GB2261622B - Method of and apparatus for temperature control in laser micro-processing of material - Google Patents

Method of and apparatus for temperature control in laser micro-processing of material

Info

Publication number
GB2261622B
GB2261622B GB9223711A GB9223711A GB2261622B GB 2261622 B GB2261622 B GB 2261622B GB 9223711 A GB9223711 A GB 9223711A GB 9223711 A GB9223711 A GB 9223711A GB 2261622 B GB2261622 B GB 2261622B
Authority
GB
United Kingdom
Prior art keywords
processing
temperature control
laser micro
micro
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9223711A
Other languages
English (en)
Other versions
GB2261622A (en
GB9223711D0 (en
Inventor
Werner Moeller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Defence and Space GmbH
Original Assignee
Deutsche Aerospace AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Aerospace AG filed Critical Deutsche Aerospace AG
Publication of GB9223711D0 publication Critical patent/GB9223711D0/en
Publication of GB2261622A publication Critical patent/GB2261622A/en
Application granted granted Critical
Publication of GB2261622B publication Critical patent/GB2261622B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/32Bonding taking account of the properties of the material involved

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
GB9223711A 1991-11-13 1992-11-12 Method of and apparatus for temperature control in laser micro-processing of material Expired - Fee Related GB2261622B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4137232A DE4137232C1 (enrdf_load_stackoverflow) 1991-11-13 1991-11-13

Publications (3)

Publication Number Publication Date
GB9223711D0 GB9223711D0 (en) 1992-12-23
GB2261622A GB2261622A (en) 1993-05-26
GB2261622B true GB2261622B (en) 1995-01-11

Family

ID=6444647

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9223711A Expired - Fee Related GB2261622B (en) 1991-11-13 1992-11-12 Method of and apparatus for temperature control in laser micro-processing of material

Country Status (3)

Country Link
DE (1) DE4137232C1 (enrdf_load_stackoverflow)
FR (1) FR2683474B1 (enrdf_load_stackoverflow)
GB (1) GB2261622B (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070158316A1 (en) * 2006-01-10 2007-07-12 Honeywell International Inc. System and method for blind laser brazing
CN112345115B (zh) * 2020-09-17 2021-09-14 燕山大学 一种基于双发光中心纳米晶近红外荧光的高灵敏测温方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5565287A (en) * 1978-06-28 1980-05-16 Teijin Ltd Heat-sensitive fluorescent material
US4341942A (en) * 1978-10-31 1982-07-27 International Business Machines Corporation Method of bonding wires to passivated chip microcircuit conductors
DE3247338A1 (de) * 1982-12-21 1984-06-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum laserloeten von flexiblen verdrahtungen
US4845354A (en) * 1988-03-08 1989-07-04 International Business Machines Corporation Process control for laser wire bonding
US4873414A (en) * 1988-06-13 1989-10-10 Rolls Royce Inc. Laser drilling of components
DE4105874C1 (enrdf_load_stackoverflow) * 1991-02-25 1992-07-30 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De
DE4105875C1 (enrdf_load_stackoverflow) * 1991-02-25 1992-08-13 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De

Also Published As

Publication number Publication date
DE4137232C1 (enrdf_load_stackoverflow) 1993-05-06
GB2261622A (en) 1993-05-26
FR2683474B1 (fr) 1995-11-24
FR2683474A1 (fr) 1993-05-14
GB9223711D0 (en) 1992-12-23

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19971112