DE3885682T2 - Verfahren zum Galvanisieren von Metallen. - Google Patents

Verfahren zum Galvanisieren von Metallen.

Info

Publication number
DE3885682T2
DE3885682T2 DE88308221T DE3885682T DE3885682T2 DE 3885682 T2 DE3885682 T2 DE 3885682T2 DE 88308221 T DE88308221 T DE 88308221T DE 3885682 T DE3885682 T DE 3885682T DE 3885682 T2 DE3885682 T2 DE 3885682T2
Authority
DE
Germany
Prior art keywords
bath
cathode
anode
metal
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88308221T
Other languages
German (de)
English (en)
Other versions
DE3885682D1 (de
Inventor
Craig J Brown
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Eco Tec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eco Tec Inc filed Critical Eco Tec Inc
Application granted granted Critical
Publication of DE3885682D1 publication Critical patent/DE3885682D1/de
Publication of DE3885682T2 publication Critical patent/DE3885682T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
DE88308221T 1987-09-08 1988-09-06 Verfahren zum Galvanisieren von Metallen. Expired - Fee Related DE3885682T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/093,664 US4778572A (en) 1987-09-08 1987-09-08 Process for electroplating metals

Publications (2)

Publication Number Publication Date
DE3885682D1 DE3885682D1 (de) 1993-12-23
DE3885682T2 true DE3885682T2 (de) 1994-04-28

Family

ID=22240108

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88308221T Expired - Fee Related DE3885682T2 (de) 1987-09-08 1988-09-06 Verfahren zum Galvanisieren von Metallen.

Country Status (12)

Country Link
US (1) US4778572A (ja)
EP (1) EP0307161B1 (ja)
JP (1) JPH01159395A (ja)
KR (1) KR890005305A (ja)
CN (1) CN1033079A (ja)
AT (1) ATE97453T1 (ja)
AU (1) AU600878B2 (ja)
BR (1) BR8804681A (ja)
CA (1) CA1330963C (ja)
DE (1) DE3885682T2 (ja)
ES (1) ES2049750T3 (ja)
IN (1) IN168603B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010055143A1 (de) * 2010-12-18 2012-06-21 Umicore Galvanotechnik Gmbh Direktkontakt-Membrananode für die Verwendung in Elektrolysezellen

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE34191E (en) * 1989-05-31 1993-03-09 Eco-Tec Limited Process for electroplating metals
US4906340A (en) * 1989-05-31 1990-03-06 Eco-Tec Limited Process for electroplating metals
US5108615A (en) * 1989-11-28 1992-04-28 Bio-Recovery Systems, Inc. Method for recovery of a metal ion from electroless plating solutions
DE4032856A1 (de) * 1990-10-13 1992-04-16 Schering Ag Membranelektrolysemodul
CA2053342A1 (en) * 1990-10-22 1992-04-23 Robert A. Tremmel Nickel electroplating process with reduced nickel ion build up
US5162079A (en) * 1991-01-28 1992-11-10 Eco-Tec Limited Process and apparatus for control of electroplating bath composition
DE4221970C2 (de) * 1992-06-30 1996-01-18 Atotech Deutschland Gmbh Verfahren zur Vermeidung der Halogengasentwicklung in Metallabscheidungsbädern mit mindestens zwei Elektrolyträumen
DE4238956A1 (de) * 1992-06-30 1994-05-19 Schering Ag Verwendung von wasserlöslichen organischen Verbindungen als Zusätze im Anolyten in galvanischen Metallabscheidungsbädern
US5401379A (en) * 1993-03-19 1995-03-28 Mazzochi; James L. Chrome plating process
US6024856A (en) * 1997-10-10 2000-02-15 Enthone-Omi, Inc. Copper metallization of silicon wafers using insoluble anodes
US20060157355A1 (en) * 2000-03-21 2006-07-20 Semitool, Inc. Electrolytic process using anion permeable barrier
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US8852417B2 (en) 1999-04-13 2014-10-07 Applied Materials, Inc. Electrolytic process using anion permeable barrier
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US8236159B2 (en) 1999-04-13 2012-08-07 Applied Materials Inc. Electrolytic process using cation permeable barrier
US6581984B1 (en) 1999-09-27 2003-06-24 Seongho Csp, Ltd. Corrugated spiral pipe with a coupling device and method for installing the same
US20060189129A1 (en) * 2000-03-21 2006-08-24 Semitool, Inc. Method for applying metal features onto barrier layers using ion permeable barriers
US7273535B2 (en) 2003-09-17 2007-09-25 Applied Materials, Inc. Insoluble anode with an auxiliary electrode
US6755960B1 (en) 2000-06-15 2004-06-29 Taskem Inc. Zinc-nickel electroplating
DE60023190T3 (de) 2000-06-15 2016-03-10 Coventya, Inc. Zink-nickel-elektroplattierung
US6576110B2 (en) * 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
ATE385863T1 (de) * 2000-08-18 2008-03-15 Ti Group Automotive Sys Ltd Verfahren zur plattierung eines metallbandes zur herstellung eines mehrwandigen rohrs
US8377283B2 (en) * 2002-11-25 2013-02-19 Coventya, Inc. Zinc and zinc-alloy electroplating
EP1884278A1 (en) * 2006-07-24 2008-02-06 ATOTECH Deutschland GmbH Apparatus and method for rinsing of liquid from work pieces
US8262894B2 (en) * 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
TW201137186A (en) * 2010-04-28 2011-11-01 Thingwell Entpr Co Ltd Pull-plating apparatus
US9017528B2 (en) 2011-04-14 2015-04-28 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
US9005409B2 (en) 2011-04-14 2015-04-14 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
US20140106179A1 (en) * 2012-10-17 2014-04-17 Raytheon Company Plating design and process for improved hermeticity and thermal conductivity of gold-germanium solder joints
US9359688B1 (en) * 2012-12-05 2016-06-07 Novellus Systems, Inc. Apparatuses and methods for controlling PH in electroplating baths
US10190232B2 (en) * 2013-08-06 2019-01-29 Lam Research Corporation Apparatuses and methods for maintaining pH in nickel electroplating baths
US9303329B2 (en) 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
US9732434B2 (en) 2014-04-18 2017-08-15 Lam Research Corporation Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes
US20170159204A1 (en) * 2014-06-25 2017-06-08 Nippon Steel & Sumitomo Metal Corporation Basket-type anode
US10167561B2 (en) * 2016-12-15 2019-01-01 John Christopher Burtch Method and apparatus for producing hydrogen having reversible electrodes

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4328076A (en) * 1980-09-02 1982-05-04 The International Nickel Co., Inc. Electrode and sludge collector support device and electroplating therewith
US4514266A (en) * 1981-09-11 1985-04-30 Republic Steel Corporation Method and apparatus for electroplating
ES8801394A1 (es) * 1984-07-02 1987-05-16 Diaz Nogueira Eduardo Procedimiento para la electrodeposicion catodica de metales con la generacion del acido correspondiente, a partir de disoluciones de sus sales

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010055143A1 (de) * 2010-12-18 2012-06-21 Umicore Galvanotechnik Gmbh Direktkontakt-Membrananode für die Verwendung in Elektrolysezellen
DE102010055143B4 (de) 2010-12-18 2022-12-01 Umicore Galvanotechnik Gmbh Direktkontakt-Membrananode für die Verwendung in Elektrolysezellen

Also Published As

Publication number Publication date
JPH0514799B2 (ja) 1993-02-25
JPH01159395A (ja) 1989-06-22
EP0307161B1 (en) 1993-11-18
ES2049750T3 (es) 1994-05-01
BR8804681A (pt) 1989-04-18
KR890005305A (ko) 1989-05-13
DE3885682D1 (de) 1993-12-23
CN1033079A (zh) 1989-05-24
EP0307161A2 (en) 1989-03-15
US4778572A (en) 1988-10-18
IN168603B (ja) 1991-05-04
EP0307161A3 (en) 1989-04-26
ATE97453T1 (de) 1993-12-15
AU2199988A (en) 1989-03-23
CA1330963C (en) 1994-07-26
AU600878B2 (en) 1990-08-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ATOTECH DEUTSCHLAND GMBH, 10553 BERLIN, DE

8339 Ceased/non-payment of the annual fee