DE4135939C2 - - Google Patents

Info

Publication number
DE4135939C2
DE4135939C2 DE4135939A DE4135939A DE4135939C2 DE 4135939 C2 DE4135939 C2 DE 4135939C2 DE 4135939 A DE4135939 A DE 4135939A DE 4135939 A DE4135939 A DE 4135939A DE 4135939 C2 DE4135939 C2 DE 4135939C2
Authority
DE
Germany
Prior art keywords
target
pole
sputtering
cathode
pole shoes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4135939A
Other languages
German (de)
English (en)
Other versions
DE4135939A1 (de
Inventor
Eggo 6460 Gelnhausen De Sichmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balzers und Leybold Deutschland Holding AG
Original Assignee
Leybold AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold AG filed Critical Leybold AG
Priority to DE4135939A priority Critical patent/DE4135939A1/de
Priority to US07/827,134 priority patent/US5266178A/en
Priority to EP92106387A priority patent/EP0539650A1/de
Priority to JP4127472A priority patent/JPH06235063A/ja
Publication of DE4135939A1 publication Critical patent/DE4135939A1/de
Application granted granted Critical
Publication of DE4135939C2 publication Critical patent/DE4135939C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/347—Thickness uniformity of coated layers or desired profile of target erosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
DE4135939A 1991-10-31 1991-10-31 Zerstaeubungskathode Granted DE4135939A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE4135939A DE4135939A1 (de) 1991-10-31 1991-10-31 Zerstaeubungskathode
US07/827,134 US5266178A (en) 1991-10-31 1992-01-28 Sputtering cathode
EP92106387A EP0539650A1 (de) 1991-10-31 1992-04-14 Zerstäubungskathode
JP4127472A JPH06235063A (ja) 1991-10-31 1992-05-20 スパッタリング陰極

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4135939A DE4135939A1 (de) 1991-10-31 1991-10-31 Zerstaeubungskathode

Publications (2)

Publication Number Publication Date
DE4135939A1 DE4135939A1 (de) 1993-05-06
DE4135939C2 true DE4135939C2 (US06589383-20030708-C00041.png) 1993-08-12

Family

ID=6443857

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4135939A Granted DE4135939A1 (de) 1991-10-31 1991-10-31 Zerstaeubungskathode

Country Status (4)

Country Link
US (1) US5266178A (US06589383-20030708-C00041.png)
EP (1) EP0539650A1 (US06589383-20030708-C00041.png)
JP (1) JPH06235063A (US06589383-20030708-C00041.png)
DE (1) DE4135939A1 (US06589383-20030708-C00041.png)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1067118C (zh) * 1994-07-08 2001-06-13 松下电器产业株式会社 磁控管溅射装置
US5441614A (en) * 1994-11-30 1995-08-15 At&T Corp. Method and apparatus for planar magnetron sputtering
GB2318590B (en) * 1995-07-10 1999-04-14 Cvc Products Inc Magnetron cathode apparatus and method for sputtering
US6221217B1 (en) 1995-07-10 2001-04-24 Cvc, Inc. Physical vapor deposition system having reduced thickness backing plate
DE19627533A1 (de) * 1996-07-09 1998-01-15 Leybold Materials Gmbh Target für die Sputterkathode einer Vakuumbeschichtungsanlage und Verfahren zu seiner Herstellung
DE19738815A1 (de) * 1997-09-05 1999-03-11 Leybold Ag Verfahren zur Montage von Targetsegmenten und Justierbolzen zur Durchführung des Verfahrens
IL127236A0 (en) 1997-11-26 1999-09-22 Vapor Technologies Inc Apparatus for sputtering or arc evaporation
US6066242A (en) * 1998-06-10 2000-05-23 David A. Glocker Conical sputtering target
US5997705A (en) * 1999-04-14 1999-12-07 Vapor Technologies, Inc. Rectangular filtered arc plasma source
US6783638B2 (en) * 2001-09-07 2004-08-31 Sputtered Films, Inc. Flat magnetron
GB0126721D0 (en) * 2001-11-07 2002-01-02 Bellido Gonzalez V Ferromagnetic magnetron
EP1336985A1 (de) * 2002-02-19 2003-08-20 Singulus Technologies AG Zerstäubungskathode und Vorrichtung und Verfahren zum Beschichten eines Substrates mit mehreren Schichten
US20040055883A1 (en) * 2002-03-02 2004-03-25 Shinzo Onishi Magnetron sputtering target for non-magnetic materials
DE10234858A1 (de) * 2002-07-31 2004-02-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Einrichtung zur Erzeugung einer Magnetron-Entladung
US7498587B2 (en) * 2006-05-01 2009-03-03 Vapor Technologies, Inc. Bi-directional filtered arc plasma source
US20080083611A1 (en) * 2006-10-06 2008-04-10 Tegal Corporation High-adhesive backside metallization
US8808513B2 (en) * 2008-03-25 2014-08-19 Oem Group, Inc Stress adjustment in reactive sputtering
US20090246385A1 (en) * 2008-03-25 2009-10-01 Tegal Corporation Control of crystal orientation and stress in sputter deposited thin films
CN101525737B (zh) * 2009-01-19 2011-05-25 中国电子科技集团公司第四十八研究所 一种用于镀制贵金属膜的磁控溅射靶
US8482375B2 (en) * 2009-05-24 2013-07-09 Oem Group, Inc. Sputter deposition of cermet resistor films with low temperature coefficient of resistance
WO2011062943A2 (en) * 2009-11-18 2011-05-26 Applied Materials, Inc. Planar magnetron sputtering source producing high target utilization and stable coating uniformity over lifetime

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3884793A (en) * 1971-09-07 1975-05-20 Telic Corp Electrode type glow discharge apparatus
US4194962A (en) * 1978-12-20 1980-03-25 Advanced Coating Technology, Inc. Cathode for sputtering
JPS5952957B2 (ja) * 1980-06-16 1984-12-22 日電アネルバ株式会社 マグネトロン型スパッタ装置のカソ−ド部
JPS58221275A (ja) * 1982-06-16 1983-12-22 Anelva Corp スパツタリング装置
US4391697A (en) * 1982-08-16 1983-07-05 Vac-Tec Systems, Inc. High rate magnetron sputtering of high permeability materials
DE3411536A1 (de) * 1983-07-06 1985-01-17 Leybold-Heraeus GmbH, 5000 Köln Magnetronkatode fuer katodenzerstaeubungsanlagen
US4515675A (en) * 1983-07-06 1985-05-07 Leybold-Heraeus Gmbh Magnetron cathode for cathodic evaportion apparatus
DE3429988A1 (de) * 1983-12-05 1985-06-13 Leybold-Heraeus GmbH, 5000 Köln Magnetronkatode zum zerstaeuben ferromagnetischer targets
DE3480245D1 (en) * 1983-12-05 1989-11-23 Leybold Ag Magnetron-cathodes for the sputtering of ferromagnetic targets
DE3527626A1 (de) * 1985-08-01 1987-02-05 Leybold Heraeus Gmbh & Co Kg Zerstaeubungskatode nach dem magnetronprinzip
JPS6393881A (ja) * 1986-10-08 1988-04-25 Anelva Corp プラズマ処理装置
JPH0285354A (ja) * 1988-09-19 1990-03-26 Daido Steel Co Ltd 黒色被膜コーティング方法
JPH02194171A (ja) * 1989-01-20 1990-07-31 Ulvac Corp マグネトロンスパッタリング源

Also Published As

Publication number Publication date
EP0539650A1 (de) 1993-05-05
US5266178A (en) 1993-11-30
JPH06235063A (ja) 1994-08-23
DE4135939A1 (de) 1993-05-06

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: BALZERS UND LEYBOLD DEUTSCHLAND HOLDING AG, 63450

8339 Ceased/non-payment of the annual fee