DE102005056096B4 - Cooling arrangement for at least one plugged into a rack electrical assembly and method for cooling such an electrical assembly and rack with an assembly - Google Patents

Cooling arrangement for at least one plugged into a rack electrical assembly and method for cooling such an electrical assembly and rack with an assembly

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Publication number
DE102005056096B4
DE102005056096B4 DE200510056096 DE102005056096A DE102005056096B4 DE 102005056096 B4 DE102005056096 B4 DE 102005056096B4 DE 200510056096 DE200510056096 DE 200510056096 DE 102005056096 A DE102005056096 A DE 102005056096A DE 102005056096 B4 DE102005056096 B4 DE 102005056096B4
Authority
DE
Germany
Prior art keywords
thermal zone
assembly
arranged
board
characterized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE200510056096
Other languages
German (de)
Other versions
DE102005056096A1 (en
Inventor
Martin Dipl.-Ing. Böhm
Ernst Engst
Thomas Dipl.-Ing. FH Schmidt-Behounek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oce Printing Systems GmbH and Co KG
Original Assignee
Oce Printing Systems GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oce Printing Systems GmbH and Co KG filed Critical Oce Printing Systems GmbH and Co KG
Priority to DE200510056096 priority Critical patent/DE102005056096B4/en
Publication of DE102005056096A1 publication Critical patent/DE102005056096A1/en
Application granted granted Critical
Publication of DE102005056096B4 publication Critical patent/DE102005056096B4/en
Application status is Expired - Fee Related legal-status Critical
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management

Abstract

Cooling arrangement for at least one plug-in electrical subassembly in an assembly, comprising:
a circuit board (12) on which electrical components are arranged on at least one side,
the board (12) being divided into at least two thermal zones (18, 20, 22) extending parallel to a side edge of the board (12) orthogonal to the intended insertion direction;
Means (24, 30, 32) with which in the first thermal zone (18) an air flow can be generated,
wherein the means (24, 30, 32) are connected to the electrical assembly;
Partition means (26) for isolating the flow of air in the first thermal zone (18) from the air flow in the second thermal zone (20).

Description

  • cooling arrangement for at least one in a rack plug-in electrical assembly and method for cooling a such electrical assembly and rack with an assembly.
  • The The invention relates to a cooling arrangement for at least one in a rack pluggable electrical assembly, which includes a circuit board on arranged at least on one side electrical components are. The invention further relates to a method for cooling a in a rack arranged electrical assembly by means of a cooling arrangement, a plug-in lektrische assembly with a cooling arrangement as well as a rack with at least one slot into which an electrical module can be inserted is.
  • It are subracks known to have a variety of slots, so-called slots, in each of which a plug-in module can be inserted. The Plug-in modules are plugged in via connectors with a so-called backplane arrangement with each other and with a power supply unit connected. Such a backplane arrangement is also called a backplane or reverse wiring designated. The subracks For example, have a nominal width of 19 inches in accordance with the standard IEC60297-3-101. A plug-in assembly includes a printed circuit board, d. H. Motherboard attached to a first side edge with a connector and on the second side edge opposite the first side edge connected to a front panel or front panel.
  • Further plug-in modules are known, which are mechanically enclosed. These enclosed assemblies are also referred to as cassettes. The Plug-in assembly may include other boards, preferably are arranged at a distance from the motherboard. At least up the front of the motherboard are components or assemblies arranged, in particular electrically connected to the motherboard are. These components and assemblies are particularly integrated circuits, passive components and assemblies, such. Hard disk space, Memory cards or memory modules. In particular, some electronic Circuits, such. B. CPUs serving as processors, and power semiconductors have a very high power dissipation. This can be done in desktop computer systems currently used processors from the manufacturers Intel and AMD as well the power processors of Motorola and IBM in use are not operated at full power on plug-in modules, since the amount of heat generated by the power loss occurring not discharged can be. Therefore, in the prior art often only so-called Mobile processors used with lower power dissipation. General is it required processors on relatively large heat sink to dissipate the To arrange power loss. However, such heatsinks are a significant flow resistance, the airflow reduced in the area of the heat sink.
  • Other Possible solutions, such as the discharge The power loss with the help of a water cooling circuit, are currently not used with plug-in modules due to various problems. A plug-in module with a CPU has a one-off power loss the CPU of up to 150 watts and about 100 watts total power loss other components.
  • From the document DE 20 2005 009 081 U1 a cooling module for electronic circuits is known, are provided in the cooling body different cooling capacity, wherein a part of the heat sink is arranged in a generated by a fan air flow.
  • From the document US 5,828,549 A a cooling arrangement for processors of a personal computer is known in which cooling bodies are provided, each having an inner closed flow channel through which a part of the cooling air generated by a fan is passed.
  • From the document US 5,210,680 A is a rack for vertically arranged in slots of the rack electronic modules known. Below the modules a fan module is arranged. For individual insertion slots of the rack, in which no module is used, air baffles may be provided, through which the air flow supplied by the fans is routed to assemblies of adjacent slots.
  • task The invention is a cooling arrangement for at least one in a rack plug-in electrical assembly and a method for cooling a in a rack to provide arranged electrical assembly in which the by the power loss of the components and assemblies of the assembly generated heat safely dissipated in a simple manner. Furthermore, a rack and to specify a pluggable electrical assembly.
  • This object is achieved by a cooling arrangement for at least one plug-in an assembly electrical assembly with the features of claim 1. Advantageous developments of the invention are specified in the dependent claims. Furthermore, the inventions tion solved by a method having the features of claim 19, by an assembly having the features of claim 20 and by a rack with the features of claim 23.
  • at a cooling arrangement with the features of claim 1 is in each of the thermal zones The board generates a different flow of air, resulting in each these thermal zones due to the power dissipation there arranged components generated heat is safely dissipated. Thereby can especially as a CPU serving processors even at high loads These processors are safely cooled so that these processors are also durable at full power dissipation and / or full computing power can be operated.
  • One second aspect of the invention relates to a method for cooling Components of an inserted in a rack assembly with the features of claim 19. By such a method is achieved that in the first thermal zone and in the second thermal zone arranged components according to their Power dissipation cooled can be, so that in particular for components or assemblies with a high Power loss, the large amount of heat generated by the high power loss safely dissipated can be and the components thereby in a temperature range can be operated by the one permissible Temperature limit not exceeded becomes. This prevents in particular that the components are destroyed or protective circuits of the components are activated by the at least the performance of the respective component or the respective module temporarily reduced is.
  • One third aspect of the invention relates to a rack with The features of claim 23. By such a rack with At least one construction group is achieved that all components and / or building units of the assembly, a sufficient amount of cooling air is supplied, by the amount of heat generated by their respective power dissipation safely dissipated so that also features components with a relatively high power dissipation sufficiently cooled become.
  • To the better understanding The present invention is described below in the drawings illustrated preferred embodiments reference taken from specific terminology. It should be noted, however, that the scope of the invention not restricted should be, because such changes and further modifications to the devices shown and the Method and such other applications of the invention as they in it are shown as usual current or future Expertise of a competent Be considered professional. The figures show exemplary embodiments of the invention, namely:
  • 1 a schematic representation of the side view of an assembly according to the invention in the installed position;
  • 2 a schematic representation of the module according to 1 in a view from below;
  • 3 a schematic representation of two similar side-by-side assemblies in a view from below;
  • 4 a schematic perspective view of two juxtaposed modules, in addition fans of a rack are shown;
  • 5 a schematic sectional view of a rack with a center-plane center wall;
  • 6 a side view of a CPU assembly according to the invention with schematically illustrated components and assemblies; and
  • 7 a view of the CPU module after 6 from underneath.
  • In 1 is a side view of a schematically illustrated assembly 10 represented according to the invention. This module is also referred to as a printed circuit board and is intended for use in a rack. The assembly 10 has a motherboard 12 , at the front side edge as a front panel 14 trained cover plate is provided. The front panel 14 is essentially orthogonal to the motherboard 12 arranged. At which the front panel 14 opposite side edge of the motherboard 12 are three connectors 15 . 16 . 17 arranged and at least electrically connected to the motherboard 12 connected. A strip-shaped area of each connector 15 . 16 . 17 stands over the side edge of the motherboard 12 above. The connectors 15 . 16 . 17 are when inserting the module 10 automatically connected in a rack with the provided in the rack complementary connector assemblies. In a simple rack are used in the modules only from the front of the rack in this and preferably connected by a backplane arrangement with each other and with a power supply unit. With double subracks, the subassemblies are inserted from both the front of the subrack and the rear side of the subrack used and preferably connected by a center-plane arrangement with each other and with a Stromversorugngseinheit.
  • The backplane arrangement connects several subassembled in the rack assemblies together and thus forms the back wiring of the rack for signal exchange and power supply of the modules. A center-tilt arrangement is used to connect the modules used by the front and the back in the rack. In particular, the backplane assembly and the center-plane assembly include at least one common bus for data transfer between the assembly 10 and the other modules used in the rack and between the other modules with each other. The motherboard 12 preferably comprises a single-layer or multilayer printed circuit board.
  • The assembly 10 is in three thermal zones 18 . 20 . 22 divided, which are substantially strip-shaped side by side parallel to the side edge at which the connector 15 . 16 . 17 are arranged and parallel to the side edge where the front panel 14 is arranged. In the first zone 18 is the main processor, ie the CPU, of the module 10 arranged. On the top of the CPU, a relatively large heat sink is arranged. In the first zone 18 In general, components are arranged with a high power loss, of which a relatively large amount of heat must be dissipated. At the bottom of the motherboard 12 is in the first zone 18 a fan unit 24 arranged with two axial fans, which provide a relatively large flow of air through the first zone 18 through.
  • Further, a cover 26 provided the first zone 18 limited to three sides and essentially ensures that the through the fan unit 24 at least reinforced air flow through the first zone 18 passes through and not into other adjacent thermal zones 20 . 22 escapes. This ensures that a suffi cient amount of cooling air to the components to be cooled, heatsinks and assemblies in the first thermal zone 18 is passed to dissipate an amount of heat sufficient for cooling. Thus, through the cover 26 and the motherboard 12 the first thermal zone 18 limited to four sides, whereby a flow channel is formed. Preferably, a heat-conducting connected to the processor heat sink is formed and arranged such that the cooling body with its cooling fins over the entire cross-sectional area of the cover 26 extends above the processor, creating at least a significant part of the through the fan unit 24 generated or amplified air flow past the cooling fins and cooling surfaces of the heat sink and thereby dissipates a sufficient amount of heat to cool the processor.
  • In the second thermal zone 20 are components arranged with an average power loss, in particular memory circuits and parts of a switching power supply for generating on the module 10 required supply voltages. The memory circuits are preferably memory modules comprising memory circuits arranged on small printed circuit boards. These memory modules are via appropriate connectors to the motherboard 12 connected. As a result, a flexible configuration of the memory, in particular of the working memory, of the module 10 possible. The memory modules can volatile memory, such. B. RAM, or non-volatile memory such. As EEPROMs or EPROMs include.
  • In the third thermal zone 22 Components are arranged with a relatively low power loss, in which only a relatively small amount of heat must be dissipated. In the third thermal zone 22 is at a distance to the motherboard 12 a hard disk 28 arranged, which represents a erhebli chen flow resistance for an air flow due to their closed design, the assembly 10 flows through from the lower side edge to the upper side edge. The existing for this air flow air inlet surface of the second thermal zone is through a first air baffle 30 limited by the at least one gap between the front and the top of the motherboard 12 and the air baffle 30 is formed. On the front of the motherboard 12 are components and assemblies of the assembly 10 arranged.
  • The air baffle 30 causes much of the assembly 10 supplied cooling air below the baffle 30 the second zone is fed, causing the cooling air in the front of the motherboard 12 and the components and assemblies arranged thereon flow past or flow around them, thereby producing a good cooling effect. The air baffle 30 forms an additional flow resistance for in the second thermal zone 20 incoming cooling air.
  • In the air inlet area of the third thermal zone 22 is a second air baffle 32 at a distance to the motherboard 12 arranged, wherein the air baffle 32 at a closer distance to the motherboard 12 is arranged as the air baffle 30 , The air baffle 32 is arranged and dimensioned in such a way that it together with that through the hard disk 28 formed flow resistance and the other in the third zone 22 arranged components forms a considerably larger flow resistance than the air baffle 30 and the in the second thermal zone arranged components and components.
  • The through the in the second thermal zone 20 and in the third thermal zone 22 arranged flow components and / or components formed by the air baffles 30 . 32 each enlarged.
  • This allows a targeted division of the assembly 10 from the rack supplied cooling air to the individual thermal zones 18 . 20 . 22 respectively. In particular, by the baffles 30 . 32 that achieves a greater part of the assembly 10 Cooling air from the first zone fed from the rack 18 is supplied. Despite the relatively large flow resistance of the first thermal zone formed in particular by the processor heat sink 18 is through the through the baffles 30 . 32 increased flow resistance of the second thermal zone 20 and the third thermal zone 22 as well as through the fan unit 24 in the first thermal zone 18 caused amplification of the air flow of the first thermal zone 18 a sufficiently large proportion of the rack to the module 10 supplied guided cooling air. This ensures that sufficient cooling air flows past the heat sink of the processor and flows through the openings provided between the cooling fins in order to dissipate the heat loss of the processor conducted to the heat sink.
  • The fan unit 24 reduces the flow resistance of the first thermal zone 18 significantly or creates a negative flow resistance. By providing the baffles 30 . 32 and / or providing additional fans on the assembly 10 is in each of the thermal zones 18 . 20 . 22 which is used to dissipate the power dissipation in the respective zone 18 . 20 . 22 arranged components selectively controlled amount of heat generated. The baffles 30 . 32 and / or the fan unit 24 also cause a mechanical stiffening of the motherboard 12 , This will increase the torsional rigidity of the motherboard 12 elevated. In particular, with the force effects during insertion of the module 10 in a rack or when pulling out the module 10 The rack will damage the motherboard 12 avoided.
  • In 2 is the assembly 10 schematically shown in a view from below, wherein the assembly in 2 opposite to the 1 shown side view of the assembly 10 rotated by 90 °. Like elements have the same reference numerals. Between the air baffle 30 the second thermal zone 20 and the motherboard 12 remains a larger free cross-sectional area than between the air baffle 32 the third thermal zone 22 and the motherboard 12 , The second thermal zone 20 This has a lower flow resistance than the third thermal zone 22 , Thereby flows through the second thermal zone 20 a larger amount of air supplied from the rack cooling air than through the third thermal zone 22 , The over the air baffle 32 outstanding hard disk 28 Prevents most of the cooling air supplied by the rack above the air baffle 32 unused by the third thermal zone 22 is dissipated and essentially not for cooling the assembly 10 or for the removal of the components and assemblies of the assembly 10 generated amount of heat is used.
  • In 3 is the assembly 10 together with one in the rack next to the module 10 essentially the same structure 10a shown. The with the elements of the assembly 10 matching elements of the assembly 10a are marked with the same reference numeral and additionally with the letter a.
  • By arranging the assembly 10a next to the assembly 10 is the second thermal zone 20 additionally through the back wall of the motherboard 12a the assembly 10a limited, so that also around the second thermal zone 20 a substantially closed flow channel is formed. In the same way, the third thermal zone 22 through the back of the board 12a the assembly 10a and limited by a rear wall of the subrack, not shown, so that through the boundaries escape of the cooling air from the thermal zones 20 . 22 especially through the back of the board 12a the adjacent module 10a is prevented. Is next to the assembly 10a no further assembly is provided, a so-called dummy module or a blanking plate is used instead of an adjacent board in the rack, the back of this blanking plate has the same function for limiting the second and third thermal zone, as the back of the board 12a for the assembly 10a , Alternatively, the assembly is 10 arranged directly adjacent to a side wall of the subrack.
  • The assemblies 10 . 10a are arranged in the rack in arranged in the rack guide rails, in which the modules 10 . 10a each be pushed into the rack when inserting the module. Through these rails is the distance of the motherboards 12 and 12a neighboring assemblies 10 and 10a specified. The distance of the rails thus determines the width of a slot or a slot. The width of an assembly 10 . 10a can also include multiple slots, in which case not provided at each slot guide rails but only where a motherboard of the assembly 10 . 10a is arranged. Will instead of an assembly 10 respectively. 10a a bling plate or a blind module consisting of a blanking plate and at least one front panel, the blanking plate, which has substantially the same dimensions as the motherboard, is inserted in the same manner into the guide rails of a slot as an assembly 10a , Preferably, the dummy module has at least one guide element, by means of which the dummy module is mechanically guided and / or held in a plug connector arrangement of the module carrier.
  • In 4 is a schematic representation of the modules 10 and 10a shown according to their arrangement in a rack, with two provided in the rack fan 40 . 42 are shown schematically. The fans 40 . 42 cause an air flow through the thermal zones 18 . 18a . 20 . 20a . 22 . 22a of the assemblies 10 . 10a , Preferably, between the fans 40 . 42 and the assemblies 10 . 10a a filter mat, not shown, provided by a back pressure between the fans 40 . 42 and the filter mat is generated. The dynamic pressure causes a relatively uniform passage of air through the filter mat, whereby a relatively uniform air flow above the filter mat and thus in the region of the underside of the modules 10 . 10a is produced. The air flows through the individual modules 10 . 10a are each shown schematically by arrows.
  • In 5 is a schematic sectional view of a rack 50 shown on the front 52 and on the back 54 several juxtaposed slots are available. In the rack 50 can both from its front 52 forth assemblies 10 . 10a in the slots on the front 52 of the subrack 50 and from his back 54 forth assemblies 10 . 10a in the slots on the back 54 of the subrack are inserted. By inserting the modules 10 . 10a in the rack 50 are the connectors 15 . 15a . 16 . 16a . 17 . 17a automatically with at a centerplane arrangement 56 provided connector assemblies, in the same way as a backplane arrangement in a rack 50 in which the modules only from the front 52 are insertable, an electrical connection between the individual modules 10 . 10a produce. In the rack 50 are fans 41 . 42 . 45 . 46 below the modules 10 . 10a or arranged below the slots, the cooling air from the environment of the rack 50 suck in and one up to the assemblies 10 . 10a generate executed airflow.
  • Between the modules 10 . 10a and the fans 41 . 42 . 45 . 46 are filter mats 57 . 58 provided that filter out dirt particles from the cooling air and generate a flow resistance. The flow resistance of the filter mats 57 . 58 causes through the fan 41 . 42 . 45 . 46 generated air flow below the filter mat 57 . 58 a dynamic pressure is built up by which a substantially over the entire surface of the filter mat 57 . 58 even air flow through the filter mat 57 . 58 passes through. This will work on the bottoms of the assemblies 10 . 10a a substantially uniform air flow provided as a cooling air flow. With the help of the air baffles 30 . 32 as well as with the help of the fan arrangement 24 . 24a This is essentially evenly through the filters 57 . 58 passing airflow according to the due in the individual thermal zones 18 . 18a . 20 . 20a . 22 . 22a split dissipating amount of heat.
  • Alternatively or additionally, an area above the modules 10 . 10a more fans 43 . 44 . 47 . 48 provided the air flow through the assemblies 10 . 10a or through the zones 18 . 18a . 20 . 20a . 22 . 22a of the assemblies 10 . 10a Promote by placing a vacuum above that in the rack 50 arranged assemblies 10 . 10a produce. For even distribution of negative pressure are below the fan 43 . 44 a filter mat 59 and below the fan 47 . 48 a filter mat 60 arranged.
  • By providing the three thermal zones 18 . 20 . 22 can also have assemblies 10 . 10a , which have electronic components with very different heat output, are optimally cooled. The assemblies 10 . 10a are in the rack 50 pluggable and removable from this again. In such a rack 50 can have multiple assemblies 10 . 10a same type or different assemblies are arranged side by side. In the first thermal zone 18 is at least one fan 24 arranged by the in the rack 50 provided fan 40 to 48 amplified air flow and a sufficient amount of air in particular at one in the first thermal zone 18 provided heat sink passes, which is provided in particular for dissipating the heat of a processor. This air flow is within an air shaft or flow channel of the first thermal zone 18 led, in particular by the cover 26 or other suitable Abschottmittel is formed. As a cover 26 For forming an air duct, in particular, a sheet metal cover or a cover made of other materials may be used. Preferably, the cover is made of electrically non-conductive plastics.
  • By providing the cover 26 becomes a relatively large amount of air passing through the first thermal zone 18 forced air flow forced, despite by one in the first thermal zone 18 arranged heat sink caused relatively high flow resistance to flow past the surface of the heat sink and absorb heat from the heat sink and dissipate. By suitable control of the fans of the fan unit 24 can pass through the first thermal zone 18 Depending on the momentarily occurring heat development, the conducted air quantity can be varied within wide limits without the air flow through the other thermal zones 20 . 22 is strongly influenced.
  • Especially in one in the first thermal zone 18 arranged as a CPU serving processor, the current heat development is highly dependent on the current processing power of the processor. The ones in the other zones 20 . 22 arranged components have a lower fluctuation of the power loss and thus a smaller variation of the amount of heat to be dissipated at different load, causing in these zones 20 . 22 a relatively uniform or constant cooling air flow is advantageous.
  • By the foreclosure of the first thermal zone 18 with the help of the cover 26 and the motherboard 12 , by the foreclosure of the second thermal zone 20 with the help of the motherboard 12 , the front panel 14 , the cover 26 and the back of the motherboard 12a an adjacent module 10a and by the foreclosure of the third thermal zone 22 with the help of the motherboard 12 , the cover 26 , the back of the motherboard 12a an adjacent module 10a and a backplane (backplane or centerplane array) of the chassis will be around each of the thermal zones 18 . 20 . 22 Air ducts formed. By constructive measures, such as the provision of additional flow resistance in the form of baffles 30 . 32 for reducing the flow cross sections of the individual air shafts of the zones 18 . 20 . 22 and / or the provision of additional fans will be in the zones 18 . 20 . 22 defined flow resistances formed by the targeted division of the volume flow of the cooling air through each of these to be cooled thermal zones 20 . 22 flows, is reached. In other embodiments, the air flow through one of the zones can be completely prevented.
  • The different flow resistance of the second thermal zone 20 and the third thermal zone 22 cause the amount of air passing through the third zone 22 flows less than the amount of air passing through the second zone 20 flows. This concerns at least the total amount of the respective zones 20 . 22 flowing cooling air and / or the flow velocity through the respective zones 20 . 22 flowing cooling air.
  • In the present embodiment of the module 10 have the thermal zones 18 . 20 . 22 about the same width, so that their cross-sectional areas are substantially equal. The different flow resistances of the individual zones bring about a different flow velocity through the thermal zone corresponding to the flow resistances 18 . 20 . 22 flowing cooling air.
  • The fan unit 24 or in the fan unit 24 included fans are directly on the motherboard 12 at the bottom and / or top margin of the assembly 10 arranged. The preferably rectangular outline area of the cross-section of a heat sink for cooling a processor operating in the first zone 18 is arranged, fills at least an upper portion of the through the cover 26 formed enclosed duct, so that through the fan unit 24 in the first thermal zone 18 caused air flow not laterally from the heat sink and the first thermal zone 18 can escape.
  • In particular through the air baffle 30 becomes the second thermal zone 20 entering airflow to the in this second thermal zone 20 arranged components and assemblies directed, for example, in the second zone 20 arranged memory modules and arranged on these memory modules memory circuits. In the third thermal zone 22 is below the hard drive 28 formed another duct. Through this further air shaft, the air flow in the third thermal zone 22 directly to the on the motherboard 12 in the area of the third thermal zone 22 arranged components passed. The hard disk 28 forms a large flow resistance in the third thermal zone 22 through the underneath the hard drive 28 a relatively high flow velocity of the cooling air is generated. This results in a relatively good cooling effect of the components and assemblies arranged there, which have a relatively low power loss, resulting in only a relatively small amount of heat from the third thermal zone 22 is payable.
  • The baffles 30 . 32 are not directly with the motherboard 12 connected. Alternatively, the air baffles 30 . 32 with fasteners to the motherboard 12 connected, which have only a low air resistance to those in these thermal zones 20 . 22 no further obstructing cooling air flowing in.
  • In 6 is the assembly 10 in the side view similar to the side view 1 shown. In the side view of the assembly 10 to 6 are the outlines of various components, heatsinks, components and pads for SMD components and in the motherboard 12 provided holes for the passage of connection pins of the components and the components shown in detail. In 7 is a representation of the assembly 10 to 6 shown.
  • In the 6 and 7 are just the outlines of the disk 28 and the cover 26 which also shows the below the hard drive 28 and inside the cover 26 arranged components and components are shown.
  • In the second thermal zone 20 are four memory modules 19 with so-called registered DDR RAM as Speicherbän ke in each case a 25 ° socket arranged. There are also connectors, indicators and actuators on the connectors 15 . 16 . 17 opposite edge side of the module 10 shown through in the front panel 14 provided openings projecting outwardly or at least visible through these openings and / or connectable with complementary connector assemblies.
  • Additionally or alternatively to the shown axial fans of the fan unit 24 can on the assembly 10 . 10a . 70 itself and / or in the rack 50 Radial fans or roller fans or radial fans and roller fans are used. In alternative embodiments, only two are thermal zones 18 . 20 or 20 . 22 provided, only in one of the zones 20 for limiting the amount of cooling air flowing through this zone, an additional means, in particular an air guide plate 30 , and in the other thermal zone 18 . 20 no additional means of restricting through this zone 18 . 22 is provided flowing cooling air. In this embodiment, then no additional fans 24 on the assembly 10 . 10a . 70 even provided. Alternatively, the flow resistances of both thermal zones can be adjusted by a targeted arrangement of the components such that a desired different air flow is achieved in the two thermal zones.
  • Furthermore, additionally or alternatively, the motherboards 12 . 12a of the assemblies 10 . 10a be arranged horizontally in a suitable rack, with the aid of fans an air flow along or parallel to the surface of the circuit boards 12 . 12a is produced. Preferably, the fans are not like the rack 50 un th and / or arranged above in the rack, but in a right and / or left side region of the rack, ie on at least one side of the rack provided. Furthermore, as with the rack 50 shown, at least one filter mat between the assembly and the fan / fans provided that cause a relatively uniform distribution of the airflow generated by the fan on the slots in which the modules are plugged or plugged.
  • 10 10a
    module
    12 12a
    motherboard
    13
    plug
    14 14a
    front panel
    15 15a, 16, 16a, 17, 17a
    Connectors
    18 18a
    first thermal zone
    19
    registered DDR SDRAM
    20 20a
    second thermal zone
    22 22a
    third thermal zone
    24
    fan unit
    26 26a
    metal cover
    28 28a
    hard disk
    30 30a, 32, 32a
    baffles
    40 to 48
    Fan
    50
    rack
    52
    front
    54
    back
    56
    Center plane configuration
    57 to 60
    filter

Claims (27)

  1. Cooling arrangement for at least one electrical subassembly which can be plugged into a rack, comprising: a circuit board ( 12 ), on which at least on one side electrical components are arranged, wherein the board ( 12 ) into at least two thermal zones ( 18 . 20 . 22 ), which are parallel to a side edge of the board ( 12 ) extends orthogonal to the intended insertion direction; Means ( 24 . 30 . 32 ) with those in the first thermal zone ( 18 ) an air flow can be generated, wherein the means ( 24 . 30 . 32 ) are connected to the electrical assembly; Partitioning means ( 26 ) for isolating the air flow in the first thermal zone ( 18 ) of the air flow in the second thermal zone ( 20 ).
  2. Cooling arrangement according to claim 1, characterized in that at least a first on the board ( 12 ) arranged component and / or a first on the board ( 12 ) arranged assembly in the first thermal zone ( 18 ) are arranged that at least a second on the board ( 12 ) arranged component and / or a second on the board ( 12 ) arranged assembly in the second thermal zone ( 20 ) are arranged, and / or that the flow directions of the air flows in the first thermal zone ( 18 ) and in the second thermal zone ( 20 ) substantially parallel to the first side of the board ( 12 ).
  3. Cooling arrangement according to claim 1 or 2, characterized in that the means ( 24 . 30 . 32 ) are selected and dimensioned in such a way that by the in the respective thermal zone ( 18 . 20 . 22 ) arranged components and assemblies caused flow resistance is taken into account.
  4. Cooling arrangement according to one of the preceding claims, characterized in that the Abschottmittel ( 26 ) a region of the first thermal zone ( 18 ) on the board ( 12 ) partially enclose.
  5. Cooling arrangement according to one of the preceding claims, characterized in that in the first thermal zone ( 18 ) Components and / or structural units with a high heat dissipation capacity and in the second thermal zone ( 20 ) Components and / or assemblies are arranged with a lower heat loss power, wherein preferably at least one in the first thermal zone ( 18 ) or in the first thermal zone ( 18 ) arranged assembly has a heat sink.
  6. Cooling arrangement according to claim 5, characterized in that the Abschottmittel ( 26 ) are arranged such that the flow resistance of the heat sink at least in a region of the first thermal zone ( 18 ) is less than or equal to the flow resistance of the remaining remaining cross-sectional area of the first thermal zone ( 18 ) is in a region of the heat sink.
  7. Cooling arrangement according to one of the preceding claims, characterized in that the means ( 24 . 30 . 32 ) for generating a predetermined air flow on the board ( 12 ) of the assembly ( 10 ) are arranged.
  8. Cooling arrangement according to claim 7, characterized in that the means ( 24 ) have at least one axial fan, radial fan or roller fan.
  9. Cooling arrangement according to one of the preceding claims, characterized in that the board ( 12 ) has a substantially rectangular base surface, wherein at least on a first side of the board ( 12 ) at least one connecting element of at least one connector arrangement ( 15 . 16 . 17 ) on the side edge of the board ( 12 ), wherein the connecting element is preferably connected to at least one complementary connecting element of a back-wiring wall ( 56 ) of the subrack ( 50 ) is connectable.
  10. Cooling arrangement according to one of the preceding claims, characterized in that the assembly ( 10 ) a third thermal zone ( 22 ) substantially parallel to the side edge of the board ( 12 ) and parallel to the first thermal zone ( 18 ) and parallel to the second thermal zone ( 20 ), wherein at least a third on the board ( 12 ) arranged component and / or a third arranged on the board assembly in the third thermal zone ( 22 ), wherein the flow direction of the cooling air in the third thermal zone ( 22 ) substantially parallel to the side edge of the board ( 12 ), and where the means ( 24 . 30 . 32 ) in the third thermal zone ( 22 ) one of the air flows in the first thermal zone ( 18 ) and in the second thermal zone ( 20 ) cause different third air flow.
  11. Cooling arrangement according to claim 11, characterized in that in the first thermal zone ( 18 ) Components and / or units with a high power loss, in the second thermal zone ( 20 ) Components and / or units with average power loss and in the third thermal zone ( 22 ) Are arranged components and assemblies with a low power loss.
  12. Cooling arrangement according to one of the preceding claims, characterized in that the means ( 24 . 30 . 32 ) in the first thermal zone ( 18 ) a first flow velocity of the air flow, in the second thermal zone ( 20 ) a lower flow velocity of the air flow than the first flow velocity and in the third thermal zone (FIG. 22 ) cause a lower compared to the second flow rate third flow velocity of the air flow.
  13. Cooling arrangement according to one of the preceding claims, characterized in that in the rack ( 50 ) at least one other means ( 40 to 48 ) for generating a further air flow through each of the thermal zones ( 18 . 20 . 22 ), this means ( 40 to 48 ) is arranged for generating the air flow, preferably at the air inlet side, and between which means ( 40 to 48 ) and the assembly ( 10 ) preferably a filter element ( 58 . 60 ) is arranged, which has a substantially uniform air flow at least in the region of the slot of the assembly ( 10 ) causes in the rack.
  14. Cooling arrangement according to one of the preceding claims, characterized in that the cross section of the second thermal zone ( 20 ) and / or third thermal zone ( 22 ) transversely to the flow direction by means of an agent ( 30 . 32 ) is limited such that the flow resistance through this second thermal zone ( 20 ) and or third thermal zone ( 22 ), this means ( 30 . 32 ) is preferably arranged and / or formed such that the means ( 30 . 32 ) directed airflow into a region of the second thermal zone ( 20 ) and / or third thermal zone ( 22 ), are arranged in the components to be cooled and / or assemblies.
  15. Cooling arrangement according to claim 14, characterized in that the means preferably at least one air baffle ( 30 . 32 ), preferably arranged in such a way and with parts of the assembly ( 10 ), which at least the flexural rigidity of the board ( 12 ) is enlarged in at least one area.
  16. Cooling arrangement according to claim 14 or 15, characterized in that the means ( 30 . 32 ) at the air inlet and / or at the air outlet of at least one of the thermal zones ( 18 . 20 . 22 ), whereby the funds ( 30 . 32 ) one of the assembly ( 10 ) split air stream into different partial air streams, wherein each a partial air flow of a thermal zone ( 18 . 20 . 22 ) is supplied.
  17. Cooling arrangement according to one of the preceding claims, characterized in that each thermal zone ( 18 . 20 . 22 ) is limited by a flow channel, each through the board ( 12 ), a board ( 12a ) of an adjacent module ( 10 ) or a instead of an adjacent module arranged Abschottmittel, a front panel ( 14 ) of the assembly ( 10 ) and a rear wall or middle wall of the subrack ( 50 ) and between the zones 26 ) is limited.
  18. Cooling arrangement according to one of the preceding claims, characterized in that the supply voltage via an electrical connection element ( 15 . 16 . 17 ) from the rack ( 50 ) to the assembly ( 10 ), wherein the connecting element preferably has a connector.
  19. Method of cooling one in a rack arranged electrical assembly by means of a cooling arrangement according to one of the claims 1 to 18
  20. Plug-in electrical assembly with a cooling arrangement according to one of the claims 1 to 18.
  21. Assembly according to claim 20, characterized in that a CPU of the module is arranged in the first thermal zone is.
  22. An assembly according to claim 20 or 21, characterized in that at least one connecting element of at least one connector assembly ( 15 . 16 . 17 ) on the side edge of the board ( 12 ), wherein the connecting element is preferably connected to at least one complementary connecting element of a back-wiring wall ( 56 ) of the subrack ( 50 ) is connectable.
  23. rack with at least one slot in which an electrical assembly according to one of the claims 20 to 22 is inserted.
  24. rack according to claim 23, characterized in that the rack a Wiring back wall having.
  25. Subrack according to claim 23 or 24, characterized in that the subrack ( 50 ) at least one other means ( 40 to 48 ) for generating a further air flow through each of the thermal zones ( 18 . 20 . 22 ), this means ( 40 to 48 ) is arranged for generating the air flow, preferably at the air inlet side, and between which means ( 40 to 48 ) and the assembly ( 10 ) preferably a filter element ( 58 . 60 ) is arranged, which has a substantially uniform air flow at least in the region of the slot of the assembly ( 10 ) causes in the rack.
  26. Subrack according to one of claims 22 to 25, characterized in that a plurality of identical slots in the rack ( 50 ) are provided, each forming an air passage through which cooling air flows, using the means provided ( 24 . 30 . 32 ) defined division of the air flow in partial air flows takes place, each thermal zone ( 18 . 20 . 22 ) of the assembly ( 10 ) one of these partial air flows is supplied.
  27. Subrack according to one of the preceding claims, characterized in that a supply voltage via an electrical connection element ( 15 . 16 . 17 ) from the rack ( 50 ) to the assembly ( 10 ), wherein the connecting element preferably has a connector.
DE200510056096 2005-11-24 2005-11-24 Cooling arrangement for at least one plugged into a rack electrical assembly and method for cooling such an electrical assembly and rack with an assembly Expired - Fee Related DE102005056096B4 (en)

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DE200510056096 DE102005056096B4 (en) 2005-11-24 2005-11-24 Cooling arrangement for at least one plugged into a rack electrical assembly and method for cooling such an electrical assembly and rack with an assembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510056096 DE102005056096B4 (en) 2005-11-24 2005-11-24 Cooling arrangement for at least one plugged into a rack electrical assembly and method for cooling such an electrical assembly and rack with an assembly
PCT/EP2006/068858 WO2007060212A2 (en) 2005-11-24 2006-11-23 Module for insertion in a rack and method for cooling said module

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DE102005056096B4 true DE102005056096B4 (en) 2009-05-14

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DE102012103113B3 (en) * 2012-04-11 2013-08-14 Fujitsu Technology Solutions Intellectual Property Gmbh Rackservereinschub

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DE502008001254D1 (en) 2008-03-03 2010-10-14 Schroff Gmbh Housing for receiving electronic plug-in modules

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US5210680A (en) * 1990-08-07 1993-05-11 Sulzer Brothers Limited Card cage having an air cooling system
US5828549A (en) * 1996-10-08 1998-10-27 Dell U.S.A., L.P. Combination heat sink and air duct for cooling processors with a series air flow
US5871396A (en) * 1997-08-12 1999-02-16 Shen; Tsan Jung Convection type heat dissipation device for computers that is adjustable with respect to a heat source
DE19832710A1 (en) * 1998-07-14 2000-01-27 Siemens Ag Electro-optical assembly for data transmission
DE29921448U1 (en) * 1999-12-08 2000-02-17 Pfannenberg Otto Gmbh Ventilation device for a housing
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DE202005009081U1 (en) * 2005-06-09 2005-09-01 Adlink Technology Inc., Chungho Effective cooling for computer electronics is in form of carrier having fan and heat sink and sits on mother board

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US4851965A (en) * 1987-03-09 1989-07-25 Unisys Corporation Directed air management system for cooling multiple heat sinks
DE4009445A1 (en) * 1989-04-20 1990-10-25 Siemens Ag Heat sink system for circuit boards - has profiled heat sink plate position on top of circuit board components
US5210680A (en) * 1990-08-07 1993-05-11 Sulzer Brothers Limited Card cage having an air cooling system
US5828549A (en) * 1996-10-08 1998-10-27 Dell U.S.A., L.P. Combination heat sink and air duct for cooling processors with a series air flow
US5871396A (en) * 1997-08-12 1999-02-16 Shen; Tsan Jung Convection type heat dissipation device for computers that is adjustable with respect to a heat source
DE19832710A1 (en) * 1998-07-14 2000-01-27 Siemens Ag Electro-optical assembly for data transmission
US6130820A (en) * 1999-05-04 2000-10-10 Intel Corporation Memory card cooling device
DE29921448U1 (en) * 1999-12-08 2000-02-17 Pfannenberg Otto Gmbh Ventilation device for a housing
EP1343204A1 (en) * 2000-12-11 2003-09-10 Fujitsu Limited Electronic device unit
US20020159232A1 (en) * 2001-04-30 2002-10-31 Beitelmal Abdlmonem H. Air jet cooling arrangement for electronic systems
DE202005009081U1 (en) * 2005-06-09 2005-09-01 Adlink Technology Inc., Chungho Effective cooling for computer electronics is in form of carrier having fan and heat sink and sits on mother board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012103113B3 (en) * 2012-04-11 2013-08-14 Fujitsu Technology Solutions Intellectual Property Gmbh Rackservereinschub

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DE102005056096A1 (en) 2007-05-31
WO2007060212A3 (en) 2007-08-23

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