device.

Fourteenth embodiment

A description of an electronic parts cooling device according to a fourteenth embodiment of the present invention will now be given with reference to FIGS. 19A to 19C.

An electronic parts cooling device 10 b of this embodiment, as well as the counterpart of the thirteenth embodiment, includes a refrigerant gas flow passage 121 and an introduction passage 125 . The gas flow passage 121 is divided into six channels by five walls 122 a-122 e. This embodiment is characterized in that the insertion passage 125 is divided into only two channels 128 g and 128 h through the wall 122 c, which extends continuously from the Strö flow passage 121 . Two miniature blowers 127 a and 127 b are provided in the vicinity of the openings in the insertion passage 125 above the wall surface 122 c.

With the device 10 b constructed as described above, the fans 127 a and 127 b are rotated in a direction ge, which sucks gas in each of the channels 128 g and 128 h from the outside to witness the flow of a cooling gas in it. The flow thus generated increases their VELOCITY wind speed for the oblique or slanted portion 126 because of its or their smaller cross-sectional area and absorbs heat from the wall surfaces or surfaces, while a- through each of the channels 128 and 128 c 128 d 128 f of the Strö flow passage 121 passes smoothly and gently merged into the respective channels 128 g and 128 h, to then be omitted.

In this construction and loading described above, a volume decrease of the entire device 10 b may take place, as in the counterpart of the thirteenth embodiment. In addition, the introduction passage 125 can be constructed in a simplified manner and the number of miniature blowers can be reduced.

A portion 129 of the wall 122 c which is used to be divided into two flow channels the introduction passage 125, is not essential. The portion 129 can thus be eliminated to form a single channel within the Einführdurch passage 125 , in which the two fans 127 a and 127 b can be arranged. In this case, the flow of a cooling gas generated by the blowers 127 a and 127 b can be divided to pass through the six channels 128 a- 128 f of the flow passage 121 .

Fifteenth embodiment

A cooling device for electronic parts 10 c according to a fifteenth embodiment of the present invention will now be explained with reference to FIGS. 20A to 20D.

The cooling device 10 c, as well as the counterpart of the thirteenth embodiment shown in Fig. 17, comprises a cooling gas flow passage 134 and an insertion passage 135 , which are each divided into five flow channels 138 a- 138 e. Each channel is provided with a blower 137 .

The cooling device 10 c is constructed such that the Einführdurchgang 135 progressively in the width direction in cross section is reduced or throttled to also progressively verrin like the cross-sectional area of the channels, which then smoothly into the flow passage 134th be merged or united. Specifically, the transverse walls constituting the flow channels of the insertion passage 135 are inclined toward the center of predetermined positions to form inclined portions 136 a and 136 b. The entire channels of the insertion passage 135 are thus progressively reduced in the width direction Brei in cross section to be smoothly merged into the flow passage 134 . As well as the inclined portions 136 a and 136 b, the vertical walls which divide the introduction passage 135 in five Strömungskanä le, also inclined towards the center. The respec conditions channels are thus progressively reduced in cross-section in the width direction to gently or smoothly merged into the respective channels of the flow passage 134 who the, or to pass.

As shown in FIG. 20C, the cooling device 10 c constructed as described above is also mounted on the rear surface of the semiconductor chip 900 , thereby forming a cooling mechanism for the semiconductor chip. The fans 137 are rotated in a direction which sucks gas into the channels from the outside and to generate the flow of a cooling gas within each of the channels. The flow thus generated increases its velocity at the inclined portions 136 a and 136 b because of their smaller cross-sectional area and absorbs heat from the wall surfaces as it passes through the channels of the flow passage 134 , to then be exhausted.

With this design and operation as described above, a volume decrease of the device 10 Kühleinrich be achieved, since possible sections adjacent to both sides of the flow passage 134 can be eliminated. This is sufficiently effective, if it is desired that space be used as much as possible for flow passages and the like, on the limited mounting circuit board. In addition, as shown in Fig. 20D, the apparatus 10 c suitable for cooling a semiconductor chip with a wärmeemittieren the section 901 at the center thereof.

Sixteenth embodiment

An explanation of a cooling device 10 d for electronic parts according to a sixteenth embodiment of the present invention, there is now given with reference to FIGS. 21A and 21B.

The cooling device 10 d, as well as the counterpart of the fifteenth embodiment, is progressively reduced or reduced in cross-section. However, neither a refrigerant gas flow passage 141 nor an introduction passage 145 is divided into small channels, and instead, only a single passage 148 is formed in the entire device. Two miniature blower 147 a and 147 b are seen for openings of the insertion 145 before.

Although this device 10 d is constructed in an extremely simplified manner, its volume can be reduced while the device maintains a predetermined cooling efficiency, like the devices according to the thirteen to fifteen embodiments. The device of this type may be sufficient depending on the calorific value or amount of a semiconductor chip.

Seventeenth embodiment

A description of an electronic parts cooling device according to a seventeenth embodiment of the present invention will now be given with reference to FIGS. 22A and 22B.

A cooling device 10 e of the seventeenth embodiment is constructed by adding a block to the radiation fin device 10 b of the fourteenth embodiment, which is shown in FIGS. 19A to 19C. That is, as shown in Fig. 22A and 22B, a radiation fin block 159 on a sloping or inclined portion 156 of a Einführdurchganges 155 and on the upper surface of a cooling gas flow passage 151 is disposed.

As described above, this means is constructed by further adding a 10 e fin block to the device 10 b of the fourteenth embodiment which achieves a cooling efficiency that is equivalent or substantially equivalent to that of typical equipment. Although the device is 10 s in volume equal to typi's facilities, accordingly, a higher ficiency Kühlef or performance are achieved by the device 10 e, compared to typical devices.

Eighteenth embodiment

An electronic parts cooling device 10 f according to an eighteenth embodiment of the present invention will now be described with reference to FIGS. 23A and 23B.

The cooling device 10 for the eighteenth embodiment is constructed by adding a radiation fin block or cooling fin block to the device 10 d of the lead shape sixteenth 24212 00070 552 001000280000000200012000285912410100040 0002019506373 00004 24093en from that shown in FIGS. 21A and 21B and in the transverse direction reduced in cross-section is to progressively reduce or reduce the cross-sectional area of the flow passage.

As shown in FIGS . 23A and 23B, the radiation rib blocks 169 a and 169 b are provided on the side surfaces of the inclined portions 166 of an insertion passage 165 and on the side surfaces of a cooling gas flow passage 161 .

With this construction of the device 10, f and the counterpart of the seventeenth embodiment, although the device 10 f is the typical means by volume, a higher cooling efficiency be attained by the device 10 f as compared to typical devices.

The thirteen to eighteen embodiments are only included spielhafte representations and various changes kön  NEN be carried out within the invention.

For example, although in the foregoing embodiment, the walls used for dividing the respective flow channels of the device are all tubular, they take various forms. Such examples are shown in Figs. 24A and 24B.

Figs. 24A and 24B illustrate examples of modifications of the walls of the device. Fig. 24A shows the wall in a wavy shape, while Fig. 24B shows another wall in the form of a ribbed jalousie louver rib or meander-shaped Rippenanord tion shaped.

With the modified walls described above can the surface area area can be increased and the cooling efficiency or performance can thus to a higher degree be enlarged.

Also the radiating rib blocks, which in the seventeenth and the eighteenth embodiment are only for example, representations and a heat radiator one desired shape, z. B. a heat radiator with a block of rod-shaped radiating sections, can be used.

Nineteenth embodiment

A cooling device for electronic parts according to a nineteenth embodiment ( Figures 25A-25C, Figure 26) comprises a heat radiator having a plurality of cooling gas flow passages 220 a- 220 e formed therein and miniature blowers 212 a- 212 e provided for the heat radiator 211 to create the flows of a gas jet or -stromes in the passageways 220 a-220 e.

The passageways 220 a-220 e include: a gas-Einführab section 223 with a larger cross-sectional area, which extends continuously from openings 221 a-221 e at one end of the device; an oblique portion 224 which continuously extends from the gas introduction portion 223 and the lower surface 226 of which is inclined to progressively reduce the cross-sectional area of the passages; and a cooling section 225 with a predetermined reduced cross-sectional area which forms the passageways until it reaches apertures 222 a-222 e at the other end of the device.

Miniature fan 212 a- 212 e are provided for the gas introduction portion 223rd

An explanation of the cooling process of a semiconductor chip by the device 10 g which is constructed as described above will now be described.

As shown in Fig. 27, the device 10 g is mounted on the back surface of a semiconductor chip 900 to absorb heat from and cool the chip. In such a state, the blower 212 will ge a- e 212 rotates in a direction, which gas in the passageways 220 a-220 e from the Äuße suck reindeer, to generate the flow of a cooling gas within each of the passageways. The flow thus generated increases its speed at the inclined portion 224 because of its smaller cross-sectional area and absorbs heat from the walls of the passageways 220 a-220 e while passing occurs there to be then discharged.

During this operation, since the inclined portion 224 has an inclined lower surface to progressively reduce the cross-sectional area, as shown in Fig. 26, the flow of a cooling gas near the lower surface proceeds at a higher speed. Namely, an equality in the velocity of gas flow in the passage can be defined as follows. The Ge speed of the gas flow, which se straight through the Geblä 212 a- 212 e has been generated, indicated by v₀; the velocity of the flow which is near the upper surface of the reduced portion of the passage defined by the inclined portion 224 is represented by v₁; and the velocity of the flow, which runs in the vicinity of the lower surface thereof, is denoted by v₂. Under such conditions, the relationship of the flow rate can be represented by the following mathematical formula:

v₂ <v₁ <v₀ (1)

As can be seen from the above formula, since the highest heat transfer rate or heat transfer rate or heat transfer coefficient at the connection between the passage and the lower surface 226 can be achieved, the flow can be heat in the efficient manner sorb a semiconductor chip and cool it.

The heat transfer characteristics of the cooling device 10 g, which constructed as described above and is operated will be explained with reference to FIGS. 28 to 30. It is to be noted that such characteristics are obtained when the heat radiator is an aluminum mold and air is the refrigerant gas.

Fig. 28 shows the relationship between the position x inner half of the passage of the device 10 g and the heat transfer coefficient of the heat radiator to the refrigerant gas. The horizontal axis denotes the distance x from the gas suction port, as shown in Fig. 26.

The gas flow passage is reduced in this embodiment, and thus Fig. 28 clearly shows that the heat transfer coefficient of the heat radiator to the gas can be improved in any position within the passage through the device in which the passage is not reduced by a oblique or inclined section. As a result, the gas can absorb a larger amount of heat from the heat radiator, thereby increasing the cooling efficiency.

Fig. 29 shows the relationship of the thermal resistance between the heat radiator and the cooling gas in relation to an imbalance in a cross-sectional area of the passage. The vertical axis of Fig. 29 represents the heat resistance between the heat radiator and the gas, which speaks ent the reciprocal of the heat transfer coefficient. The horizontal axis denotes a ratio of a cross-sectional area of the cooling portion 225 to that of the gas introduction portion 223 . As far as the cooling device 10 g of this embodiment is concerned, the width of the passageways at each position is constant and thus, as shown in Fig. 26, a ratio of the height R _{r of} the passage in the cooling section 225 to the height R _{i of} that in the gas A guide portion 223 corresponds to the above-mentioned ratio of the cross-sectional area of the passage. The ratio of 1 means that the passage is not reduced by a sloping or inclined portion.

As shown in Fig. 29, when the ratio of the cross-sectional area exceeds about 0.2, the thermal resistance becomes smaller than that when the passage is not decreased. When the ratio is about 0.5, the smallest heat resistance can be obtained.

As apparent from the foregoing description, the Passage through an oblique or inclined section ver reduces or reduces to a suitable Querschnittsflä and thus can the heat transfer coefficient improved between the heat radiator and the cooling gas who which increases cooling efficiency.

FIG. 30 shows the relationship of the heat resistance between the heat radiator and the cooling gas in relation to the angle at which the passage is inclined, that is, the inclination angle α of the lower surface of the inclined portion 224 .

The vertical axis of Fig. 30, like that of Fig. 29, represents the thermal resistance between the heat radiator and the cooling gas, while the horizontal axis represents the angle of the lower surface of the inclined portion 224 with respect to the gas flow direction. The inclination angle α at 0 ° means that the passage is not reduced by a sloped portion.

As shown in Fig. 30, the thermal resistance which is generated when the inclination angle is 60 ° or less is smaller than that when the passage is not reduced by a slanted portion. If the inclination angle is about 45 °, the smallest thermal resistance can be achieved.

As apparent from the foregoing description, the Passage at a suitable angle in cross-section ver decreases or decreases, whereby the Wärmeübergangskoeffi zient between the heat radiator and the cooling gas improved can be, whereby the cooling efficiency improves or increases becomes.

As is clear from the foregoing description, according to the cooling device 10 g of the nineteenth embodiment, the cooling gas passage is inclined at a suitable angle to the lower surface, which is held in contact with a semiconductor chip, so that the cross-sectional area of the passage suitably reduced can be, thereby improving the cooling efficiency.

Twentieth Embodiment

A cooling device for electronic parts 10 h according to a twentieth embodiment of the present invention will now be explained with reference to FIGS. 31A to 31D.

The cooling device 10 h of the twentieth embodiment, as the counterpart of the nineteenth embodiment, comprises a heat radiator 231 and miniature blower 232 a and 232 b for generating the flow of a cooling gas. The heat radiator 231 further includes a gas introduction portion 243 , an inclined portion 244, and a cooling portion 245 . Unlike the device of the nineteenth embodiment form are in the device 10 g of this embodiment, the gas introduction section 243 and the inclined portion 244 is not divided into small passages, but only form a passage 240 f.

That is, the device 10 h comprises: the gas introducing portion 243 , which extends continuously from an opening 241 , which is angeord net at one end of the device, the inclined portion 244 , which smoothly in the gas Insertion section 243 merges, and its lower surface 246 is inclined to progressively reduce the cross-sectional area of the passage; and the cooling section 245, which is smooth and continuously transferred to the inclined portion 244 and is divided into five passages until it reaches openings 242 a-242 e which are located at the other end of the device. The gas introduction section 243 is provided with two miniature blowers 232 a and 232 b.

There can be achieved an improvement in the cooling efficiency of the one obtained by the device as described above for 10 hours as for the counterpart of the nineteenth embodiment. Such an improvement can be achieved as long as the device meets the following conditions. The device 10 h must include: the gas introduction section 243 , which generates the flow of a cooling gas through the blowers 232 a and 232 b; the inclined portion 244 having a lower surface which is ge tends to progressively reduce the cross-sectional area of the passageway; and the cooling portion 245 having the reduced smaller cross-sectional area which allows the gas to pass through the passage. The cooling section 245 or the inclined section 244 can be divided into small passages, as long as the total cross-sectional area of the passage satisfies the foregoing conditions.

In the cooling device 10 h of the twentieth embodiment, the two fans 232 a and 232 b rotates in a direction which sucks gas into the passage from the outside to the flow of a cooling gas within the passage 240 f of the gas introduction portion 243 and to produce inclined portion 244 . The flow thus generated increases its velocity at the inclined portion 244 because of its smaller cross-sectional area and is split to pass through the five passages 240 a- 240 e of the cooling portion 245 . In the passages 240 a - 240 e, as in the counter pieces of the nineteenth embodiment, the gas flow increases its velocity to the highest degree around the lower surface of the inclined portion 244 to absorb heat from the lower surface with high efficiency and then to be skipped.

The highly efficient cooling can be achieved by the device 10 h, as well as the counterpart of the nineteenth embodiment, he aims. In addition, the gas introduction portion 243 can be constructed in an even more simplified manner, and the number of miniature blowers can be further reduced.

Twenty-first embodiment

An electronic parts cooling device 800 according to a twenty-first embodiment of the present invention will now be explained with reference to FIG .

The electronic parts cooling device 800 is another variation of the open type as described with reference to FIGS. 9 to 11. The cooling device includes a heat radiator 810 , wherein first walls 812 and second walls 814 are alternately arranged parallel to each other, and a passage 822 of the cooling gas is formed between a first wall 812 and a second wall 814 .

The length of the second walls 814 is less than that of the first walls 812 and at least one of the end faces of the cooling radiator 810 includes at least one chamber 816 connected to the cooling gas passages 822 passing through the second walls 814 are separated. In each room 816 , a miniature motor 818 and a cooling fan 820 driven by the motor 818 are arranged in such a manner that the end face of the motor 818 , which has the cooling fan 820 , is connected to the end face of the second wall 814 . In this embodiment, the end face of the motor 818 is rigidly connected to the second wall 814 with a releasable connection means (not shown in FIG. 32).

In this embodiment, the cooling fan 820 turned by the engine 818 supplies a cooling gas to the passages 822 connected to the space 816 . It is easy to rearrange the configuration of this embodiment by placing a plurality of second walls 814 between the first walls 812 to place a plurality of cooling passages 822 into which cooling gas is introduced through a single cooling fan 820 .

Another arrangement of this embodiment is that partial masking over the cooling passages 822 on the radiator 810 can be made.

In this embodiment 800 , as an open type, a high cooling efficiency of this cooling device with a smaller number of component parts and less assembly cost is easily obtained as compared with the eighth embodiment of the present invention.

Twenty-second Embodiment

An electronic parts cooling device 900 'according to a twenty-second embodiment of the present invention will now be explained with reference to FIGS. 33 and 34.

A cooling device 900 'of this embodiment is a further variation of the type described with respect to Figs. 9-11 as an open type having no full coverage over the cooling passages. The description of this embodiment is limited to the novel features as follows.

As shown in Fig. 33, the cooler 900 'includes a radiator 910 '. The Kühlabstrahler 910 'includes a plurality of cooling passages 922 , which are divided by a plurality of walls 912 , which are parallel to each other.

Drive motors 918 are alternately attached to end faces of cooling passages 922 . As shown in FIG. 34, the motor 918 is mounted on retaining projections 926 formed perpendicular to the surfaces of the walls 912 . The retaining projections 926 may be formed along the full length of the walls 912 , however, it is useful to confine alternately to the necessary parts in the passages, integrally formed with the walls 912 .

Lead wires 928 are connected to each motor 918 by the motor drive circuit boards 924 to provide electric drive power. The printed circuit boards 924 are mounted on the walls 912 , bridging the tops of the adjacent walls. As shown in FIG. 33, the circuit boards 924 have been prepared for each drive motor 918 , but only one circuit board can be used when connecting wires are connected in parallel with the drive motors 918 . It is also possible that the circuit board is formed as one of the walls of this cooling device.

In this embodiment, the blowers 920 'driven by the motors 918 are disposed outside of the walls 912 , particularly outside of the radiator 920 '. The diameter of the blower 920 'is greater than the width of the cooling passages 922 , and the flow of refrigerant gas generated can be conducted not only to the passages having the drive motors but also to the adjacent passages 922 , however, it is not necessary in that the blower has a diameter greater than the width of the passages 922 .

In this embodiment 900 ', as an open type, a high cooling efficiency of this cooling device is easily obtained with a smaller number of components and a lower assembly cost, as compared with the eighth embodiment of the present invention.

Moreover, the drive motors 918 are mounted on the rigid retaining projections 926 on the walls 912 , compared to the case in which they are mounted on the circuit boards, with a highly rigid mounting of the drive motors ensures quiet and noise-free operation of the motors guaranteed. It is also advantageous to perform the assembly by means of a mounting device for releasably mounting the motor by.

The nineteenth to twenty-second embodiments are merely examples, and various changes can be made within the invention. For example, in the foregoing embodiments, the walls used to separate the device into small passages may all be tubular shaped. However, they can be shaped differently, such. As shown in FIGS. 24A and 24B, formed in a corrugated shape or in a corrugated Venetian or louver rib shape.

In the modified walls as described above can the cross-sectional area or radiating surface are increased, whereby the cooling efficiency or performance is increased.

Five passages are formed 10 g of the nineteenth embodiment in the entire device and five passages guide die formed only in the cooling section of the apparatus 10 h the twentieth corner. However, these embodiments are only examples, and the invention can be variously changed. For example, the device may have five passages only in the gas introduction section. As discussed above, the device can be freely constructed as long as it satisfies the following conditions. The apparatus is intended to include: a gas introduction portion which generates the flow of a refrigerant gas; an inclined portion having a lower surface which is inclined to progressively reduce the cross-sectional area and a cooling portion having the reduced cross-sectional area, which allows the gas to pass through the passage.

The inclined portion is linear under a predetermined one Angle inclined in the previous embodiments. ever yet he may be inclined in every form to be continuous reduce the cross-sectional area of the lower surface. Although it is modified as such, the tilt is angle preferably between about 30 and 60 °.

Claims (34)

1. Device for cooling an electronic part, wel che comprises:
at least one base having a surface held in contact with a heat radiating surface of the electronic part ( 900 );
at least one heat radiating device ( 110 ; 201 ; 301 ; 410 ; 510 ; 610 ; 11 ) provided on the surface of the base opposite to the surface which contacts the electrochemical part ( 900 ), the heat radiating device having a passage ( 113 ; 206 , 207 ; 121 ; 134 ; 148 ; 151 ; 161 ; 220 a- 220 e; 242 a- 242 e) defining a cooling gas; and
at least one miniature motor ( 130 , 131 ; 209 , 210 ; 330 , 331 ; 430 , 431 ; 530-533 ; 630 , 631 ; 30 a- 30 e, 31 a- 31 e; 64 , 65 ; 52 a- 52 e; 17 a- 17 e; 127 a, 127 b; 137 ; 147 a, 147 b), wel cher is disposed in the flow passage and having a rotor shaft which extends in the direction of the flow passage and to which a fan or Propeller is mounted. 2. A device according to claim 1, wherein the heat radiating means comprises: a fin assembly provided on the base defining the flow passage and at least one lid ( 120 ; 208 ; 320 ; 420 ; 521 ) disposed on top of the fin assembly is to close at least teilwei se the open upper end of the flow passage. 3. Device according to claim 1, wherein in the heat Abstraction device defined flow passage to the outside or is open to the top. 4. Device according to one of claims 1 to 3, wherein the blower ( 820 ) is designed such that the generated gas flow to a plurality of passages ( 822 ) Benach disclosed is guided to the motor. 5. Device according to one of the preceding claims, wherein the blower ( 920 ') is mounted on the shaft such that the blower is arranged outside the body of the device ( 900 '). 6. Device according to one of the preceding claims, wherein the motor ( 918 ) is mounted on at least one retaining projection ( 926 ) on the wall of the passage ( 922 ) such that the mounted motor ( 918 ) he leaves a passage of cooling gas. 7. Device according to one of the preceding claims and claim 3, wherein a motor drive power supply circuit board ( 924 ) is mounted on the wall such that the plate covers a part of the passage. 8. Device according to one of the preceding claims, wherein the heat radiating device ( 710 ) and the base are mitein other formed in such a way that they have a through hole formed therein, which defines the flow passage. 9. Device according to one of the preceding claims, wherein the miniature motor ( 330 , 331 ) is fixed or fixed to the fan with the base and is arranged in the flow passage. 10. The device according to any one of the preceding claims, in which the miniature motor (130, 131; 209, 210; 430, 431; 530-533) with the blower on the cover (120; 208; 420; 520) is mounted such that it is disposed within the flow passage when the lid is arranged to close the open upper end of the flow passage. 11. Device according to one of the preceding claims and claim 2, wherein the miniature motor ( 630 , 631 ) is fixed to the fan with the rib to be arranged within the flow passage. 12. A device according to any one of the preceding claims and claim 1 or 2, wherein the cooling passage comprises a single flow passage ( 113 ) which winds over the entire surface of the base and opens at a pair of diagonal corners of the base , wherein the motor ( 130 , 131 ) is arranged with the fan adjacent to at least one of the openings ( 111 , 112 ) of the single flow channel. 13. A device according to claim 12, further comprising: an opening ( 421 ) formed in the base substantially at the center of the base to provide a passage for sucking or discharging the cooling gas. 14. A device according to any one of claims 1 to 11, wherein the flow passage ( 310 ) includes a plurality of parallel flow channels extending from one to the other of a pair of opposite sides of the base, wherein at least one motor ( 330 , 331 ) is arranged with a fan at at least one end of each of the flow channels. 15. Cooling device for cooling an electronic part which comprises:
a first heat radiator (20; 51; 60), which be nachbart is arranged to form a heat radiation surface of an electronic part (900) and at least one Kühlgasströ mung passage (21 a- 21 e; 41 a-41 e; 55 a-55 e; 61 ) for a first cooling flow formed therein;
at least a miniature fan (30 a- 30 e, 31 a-31 e; 52 a-52 e; 64), which is arranged in the flow passage for forming a flow of cooling gas from an end in Rich tung to the other end of the flow passage; and
a second heat radiator ( 40 ; 53 ) provided on the opposite side of the first heat radiator to the electronic part and grooves ( 41 a- 41 e; 55 a- 55 e) substantially perpendicular or orthogonal to the Direction of the flow passage has on;
wherein the grooves of the second heat radiator are aligned in the direction of a second flow of the cooling gas. 16. A device according to claim 15, wherein the flow passage in the first heat radiator a plurality of comprises parallel linear tubular channels which extend from one to the other of a pair of opposite Extend sides of the heat radiating surface and at least one Miniature fan at at least one end of each of the cooling channels is arranged. 17. ACCORDING device of claim 16, wherein the grooves (41 a-41 e; 55 a-55 e) in the second heat dissipator ends aufwei sen, which are arranged at a flußabwärtsliegenden portion of the second flow of cooling gas, and wherein an opening ( 54 a- 54 e) is formed in the lower part of at least one of the grooves adjacent to the end to open to the flow passage in the first heat radiator. 18. A device according to claim 15, wherein the flow passage has end openings which be in places be neighbor to the one and the other of a pair of ent open opposite sides of the heat radiating surface, and writhe in such a way that it spreads over an area corresponding to the entire area of the heat-radiating void surface of the electronic part. 19. A cooling device for an arrangement adjacent to a heat radiating surface of an electronic part for cooling the electronic part, which comprises:
at least one cooling gas flow passage having an opening disposed adjacent to a side of the heat-radiating surface, the flow passage having a cross-sectional area which is minimum but large enough to allow a cooling gas to flow therethrough;
at least one introduction passage provided with an opening formed adjacent to another side of the heat radiation surface and having an area larger than that of the flow passage, the introduction passage being connected to the flow passage as its cross sectional area progresses decreases so that it smoothly passes into the flow passage; and
at least one miniature blower disposed in the vicinity of the opening of the introduction passage for forcing the cooling gas to flow from the opening of the introduction passage to the end of the flow passage. 20. A device according to claim 19, wherein a part one or the entire wall, which is opposite to the heat radiating surface and defines the insertion passage, is inclined so as to progressively heat radiating in a direction away from the opening of the insertion passage Ganges approach, reducing the cross-sectional area of the insertion passage is progressively reduced. 21. A device according to claim 19, wherein a part or the entirety of a pair of walls, perpendicular to the heat radiating surface, which define the insertion passage, inclined are to move in a direction away from the opening of the one pass through each other, reducing the cross-section surface of the insertion passage is progressively reduced. 22. Device according to claim 20 or 21, wherein the Inclination angle of the wall with respect to the flow direction of the Coolant is in the range between 30 ° to 60 °.   23. Device according to one of claims 19 to 22, further comprising: Wärmeabstrahlglieder (159; 169 a, 169 b) formed on the outer surface of the inclined wall (156) wel che the Einführdurchschnitt defined, are disposed, namely opposite to the introduction surface against the opposite surface and on the outer surface of the wall, which defines the cooling gas flow passage, and continu ously from this outer surface of the wall, which defines the Einführdurchgang. 24. Device according to one of claims 19 to 23, wherein the cooling gas flow passage a plurality of flow includes channels for the cooling gas, and the insertion passage a Variety of insertion channels includes, which with corresponding the flow channels are connected, each of the introduction channels its cross-sectional area over a part or the Entity of its length towards the connection with the associated flow channel decreases and wherein the minia turbo fan for each of the inlet ducts near the Öff tion of the insertion channel is arranged. 25. Device according to one of claims 19 to 23, wherein the cooling gas flow passage includes: a plurality of streams; mung channels for the cooling gas and the introduction passage comprises at least one insertion channel, which progressively its cross sectional area over part or all of its Length towards the flow channels decreases to the Cooling gas collectively to the plurality of flow channels Deliver, and being the miniature blower for everyone at least one insertion channel is arranged. 26. Device according to one of claims 19 to 25, wherein at least the wall, which is perpendicular to the heat radiation Area defines the cooling gas passage, a corrugation of a has any desired configuration. 27. Device according to claim 19, wherein at least the  Wall perpendicular to the heat radiating surface containing the cooling gas passage, a wavy louvers rib structure having. 28. A device for cooling an electronic part, wherein the device is mounted on the heat radiating surface of the electro-American part and is provided with a cooling gas flow passage, wherein the cooling gas flow passage comprises:
a first portion which is opened at its one end in the side of the cooling device corresponding to the one side of the heat radiating surface, wherein the first section from a miniature blower to flow a cooling gas through the first portion;
a second portion opened at one end thereof in another side of the cooling device corresponding to another side of the heat radiating surface, the second portion having a cross sectional area smaller than that of the first portion; and
a third portion which connects the other end of the first portion to the other end of the second Abschnit TES, wherein the lower surface of the Kühlgasströmungs passage adjacent to the heat radiation surface is inclined so that the cross-sectional area of the third Abschnit tes from the first portion towards the second section is progressively reduced. 29. The device according to claim 28, wherein the Kühlgasströ passage comprises a plurality of flow channels, each comprising: a section of a large cross sectional area corresponding to the first section, an Ab cut a small cross-sectional area corresponding to the second section and an intermediate section between the Section of a large and the section of a small cross sectional area. 30. Device according to claim 28 or 29, in which this  second portion of the cooling gas passage includes a plurality of flow channels and the first section comprises at least a flow channel from which the cooling gas collectively in the plurality of flow channels of the second section is introduced, each flow channel of the second Ab has at least one miniature blower to the Cooling gas thereby flow into the second section. 31. A device according to any one of claims 28 to 30, wherein the inclination angle of the lower part of the refrigerant gas flow passage of the third section with respect to the flow Direction of the cooling gas in the range between 30 ° and 60 °. 32. Device according to one of claims 28 to 31, wherein the cross-sectional area of the second portion of the cooling gas flow passage between 0.25 and 0.75 times greater than the cross-sectional area of the first portion of the cooling gas trömungsdurchganges. 33. Device according to one of claims 28 to 32, wherein at least the wall perpendicular to the heat radiating surface, the Coolant flow passage defines an ondulation of any has any configuration. 34. Device according to one of claims 28 to 33, wherein at least the wall is perpendicular to the heat radiating surface, which defines the cooling gas flow passage, a corrugated Having sunblind rib structure.