DE4137232C1 - - Google Patents
Info
- Publication number
- DE4137232C1 DE4137232C1 DE4137232A DE4137232A DE4137232C1 DE 4137232 C1 DE4137232 C1 DE 4137232C1 DE 4137232 A DE4137232 A DE 4137232A DE 4137232 A DE4137232 A DE 4137232A DE 4137232 C1 DE4137232 C1 DE 4137232C1
- Authority
- DE
- Germany
- Prior art keywords
- temperature
- radiation
- bond
- laser
- hold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 claims description 17
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052693 Europium Inorganic materials 0.000 claims description 4
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 4
- 230000002688 persistence Effects 0.000 claims description 3
- 230000001419 dependent effect Effects 0.000 claims description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 2
- 229910000164 yttrium(III) phosphate Inorganic materials 0.000 claims description 2
- UXBZSSBXGPYSIL-UHFFFAOYSA-K yttrium(iii) phosphate Chemical compound [Y+3].[O-]P([O-])([O-])=O UXBZSSBXGPYSIL-UHFFFAOYSA-K 0.000 claims description 2
- 238000005299 abrasion Methods 0.000 claims 1
- 230000001464 adherent effect Effects 0.000 claims 1
- 229910000510 noble metal Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 6
- 238000009529 body temperature measurement Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4137232A DE4137232C1 (enrdf_load_stackoverflow) | 1991-11-13 | 1991-11-13 | |
| FR9213488A FR2683474B1 (fr) | 1991-11-13 | 1992-11-09 | Procede et dispositif de commande de temperature pour le micro-usinage par laser de materiaux. |
| GB9223711A GB2261622B (en) | 1991-11-13 | 1992-11-12 | Method of and apparatus for temperature control in laser micro-processing of material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4137232A DE4137232C1 (enrdf_load_stackoverflow) | 1991-11-13 | 1991-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE4137232C1 true DE4137232C1 (enrdf_load_stackoverflow) | 1993-05-06 |
Family
ID=6444647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE4137232A Expired - Fee Related DE4137232C1 (enrdf_load_stackoverflow) | 1991-11-13 | 1991-11-13 |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE4137232C1 (enrdf_load_stackoverflow) |
| FR (1) | FR2683474B1 (enrdf_load_stackoverflow) |
| GB (1) | GB2261622B (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1806199A3 (en) * | 2006-01-10 | 2007-08-22 | Honeywell International Inc. | System and Method for Blind Laser Brazing |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112345115B (zh) * | 2020-09-17 | 2021-09-14 | 燕山大学 | 一种基于双发光中心纳米晶近红外荧光的高灵敏测温方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4341942A (en) * | 1978-10-31 | 1982-07-27 | International Business Machines Corporation | Method of bonding wires to passivated chip microcircuit conductors |
| US4845354A (en) * | 1988-03-08 | 1989-07-04 | International Business Machines Corporation | Process control for laser wire bonding |
| US4873414A (en) * | 1988-06-13 | 1989-10-10 | Rolls Royce Inc. | Laser drilling of components |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5565287A (en) * | 1978-06-28 | 1980-05-16 | Teijin Ltd | Heat-sensitive fluorescent material |
| DE3247338A1 (de) * | 1982-12-21 | 1984-06-28 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum laserloeten von flexiblen verdrahtungen |
| DE4105874C1 (enrdf_load_stackoverflow) * | 1991-02-25 | 1992-07-30 | Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De | |
| DE4105875C1 (enrdf_load_stackoverflow) * | 1991-02-25 | 1992-08-13 | Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De |
-
1991
- 1991-11-13 DE DE4137232A patent/DE4137232C1/de not_active Expired - Fee Related
-
1992
- 1992-11-09 FR FR9213488A patent/FR2683474B1/fr not_active Expired - Fee Related
- 1992-11-12 GB GB9223711A patent/GB2261622B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4341942A (en) * | 1978-10-31 | 1982-07-27 | International Business Machines Corporation | Method of bonding wires to passivated chip microcircuit conductors |
| US4845354A (en) * | 1988-03-08 | 1989-07-04 | International Business Machines Corporation | Process control for laser wire bonding |
| US4873414A (en) * | 1988-06-13 | 1989-10-10 | Rolls Royce Inc. | Laser drilling of components |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1806199A3 (en) * | 2006-01-10 | 2007-08-22 | Honeywell International Inc. | System and Method for Blind Laser Brazing |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2261622A (en) | 1993-05-26 |
| FR2683474B1 (fr) | 1995-11-24 |
| FR2683474A1 (fr) | 1993-05-14 |
| GB2261622B (en) | 1995-01-11 |
| GB9223711D0 (en) | 1992-12-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8100 | Publication of the examined application without publication of unexamined application | ||
| D1 | Grant (no unexamined application published) patent law 81 | ||
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILB |
|
| 8320 | Willingness to grant licenses declared (paragraph 23) | ||
| 8339 | Ceased/non-payment of the annual fee |