DE3887232D1 - Verfahren zur Herstellung von Bildsensorbauelementen, die zu Modulen zusammengesetzt werden. - Google Patents
Verfahren zur Herstellung von Bildsensorbauelementen, die zu Modulen zusammengesetzt werden.Info
- Publication number
- DE3887232D1 DE3887232D1 DE88307937T DE3887232T DE3887232D1 DE 3887232 D1 DE3887232 D1 DE 3887232D1 DE 88307937 T DE88307937 T DE 88307937T DE 3887232 T DE3887232 T DE 3887232T DE 3887232 D1 DE3887232 D1 DE 3887232D1
- Authority
- DE
- Germany
- Prior art keywords
- modules
- assembled
- production
- image sensor
- sensor components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27G—ACCESSORY MACHINES OR APPARATUS FOR WORKING WOOD OR SIMILAR MATERIALS; TOOLS FOR WORKING WOOD OR SIMILAR MATERIALS; SAFETY DEVICES FOR WOOD WORKING MACHINES OR TOOLS
- B27G19/00—Safety guards or devices specially adapted for wood saws; Auxiliary devices facilitating proper operation of wood saws
- B27G19/10—Measures preventing splintering of sawn portions of wood
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/028—Dicing
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Forests & Forestry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Wood Science & Technology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Dicing (AREA)
- Weting (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/090,827 US4814296A (en) | 1987-08-28 | 1987-08-28 | Method of fabricating image sensor dies for use in assembling arrays |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3887232D1 true DE3887232D1 (de) | 1994-03-03 |
DE3887232T2 DE3887232T2 (de) | 1994-06-16 |
Family
ID=22224512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3887232T Expired - Fee Related DE3887232T2 (de) | 1987-08-28 | 1988-08-26 | Verfahren zur Herstellung von Bildsensorbauelementen, die zu Modulen zusammengesetzt werden. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4814296A (de) |
EP (1) | EP0305204B1 (de) |
JP (1) | JPH0834197B2 (de) |
DE (1) | DE3887232T2 (de) |
Families Citing this family (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5637175A (en) * | 1988-10-05 | 1997-06-10 | Helisys Corporation | Apparatus for forming an integral object from laminations |
US5876550A (en) * | 1988-10-05 | 1999-03-02 | Helisys, Inc. | Laminated object manufacturing apparatus and method |
AU4504089A (en) * | 1988-10-05 | 1990-05-01 | Michael Feygin | An improved apparatus and method for forming an integral object from laminations |
US4966862A (en) * | 1989-08-28 | 1990-10-30 | Cree Research, Inc. | Method of production of light emitting diodes |
US5034083A (en) * | 1989-10-16 | 1991-07-23 | Xerox Corporation | Process and apparatus for assembling smaller scanning or printing arrays together to form an extended array |
US4976802A (en) * | 1989-10-16 | 1990-12-11 | Xerox Corporation | Process for assembling smaller scanning or printing arrays together to form a longer array |
US4997793A (en) * | 1989-11-21 | 1991-03-05 | Eastman Kodak Company | Method of improving cleaving of diode arrays |
US5053836A (en) * | 1989-11-21 | 1991-10-01 | Eastman Kodak Company | Cleaving of diode arrays with scribing channels |
US4997792A (en) * | 1989-11-21 | 1991-03-05 | Eastman Kodak Company | Method for separation of diode array chips during fabrication thereof |
US5000811A (en) * | 1989-11-22 | 1991-03-19 | Xerox Corporation | Precision buttable subunits via dicing |
US5031032A (en) * | 1990-03-30 | 1991-07-09 | Xerox Corporation | Color array for use in fabricating full width arrays |
US5119181A (en) * | 1990-03-30 | 1992-06-02 | Xerox Corporation | Color array for use in fabricating full width arrays |
US5041190A (en) * | 1990-05-16 | 1991-08-20 | Xerox Corporation | Method of fabricating channel plates and ink jet printheads containing channel plates |
EP0477600A1 (de) * | 1990-09-26 | 1992-04-01 | Siemens Aktiengesellschaft | Verfahren zum Befestigen eines mit wenigstens einem Halbleiterbauelement versehenen Halbleiterkörpers auf einem Substrat |
US5192959A (en) * | 1991-06-03 | 1993-03-09 | Xerox Corporation | Alignment of pagewidth bars |
US5160403A (en) * | 1991-08-09 | 1992-11-03 | Xerox Corporation | Precision diced aligning surfaces for devices such as ink jet printheads |
US5128282A (en) * | 1991-11-04 | 1992-07-07 | Xerox Corporation | Process for separating image sensor dies and the like from a wafer that minimizes silicon waste |
US5219796A (en) * | 1991-11-04 | 1993-06-15 | Xerox Corporation | Method of fabricating image sensor dies and the like for use in assembling arrays |
EP0573724B1 (de) * | 1992-06-09 | 1995-09-13 | International Business Machines Corporation | Herstellung von Laserdioden mit durch Spaltung erzeugten Stirnflächen auf einem vollständigen Wafer |
DE4220284C1 (de) * | 1992-06-20 | 1993-09-30 | Bosch Gmbh Robert | Verfahren zum Zerteilen von Verbundwafern |
US5272113A (en) * | 1992-11-12 | 1993-12-21 | Xerox Corporation | Method for minimizing stress between semiconductor chips having a coefficient of thermal expansion different from that of a mounting substrate |
JP2868384B2 (ja) * | 1993-02-23 | 1999-03-10 | 株式会社東京精密 | ダイシング溝の深さ測定方法及びダイシング装置 |
FR2707401B1 (fr) * | 1993-07-09 | 1995-08-11 | Menigaux Louis | Procédé de fabrication d'une structure intégrant un guide optique clivé à un support de fibre optique pour un couplage optique guide-fibre et structure obtenue. |
US5580831A (en) * | 1993-07-28 | 1996-12-03 | Fujitsu Limited | Sawcut method of forming alignment marks on two faces of a substrate |
US5462636A (en) * | 1993-12-28 | 1995-10-31 | International Business Machines Corporation | Method for chemically scribing wafers |
US5654204A (en) * | 1994-07-20 | 1997-08-05 | Anderson; James C. | Die sorter |
US5620614A (en) * | 1995-01-03 | 1997-04-15 | Xerox Corporation | Printhead array and method of producing a printhead die assembly that minimizes end channel damage |
US6165813A (en) * | 1995-04-03 | 2000-12-26 | Xerox Corporation | Replacing semiconductor chips in a full-width chip array |
US5510273A (en) * | 1995-04-03 | 1996-04-23 | Xerox Corporation | Process of mounting semiconductor chips in a full-width-array image |
SG67365A1 (en) * | 1995-11-21 | 1999-09-21 | Texas Instruments Inc | Trench scribe line for decreased chip spacing |
DE19601261C1 (de) * | 1996-01-16 | 1997-04-10 | Itt Ind Gmbh Deutsche | Verfahren und Hilfsvorrichtung zum Herstellen von Halbleiterschaltungselementen |
US5730817A (en) * | 1996-04-22 | 1998-03-24 | Helisys, Inc. | Laminated object manufacturing system |
US5904548A (en) * | 1996-11-21 | 1999-05-18 | Texas Instruments Incorporated | Trench scribe line for decreased chip spacing |
US6127245A (en) * | 1997-02-04 | 2000-10-03 | Micron Technology, Inc. | Grinding technique for integrated circuits |
US6075280A (en) * | 1997-12-31 | 2000-06-13 | Winbond Electronics Corporation | Precision breaking of semiconductor wafer into chips by applying an etch process |
JP3497722B2 (ja) * | 1998-02-27 | 2004-02-16 | 富士通株式会社 | 半導体装置及びその製造方法及びその搬送トレイ |
US6271102B1 (en) | 1998-02-27 | 2001-08-07 | International Business Machines Corporation | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
US6069973A (en) * | 1998-06-30 | 2000-05-30 | Xerox Corporation | Method and apparatus for color correction in a multi-chip imaging array |
US6201293B1 (en) | 1998-11-19 | 2001-03-13 | Xerox Corporation | Electro optical devices with reduced filter thinning on the edge pixel photosites and method of producing same |
US6198093B1 (en) | 1998-11-19 | 2001-03-06 | Xerox Corporation | Electro optical devices with reduced filter thinning on the edge pixel photosites and method of producing same |
TWI228780B (en) * | 2000-05-11 | 2005-03-01 | Disco Corp | Semiconductor wafer dividing method |
US6528336B2 (en) | 2000-05-23 | 2003-03-04 | Xerox Corporation | Method for fabrication of a silicon photosensor array on a wafer and testing the same |
US6670598B1 (en) | 2000-09-06 | 2003-12-30 | Xerox Corporation | Low power autozero of pixel amplifier |
US6768565B1 (en) | 2000-09-07 | 2004-07-27 | Xerox Corporation | Infrared correction in color scanners |
US6316284B1 (en) | 2000-09-07 | 2001-11-13 | Xerox Corporation | Infrared correction in color scanners |
US6747259B1 (en) | 2000-10-03 | 2004-06-08 | Xerox Corporation | Assembly of imaging arrays for large format documents |
US6342403B1 (en) | 2000-12-14 | 2002-01-29 | Xerox Corporation | Electrical detection of V-groove width |
US6396297B1 (en) | 2000-12-14 | 2002-05-28 | Xerox Corporation | Electrical detection of V-groove width |
WO2002091444A2 (en) * | 2001-05-04 | 2002-11-14 | L3 Optics, Inc. | Method for separating silica waveguides |
JP2003100666A (ja) * | 2001-09-26 | 2003-04-04 | Toshiba Corp | 半導体装置の製造方法 |
US6955989B2 (en) * | 2001-11-30 | 2005-10-18 | Xerox Corporation | Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in silicon |
US20040235272A1 (en) * | 2003-05-23 | 2004-11-25 | Howard Gregory E. | Scribe street width reduction by deep trench and shallow saw cut |
US7232957B2 (en) * | 2003-09-25 | 2007-06-19 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device and method of manufacturing the same |
CN100454494C (zh) * | 2003-12-05 | 2009-01-21 | 昭和电工株式会社 | 半导体芯片的制造方法以及半导体芯片 |
US20060057777A1 (en) * | 2004-09-14 | 2006-03-16 | Howell William C | Separating die on a substrate to reduce backside chipping |
US7468284B2 (en) * | 2005-02-28 | 2008-12-23 | Silverbrook Research Pty Ltd | Method of bonding substrates |
US7287831B2 (en) * | 2005-02-28 | 2007-10-30 | Silverbrook Research Pty Ltd | Printhead integrated circuit adapted for adhesive bonding |
WO2006089337A1 (en) | 2005-02-28 | 2006-08-31 | Silverbrook Research Pty Ltd | Method of bonding substrates |
US7858493B2 (en) * | 2007-02-23 | 2010-12-28 | Finisar Corporation | Cleaving edge-emitting lasers from a wafer cell |
US8129258B2 (en) * | 2009-12-23 | 2012-03-06 | Xerox Corporation | Method for dicing a semiconductor wafer, a chip diced from a semiconductor wafer, and an array of chips diced from a semiconductor wafer |
US8801889B2 (en) * | 2011-02-04 | 2014-08-12 | Apple Inc. | Water jet shaping of displays and structures for electronic devices |
US8836478B2 (en) * | 2011-09-25 | 2014-09-16 | Authentec, Inc. | Electronic device including finger sensor and related methods |
US9806219B2 (en) | 2013-02-14 | 2017-10-31 | Apple Inc. | Displays with camera window openings |
JP5637329B1 (ja) * | 2013-07-01 | 2014-12-10 | 富士ゼロックス株式会社 | 半導体片の製造方法、半導体片を含む回路基板および画像形成装置 |
WO2015019540A1 (ja) * | 2013-08-08 | 2015-02-12 | シャープ株式会社 | 半導体素子基板およびその製造方法 |
KR102194727B1 (ko) | 2015-04-29 | 2020-12-23 | 삼성전기주식회사 | 인덕터 |
US10242912B2 (en) * | 2016-07-08 | 2019-03-26 | Analog Devices, Inc. | Integrated device dies and methods for singulating the same |
JP6814646B2 (ja) * | 2017-01-23 | 2021-01-20 | 株式会社ディスコ | 光デバイスウェーハの加工方法 |
US10943895B2 (en) * | 2019-01-14 | 2021-03-09 | Xerox Corporation | Method of fabricating a plurality of linear arrays with submicron y-axis alignment |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3078559A (en) * | 1959-04-13 | 1963-02-26 | Sylvania Electric Prod | Method for preparing semiconductor elements |
GB1118536A (en) * | 1966-09-30 | 1968-07-03 | Standard Telephones Cables Ltd | Improvements in or relating to semiconductor devices |
DE1652512B2 (de) * | 1967-05-29 | 1976-08-26 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von halbleiterbauelementen |
US3628107A (en) * | 1969-05-05 | 1971-12-14 | Gen Electric | Passivated semiconductor device with peripheral protective junction |
US3628106A (en) * | 1969-05-05 | 1971-12-14 | Gen Electric | Passivated semiconductor device with protective peripheral junction portion |
US3579815A (en) * | 1969-08-20 | 1971-05-25 | Gen Electric | Process for wafer fabrication of high blocking voltage silicon elements |
US3608186A (en) * | 1969-10-30 | 1971-09-28 | Jearld L Hutson | Semiconductor device manufacture with junction passivation |
US3698080A (en) * | 1970-11-02 | 1972-10-17 | Gen Electric | Process for forming low impedance ohmic attachments |
US3852876A (en) * | 1973-01-02 | 1974-12-10 | Gen Electric | High voltage power transistor and method for making |
US3838501A (en) * | 1973-02-09 | 1974-10-01 | Honeywell Inf Systems | Method in microcircuit package assembly providing nonabrasive, electrically passive edges on integrated circuit chips |
US3972113A (en) * | 1973-05-14 | 1976-08-03 | Mitsubishi Denki Kabushiki Kaisha | Process of producing semiconductor devices |
US4179794A (en) * | 1975-07-23 | 1979-12-25 | Nippon Gakki Seizo Kabushiki Kaisha | Process of manufacturing semiconductor devices |
US4033027A (en) * | 1975-09-26 | 1977-07-05 | Bell Telephone Laboratories, Incorporated | Dividing metal plated semiconductor wafers |
JPS584814B2 (ja) * | 1976-04-27 | 1983-01-27 | 三菱電機株式会社 | 半導体装置 |
DE2633324C2 (de) * | 1976-07-24 | 1983-09-15 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Verfahren zum Herstellen von Halbleiterbauelementen hoher Sperrspannungsbelastbarkeit |
US4040877A (en) * | 1976-08-24 | 1977-08-09 | Westinghouse Electric Corporation | Method of making a transistor device |
DE2730130C2 (de) * | 1976-09-14 | 1987-11-12 | Mitsubishi Denki K.K., Tokyo | Verfahren zum Herstellen von Halbleiterbauelementen |
US4237601A (en) * | 1978-10-13 | 1980-12-09 | Exxon Research & Engineering Co. | Method of cleaving semiconductor diode laser wafers |
US4236296A (en) * | 1978-10-13 | 1980-12-02 | Exxon Research & Engineering Co. | Etch method of cleaving semiconductor diode laser wafers |
JPS55124243A (en) * | 1979-03-20 | 1980-09-25 | Nec Corp | Compound semiconductor device |
JPS56103447A (en) * | 1980-01-22 | 1981-08-18 | Toshiba Corp | Dicing method of semiconductor wafer |
US4355457A (en) * | 1980-10-29 | 1982-10-26 | Rca Corporation | Method of forming a mesa in a semiconductor device with subsequent separation into individual devices |
US4604161A (en) * | 1985-05-02 | 1986-08-05 | Xerox Corporation | Method of fabricating image sensor arrays |
US4624741A (en) * | 1985-12-13 | 1986-11-25 | Xerox Corporation | Method of fabricating electro-mechanical modulator arrays |
-
1987
- 1987-08-28 US US07/090,827 patent/US4814296A/en not_active Expired - Lifetime
-
1988
- 1988-08-19 JP JP20622588A patent/JPH0834197B2/ja not_active Expired - Lifetime
- 1988-08-26 EP EP88307937A patent/EP0305204B1/de not_active Expired - Lifetime
- 1988-08-26 DE DE3887232T patent/DE3887232T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE3887232T2 (de) | 1994-06-16 |
JPS6470695A (en) | 1989-03-16 |
JPH0834197B2 (ja) | 1996-03-29 |
US4814296A (en) | 1989-03-21 |
EP0305204B1 (de) | 1994-01-19 |
EP0305204A1 (de) | 1989-03-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |