DE202005009081U1 - Effective cooling for computer electronics is in form of carrier having fan and heat sink and sits on mother board - Google Patents

Abstract

The mother circuit board of a computer system has various electronic circuit components including the heat generating CPU chip. Mounted directly onto the board is a carrier [1] for cooling elements. A heat sink module [3] is in direct contact with the CPU that projects through an aperture. A cooling fan [2] circulates cool air over the board. The carrier also has formed cooling fins [11].

Description

The The present invention relates to a cooling device for cooling electronic components.

in the Connection with the rapid development of semiconductor technology the packing density of electronic devices has become much higher, and the size of electronic Facilities and devices has become smaller. electronic High-speed devices consume a lot of electrical energy and give while a lot of heat in their operation from. To heat effectively of exhaling heat electronic devices can remove a heat sink with high power used. A high power heat sink has one wide flat base and a plurality of cooling fins extending from the Upper wall of the flat base extend. Ordinary heatsinks have the flat base and the cooling fins in different lengths, Heights or Thick, and the cooling fins are at different intervals from each other to obtain the desired heat dissipation effect.

The connection stability between the heat sink and the circuit board affected the operating behavior of the heat sink. A Motherboard for An industrial computer has a CPU and a plurality of Crisps. The type of CPU becomes due to the purpose of the industrial computer certainly. Different types of CPUs have different ones heights Thickness or volume and can be used according to different purposes. The installation a heat sink in a circuit board must with proper adjustment to match the height of the CPU on the circuit board customized to be.

• 1. Wenn ein anderer Typ von CPU in der Schaltungsplatine verwendet wird, kann es für die Schrauben unmöglich sein, die Montageansätze des Kühlkörpers an den entsprechenden Montageschraublöchern der Schaltungsplatine anzubringen, so dass die Anwendung des Kühlkörpers begrenzt ist.
• 2. Wenn die Schrauben übermäßig festgezogen werden, kann der nach unten gerichtete Druck vom Kühlkörper auf die CPU die normale Funktion der CPU negativ beeinflussen. Wenn die Schrauben jedoch nicht gleichmäßig festgezogen sind, kann sich der Kühlkörper verschieben, und es kann ein Zwischenraum zwischen dem Kühlkörper und der CPU erscheinen, der die Wärmeabführungsfunktion des Kühlkörpers verringert.
• 3. Wenn die Schaltungsplatine mit mehreren CPUs versehen ist, sollten mehrere Kühlkörper individuell in der Schaltungsplatine installiert und an den CPUs angebracht werden. Diese Installationsprozedur ist kompliziert. Weiter kann ein enger Abstand zwischen zwei benachbarten CPUs die Installation von Kühlkörpern verhindern.

A conventional heat sink A (as in 6 is shown) has a plurality of mounting lugs A1, which are arranged around the edge. During installation, bolts B are inserted through the mounting bosses A1 and screwed into corresponding mounting bolt holes C2 in the circuit board C to fix the heatsink A to the circuit board C, the bottom wall of the heatsink A being in contact with the surface of the CPU C1 in the circuit board C is held. This construction has the following numerous disadvantages.

• 1. When another type of CPU is used in the circuit board, it may be impossible for the screws to attach the heatsink mounting bosses to the corresponding mounting holes of the circuit board, so that the application of the heatsink is limited.
• 2. If the screws are tightened excessively, downward pressure from the heat sink to the CPU may adversely affect the normal functioning of the CPU. However, if the screws are not tightened evenly, the heat sink may shift and there may be a gap between the heat sink and the CPU that reduces the heat dissipation function of the heat sink.
• 3. If the circuit board is provided with multiple CPUs, multiple heatsinks should be individually installed in the circuit board and attached to the CPUs. This installation procedure is complicated. Further, a close spacing between two adjacent CPUs may prevent the installation of heat sinks.

The The present invention has been made in consideration of these circumstances. It is an object of the present invention to provide a cooler module create that with the height any of a variety of CPUs. It is a Another object of the present invention to provide a cool which can be easily installed in a circuit board, to heat effectively and quickly from the CPU on the circuit board.

Around to achieve these and other objects of the present invention, indicates the cooler module a base member for attachment to a circuit board, a heat sink, the mounted in the base member and heat from a CPU on the circuit board can receive, to which the base member is attached, wherein the Heat sink one Plurality of cooling fins has, and a fan designed to generate air streams to the heat sink, wherein the Base member a slot corresponding to the CPU on the circuit board, to which the base member is attached, and has a plurality of mounting holes, which are spaced around the slot. The heat sink is held on the base member and has a flat lower block, which is in the slot of the base member is used and is adapted to the CPU on the circuit board to touch, to which the base member is attached, wherein a plurality of fastening elements is provided vertically movable around the edge and at the mounting holes of the Base member is attached to secure the heat sink to the base member, so that the heat sink is vertical moved relative to the base member within a limited distance can be.

The Invention will be described below with reference to advantageous embodiments with reference to the attached Drawings described. Show it:

1 a perspective view of a cooler module of the present invention;

2 an exploded view of the cooler module of the present invention;

3 a side cross-sectional view of the cooler module of the present invention;

4 a schematic cross-sectional side view showing an application example of the cooler module of the invention;

5 a schematic side cross-sectional view showing another application example of the cooler module of the invention; and

6 an exploded view of a prior art construction.

Referring to the 1 to 3 For example, a radiator module of the present invention is shown which is a base member 1 , a fan 2 and a heat sink 3 having.

The base member has a plurality of cooling fins 11 , a recording room 12 that is between the cooling fins 11 is arranged, a slot 121 passing through its top and bottom wall in the receiving space 12 is incorporated, a plurality of mounting holes 122 passing through the top and bottom wall around the slot 121 are mounted, and a plurality of hollow support columns 13 located vertically in the four corners on the underside for receiving a corresponding screw 131 extend downwards.

The fan 2 is a side-blowing type, which is an exit port 21 on a lateral side.

The heat sink 3 has a lower flat block 31 , a plurality of radiator ribs 32 extending upward from the top wall thereof, a plurality of axis holes 33 which are incorporated through the upper and lower walls and around the radiator ribs 32 are spaced, and a plurality of fastening means 34 on that in the axle holes 33 are arranged. Any fastening device 34 has a fastener 341 that has a threaded shank 3411 has, and a spring member 342 on that on the fastener 34 is appropriate.

During the installation will be the fan 2 stuck in the recording room 12 of the base member 1 attached, being taken care that the air outlet opening 21 on one side of the slot 121 is applied. After that, the flat bottom block 31 of the heat sink 3 in the slot 121 of the base member 1 and then it becomes the threaded shank 3411 of the fastening element 341 each fastening device 34 in the mounting holes 122 of the base member 1 screwed in to the heat sink 3 at the base member 1 attaching, thereby allowing cold air from the exit port 21 of the blower 2 to the heat sink 3 to get to heat from the heat sink 3 lead away.

As mentioned above, the fasteners fasten 34 the heat sink 3 at the base member 1 , The spring links 342 the fastening devices 34 lie between the head of each of the fasteners 341 and the top wall of the heat sink 3 on to the heatsink 3 on the base member 1 hold down. The fasteners 341 the fastening device 34 restrict the direction of displacement of the heat sink 3 relative to the base member 1 one, ie, after installation, the heat sink can 3 vertically along the fasteners 341 the fastening devices 34 relative to the base member 1 be moved with the restriction due to the fasteners 341 , After moving the spring members hold 342 the heat sink 3 on the spring link 1 downward.

Referring to the 3 to 5 become during use the hollow support columns 13 of the base member 1 on a circuit board 4 supported, and then it will be the screws 131 in corresponding mounting screw holes 41 the circuit board 4 screwed in to the base member 1 on the circuit board 4 to attach, taking the flat lower block 31 of the heat sink 3 constantly on the upper surface of the CPU 42 is pressed. Because the heat sink 3 vertically along the fasteners 341 relative to the base member 1 is movable and by the spring members 342 pressed down, the heat sink adapts 3 the height of the CPU 42 and is constantly in close contact with the surface of the CPU 42 kept effective heat energy from the CPU 42 dissipate. During operation, cold air flows from the air outlet 21 of the blower 2 to the heat sink 3 off to heat from the CPU 42 and the heat sink 3 dissipate. It has the base member 1 a plurality of lower cushions, pads or humps 14 that on chips 43 the circuit board 4 be pressed to heat energy from the chips 43 to the base member 1 dissipating, thereby allowing heat energy to travel further into the open air through the radiator fins 11 can be delivered.

An ordinary motherboard for industrial use has many chips and a CPU. The type of CPU is determined based on the desired purpose. Because the heat sink 3 vertically along the Befestigungslementen 341 relative to the base member 1 is movable and by the spring members 342 is held down, the heat sink fits 3 with each of a variety of CPUs on a circuit board together and will last in close contact with the held on the upper surface of the CPU to effectively dissipate heat from the CPU.

• 1. Der Kühlkörper ist vertikal relativ zum Basisglied bewegbar, um sich an die Höhe der CPU auf der Schaltungsplatine anzupassen, in der das Kühlermodul installiert ist, wobei der flache Bodenblock des Kühlkörpers in enger Berührung mit der oberen Oberfläche der CPU gehalten wird, um schnell Wärme von der CPU abzuführen.
• 2. Die Befestigungselemente der Befestigungseinrichtungen sind durch die Achsenlöcher des Kühlkörpers eingesetzt und in die Montagelöcher des Basisgliedes eingeschraubt, um den Kühlkörper am Basisglied zu befestigen, damit der Kühlkörper vertikal entlang den Befestigungselementen bewegt werden kann, um sich an die Höhe der CPU auf der Schaltungsplatine anzupassen, in der das Kühlermodul installiert ist, und die Federglieder der Befestigungseinrichtungen halten den Kühlkörper auf dem Basisglied nieder, wodurch der Kühlkörper in enger Berührung mit der oberen Oberfläche der CPU gehalten wird.
• 3. Das Kühlermodul passt mit unterschiedlichen Schaltungsplatinen und unterschiedlichen Typen von CPUs und für unterschiedliche Anwendungen zusammen.
• 4. Der Kühlkörper des Kühlermoduls kann vertikal relativ zum Basisglied eingestellt werden, um an die Höhe der CPU angepasst zu werden, was die Installation erleichtert.

As mentioned above, the radiator module of the present invention has the following features:

• 1. The heat sink is vertically movable relative to the base member to accommodate the height of the CPU on the circuit board in which the cooler module is installed, with the flat bottom block of the heat sink held in close contact with the top surface of the CPU to quickly Dissipate heat from the CPU.
• 2. The fasteners of the fasteners are inserted through the axis holes of the heat sink and screwed into the mounting holes of the base member to attach the heat sink to the base member, so that the heat sink can be moved vertically along the fasteners to the height of the CPU on the circuit board in which the radiator module is installed, and the spring members of the fasteners hold the heat sink down on the base member, thereby holding the heat sink in intimate contact with the upper surface of the CPU.
• 3. The cooler module fits together with different circuit boards and different types of CPUs and for different applications.
• 4. The heat sink of the chiller module can be adjusted vertically relative to the base member to match the height of the CPU, which facilitates installation.

A prototype of the radiator module is with the characteristics of 1 to 5 been prepared. The cooler module works smoothly to provide all of the above features.

Even though a particular embodiment of Invention detailed for For illustration purposes, various modifications may be made and improvements are made without mind and scope to deviate from the invention.

1

base member

11

radiation fin

12

accommodation space

121

slot

122

mounting hole

13

cave support column

131

screw

14

lower Cushion or hump

2

fan

21

air outlet

3

heatsink

31

flat lower block

32

radiation fin

33

axle hole

34

Fastening device ^

341

fastener

3411

With Threaded shaft

342

spring member

4

circuit board

41

Mounting screw hole

42

CPU

43

chip

A

heatsink

A1

mounting boss

B

screw

C

circuit board

C1

CPU

C2

Mounting screw hole

Claims (4)

Cooling module for electronic circuits and components, characterized in that it comprises a base member ( 1 ) connected to a circuit board ( 4 ), a heat sink ( 3 ) on the base member ( 1 ) and a flat lower block ( 31 ) passing through a slot ( 121 ) in the base member ( 1 ) and with a CPU ( 42 ) on a circuit board, wherein a plurality of headed fasteners ( 341 ) through the heat sink ( 3 ) and at the base member ( 1 ) is attached to the heat sink ( 3 ) on the base member ( 1 ), so that the heat sink ( 3 ) vertically along the headed fasteners ( 341 ) is movable to the desired height, wherein spring members ( 342 ) on the headed fasteners ( 341 ) are provided to the heat sink ( 3 ), so that the flat lower block ( 31 ) in close contact with the CPU ( 42 ) on the circuit board ( 4 ) is durable. Cooling module for electronic circuits and components, characterized in that it comprises a base member ( 1 ) for attachment to a circuit board ( 4 ), a heat sink ( 3 ) contained in the base member ( 1 ) and is adapted to heat from a CPU ( 42 ) on a circuit board ( 4 ) at which the base member ( 1 ) is attachable, wherein the heat sink ( 3 ) a plurality of radiator or radiation fins ( 32 ), and a blower ( 2 ), which is adapted to air flow to the heat sink ( 3 ), the base member ( 1 ) a slot ( 121 ) for a CPU ( 42 ) on the circuit board ( 4 ), at which the base member ( 1 ) is attachable, and a plurality of mounting holes ( 122 ), which around the slot ( 121 ) are arranged, wherein the heat sink ( 3 ) on the base member ( 1 ) and a flat lower block ( 31 ) passing through the slot ( 121 ) of the base member ( 1 ) is used and is adapted to the CPU ( 42 ) on the circuit board ( 4 ), at which the base member ( 1 ), and a plurality of fasteners ( 34 ), which are arranged vertically movable around the edge thereof and at the mounting holes ( 122 ) of the base member ( 1 ) are attached to the heat sink ( 3 ) on the base member, so that the heat sink ( 3 ) vertically relative to the base member ( 1 ) is movable within a limited scope. Radiator module according to claim 1 or 2, characterized in that the heat sink ( 3 ) a plurality of axle holes ( 33 ) around its edge corresponding to the mounting holes ( 122 ) of the base member ( 1 ), and fastening devices ( 34 ) through the axial holes ( 33 ) of the heat sink ( 3 ) and at the mounting holes ( 122 ) of the base member are attached. Radiator module according to claim 3, characterized in that the fastening devices ( 34 ) each have a head fastener ( 341 ) through an axis hole ( 33 ) of the heat sink ( 3 ) and at a mounting hole ( 122 ) of the base member ( 1 ), and a spring member ( 342 ) mounted on the headed fastener ( 341 ) is mounted and between the fastener ( 341 ) and the heat sink ( 3 ) is applied to a downward pressure on the heat sink ( 3 ) exercise.