DE4123911C1 - - Google Patents

Info

Publication number
DE4123911C1
DE4123911C1 DE4123911A DE4123911A DE4123911C1 DE 4123911 C1 DE4123911 C1 DE 4123911C1 DE 4123911 A DE4123911 A DE 4123911A DE 4123911 A DE4123911 A DE 4123911A DE 4123911 C1 DE4123911 C1 DE 4123911C1
Authority
DE
Germany
Prior art keywords
nickel
copper
thin
plated
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4123911A
Other languages
German (de)
English (en)
Inventor
Karl Dipl.-Phys. Dr. 6149 Rimbach De Exel
Peter Dipl.-Ing. 7540 Neuenbuerg De Laipple
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doduco and Co Dr Eugen Duerrwaechter 7530 Pforzheim De GmbH
Original Assignee
Doduco and Co Dr Eugen Duerrwaechter 7530 Pforzheim De GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doduco and Co Dr Eugen Duerrwaechter 7530 Pforzheim De GmbH filed Critical Doduco and Co Dr Eugen Duerrwaechter 7530 Pforzheim De GmbH
Priority to DE4123911A priority Critical patent/DE4123911C1/de
Priority to EP19920111676 priority patent/EP0523547A3/de
Application granted granted Critical
Publication of DE4123911C1 publication Critical patent/DE4123911C1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/047—Attaching leadframes to insulating supports, e.g. for tape automated bonding [TAB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
DE4123911A 1991-07-18 1991-07-18 Expired - Fee Related DE4123911C1 (enExample)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE4123911A DE4123911C1 (enExample) 1991-07-18 1991-07-18
EP19920111676 EP0523547A3 (en) 1991-07-18 1992-07-09 Electroless nickel plated dcb substrate and method of connecting the same with fine wires

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4123911A DE4123911C1 (enExample) 1991-07-18 1991-07-18

Publications (1)

Publication Number Publication Date
DE4123911C1 true DE4123911C1 (enExample) 1993-01-14

Family

ID=6436509

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4123911A Expired - Fee Related DE4123911C1 (enExample) 1991-07-18 1991-07-18

Country Status (2)

Country Link
EP (1) EP0523547A3 (enExample)
DE (1) DE4123911C1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0701281A2 (de) 1994-09-07 1996-03-13 W.C. Heraeus GmbH Substrat mit bondfähiger Beschichtung
DE19827521C1 (de) * 1998-06-22 1999-07-29 Heraeus Gmbh W C Verfahren zur Herstellung einer gebondeten, aluminiumhaltiges Material enthaltenden Vorrichtung
DE102006004322A1 (de) * 2006-01-31 2007-08-16 Häusermann GmbH Leiterplatte mit zusätzlichen funktionalen Elementen sowie Herstellverfahren und Anwendung
DE102013207721A1 (de) * 2013-04-26 2014-10-30 Infineon Technologies Ag Bondverbindung und Bondverfahren

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0862209B1 (de) * 1997-03-01 2009-12-16 Electrovac AG Verfahren zum Herstellen eines Metall-Keramik-Substrates
US6790757B1 (en) * 1999-12-20 2004-09-14 Agere Systems Inc. Wire bonding method for copper interconnects in semiconductor devices
DE202004008563U1 (de) * 2004-05-29 2004-08-12 Ixys Semiconductor Gmbh Solarmodul mit einem Substratträger aus Keramik
DE102005045100A1 (de) * 2005-09-21 2007-03-29 Infineon Technologies Ag Verfahren zum Herstellen eines Leistungshalbleitermoduls

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3728096C1 (en) * 1987-07-03 1989-01-12 Duerrwaechter E Dr Doduco Flat body, especially for use as a heat sink for electronic power components

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01272183A (ja) * 1988-04-25 1989-10-31 Toshiba Corp セラミックス回路基板
DE69233801D1 (de) * 1991-07-24 2011-02-17 Denki Kagaku Kogyo Kk Verfahren zur Herstellung eines Schaltungssubstrates mit einem montierten Halbleiterelement

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3728096C1 (en) * 1987-07-03 1989-01-12 Duerrwaechter E Dr Doduco Flat body, especially for use as a heat sink for electronic power components

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0701281A2 (de) 1994-09-07 1996-03-13 W.C. Heraeus GmbH Substrat mit bondfähiger Beschichtung
DE4431847A1 (de) * 1994-09-07 1996-03-14 Heraeus Gmbh W C Substrat mit bondfähiger Beschichtung
DE4431847C2 (de) * 1994-09-07 2002-08-08 Heraeus Gmbh W C Substrat mit bondfähiger Beschichtung
DE4431847C5 (de) * 1994-09-07 2011-01-27 Atotech Deutschland Gmbh Substrat mit bondfähiger Beschichtung
DE19827521C1 (de) * 1998-06-22 1999-07-29 Heraeus Gmbh W C Verfahren zur Herstellung einer gebondeten, aluminiumhaltiges Material enthaltenden Vorrichtung
DE102006004322A1 (de) * 2006-01-31 2007-08-16 Häusermann GmbH Leiterplatte mit zusätzlichen funktionalen Elementen sowie Herstellverfahren und Anwendung
DE102013207721A1 (de) * 2013-04-26 2014-10-30 Infineon Technologies Ag Bondverbindung und Bondverfahren

Also Published As

Publication number Publication date
EP0523547A2 (de) 1993-01-20
EP0523547A3 (en) 1993-10-06

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Legal Events

Date Code Title Description
8100 Publication of patent without earlier publication of application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee
8370 Indication related to discontinuation of the patent is to be deleted
8339 Ceased/non-payment of the annual fee