DE4210835C1 - - Google Patents
Info
- Publication number
- DE4210835C1 DE4210835C1 DE4210835A DE4210835A DE4210835C1 DE 4210835 C1 DE4210835 C1 DE 4210835C1 DE 4210835 A DE4210835 A DE 4210835A DE 4210835 A DE4210835 A DE 4210835A DE 4210835 C1 DE4210835 C1 DE 4210835C1
- Authority
- DE
- Germany
- Prior art keywords
- cooling
- spider
- plate
- cooling plate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 claims description 25
- 241000239290 Araneae Species 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 8
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims description 3
- 239000011324 bead Substances 0.000 claims description 2
- 239000004575 stone Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4210835A DE4210835C1 (US08087162-20120103-C00010.png) | 1992-04-01 | 1992-04-01 | |
EP93104262A EP0563679A1 (de) | 1992-04-01 | 1993-03-16 | Einrichtung zum Kühlen von zu Flachbaugruppen zusammengefassten gehäuselosen integrierten Bausteinen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4210835A DE4210835C1 (US08087162-20120103-C00010.png) | 1992-04-01 | 1992-04-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE4210835C1 true DE4210835C1 (US08087162-20120103-C00010.png) | 1993-06-17 |
Family
ID=6455727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE4210835A Expired - Fee Related DE4210835C1 (US08087162-20120103-C00010.png) | 1992-04-01 | 1992-04-01 |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0563679A1 (US08087162-20120103-C00010.png) |
DE (1) | DE4210835C1 (US08087162-20120103-C00010.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10227008B4 (de) | 2002-06-18 | 2012-10-18 | Robert Bosch Gmbh | Kühlvorrichtung für Halbleitermodule und Elektronikanordnung |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5772357A (en) * | 1980-10-24 | 1982-05-06 | Nec Corp | Mounting method of integrated circuit |
EP0241290A1 (en) * | 1986-04-09 | 1987-10-14 | Nec Corporation | Cooling system for electronic components |
EP0103068B1 (de) * | 1982-09-09 | 1989-01-04 | Siemens Aktiengesellschaft | Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen |
WO1989008327A1 (en) * | 1988-03-01 | 1989-09-08 | Digital Equipment Corporation | Method and apparatus for packaging and cooling integrated circuit chips |
US4884630A (en) * | 1988-07-14 | 1989-12-05 | Microelectronics And Computer Technology Corporation | End fed liquid heat exchanger for an electronic component |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4758926A (en) * | 1986-03-31 | 1988-07-19 | Microelectronics And Computer Technology Corporation | Fluid-cooled integrated circuit package |
-
1992
- 1992-04-01 DE DE4210835A patent/DE4210835C1/de not_active Expired - Fee Related
-
1993
- 1993-03-16 EP EP93104262A patent/EP0563679A1/de not_active Ceased
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5772357A (en) * | 1980-10-24 | 1982-05-06 | Nec Corp | Mounting method of integrated circuit |
EP0103068B1 (de) * | 1982-09-09 | 1989-01-04 | Siemens Aktiengesellschaft | Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen |
EP0241290A1 (en) * | 1986-04-09 | 1987-10-14 | Nec Corporation | Cooling system for electronic components |
WO1989008327A1 (en) * | 1988-03-01 | 1989-09-08 | Digital Equipment Corporation | Method and apparatus for packaging and cooling integrated circuit chips |
US4884630A (en) * | 1988-07-14 | 1989-12-05 | Microelectronics And Computer Technology Corporation | End fed liquid heat exchanger for an electronic component |
Non-Patent Citations (1)
Title |
---|
Patents Abstracts of Japan, E-124 & JP-A-57 072 357 * |
Also Published As
Publication number | Publication date |
---|---|
EP0563679A1 (de) | 1993-10-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8100 | Publication of patent without earlier publication of application | ||
D1 | Grant (no unexamined application published) patent law 81 | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |