DE3885295D1 - SCHALTUNGSPLATTENMATERIAL UND ELEKTROPLATTIERUNGSBAD FüR SEINE HERSTELLUNG. - Google Patents

SCHALTUNGSPLATTENMATERIAL UND ELEKTROPLATTIERUNGSBAD FüR SEINE HERSTELLUNG.

Info

Publication number
DE3885295D1
DE3885295D1 DE88908520T DE3885295T DE3885295D1 DE 3885295 D1 DE3885295 D1 DE 3885295D1 DE 88908520 T DE88908520 T DE 88908520T DE 3885295 T DE3885295 T DE 3885295T DE 3885295 D1 DE3885295 D1 DE 3885295D1
Authority
DE
Germany
Prior art keywords
production
circuit board
plating bath
board material
electric plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE88908520T
Other languages
English (en)
Other versions
DE3885295T2 (de
Inventor
James Rice
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ohmega Electronics Inc
Original Assignee
Ohmega Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ohmega Electronics Inc filed Critical Ohmega Electronics Inc
Publication of DE3885295D1 publication Critical patent/DE3885295D1/de
Application granted granted Critical
Publication of DE3885295T2 publication Critical patent/DE3885295T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
    • H01C17/14—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by chemical deposition
    • H01C17/16—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by chemical deposition using electric current
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12778—Alternative base metals from diverse categories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)
DE88908520T 1987-09-02 1988-08-19 SCHALTUNGSPLATTENMATERIAL UND ELEKTROPLATTIERUNGSBAD FüR SEINE HERSTELLUNG. Expired - Lifetime DE3885295T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/091,990 US4892776A (en) 1987-09-02 1987-09-02 Circuit board material and electroplating bath for the production thereof
PCT/US1988/002860 WO1989002212A2 (en) 1987-09-02 1988-08-19 Improved circuit board material and electroplating bath for the production thereof

Publications (2)

Publication Number Publication Date
DE3885295D1 true DE3885295D1 (de) 1993-12-02
DE3885295T2 DE3885295T2 (de) 1994-04-21

Family

ID=22230657

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88908520T Expired - Lifetime DE3885295T2 (de) 1987-09-02 1988-08-19 SCHALTUNGSPLATTENMATERIAL UND ELEKTROPLATTIERUNGSBAD FüR SEINE HERSTELLUNG.

Country Status (5)

Country Link
US (2) US4892776A (de)
EP (1) EP0380545B1 (de)
CA (1) CA1338186C (de)
DE (1) DE3885295T2 (de)
WO (1) WO1989002212A2 (de)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347258A (en) * 1993-04-07 1994-09-13 Zycon Corporation Annular resistor coupled with printed circuit board through-hole
US5603847A (en) * 1993-04-07 1997-02-18 Zycon Corporation Annular circuit components coupled with printed circuit board through-hole
JPH09500762A (ja) * 1993-07-21 1997-01-21 オーメガ エレクトロニクス インコーポレーテッド バリア層を伴う回路基板材料
US5431776A (en) * 1993-09-08 1995-07-11 Phibro-Tech, Inc. Copper etchant solution additives
US5572409A (en) * 1994-02-08 1996-11-05 Prolinx Labs Corporation Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board
US5834824A (en) * 1994-02-08 1998-11-10 Prolinx Labs Corporation Use of conductive particles in a nonconductive body as an integrated circuit antifuse
US5537108A (en) * 1994-02-08 1996-07-16 Prolinx Labs Corporation Method and structure for programming fuses
US5726482A (en) * 1994-02-08 1998-03-10 Prolinx Labs Corporation Device-under-test card for a burn-in board
US5808351A (en) * 1994-02-08 1998-09-15 Prolinx Labs Corporation Programmable/reprogramable structure using fuses and antifuses
US5813881A (en) * 1994-02-08 1998-09-29 Prolinx Labs Corporation Programmable cable and cable adapter using fuses and antifuses
US5917229A (en) * 1994-02-08 1999-06-29 Prolinx Labs Corporation Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect
US5962815A (en) * 1995-01-18 1999-10-05 Prolinx Labs Corporation Antifuse interconnect between two conducting layers of a printed circuit board
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
US5767575A (en) * 1995-10-17 1998-06-16 Prolinx Labs Corporation Ball grid array structure and method for packaging an integrated circuit chip
US5872338A (en) * 1996-04-10 1999-02-16 Prolinx Labs Corporation Multilayer board having insulating isolation rings
WO1997039610A1 (en) * 1996-04-18 1997-10-23 International Business Machines Corporation Organic-metallic composite coating for copper surface protection
US5662788A (en) 1996-06-03 1997-09-02 Micron Technology, Inc. Method for forming a metallization layer
US7126195B1 (en) 1996-06-03 2006-10-24 Micron Technology, Inc. Method for forming a metallization layer
TW374802B (en) * 1996-07-29 1999-11-21 Ebara Densan Ltd Etching composition, method for roughening copper surface and method for producing printed wiring board
US5944879A (en) * 1997-02-19 1999-08-31 Elf Atochem North America, Inc. Nickel hypophosphite solutions containing increased nickel concentration
US5945257A (en) * 1997-10-29 1999-08-31 Sequent Computer Systems, Inc. Method of forming resistors
US6034427A (en) * 1998-01-28 2000-03-07 Prolinx Labs Corporation Ball grid array structure and method for packaging an integrated circuit chip
US6210592B1 (en) 1998-04-29 2001-04-03 Morton International, Inc. Deposition of resistor materials directly on insulating substrates
US6329899B1 (en) 1998-04-29 2001-12-11 Microcoating Technologies, Inc. Formation of thin film resistors
US6232042B1 (en) 1998-07-07 2001-05-15 Motorola, Inc. Method for manufacturing an integral thin-film metal resistor
US6194990B1 (en) 1999-03-16 2001-02-27 Motorola, Inc. Printed circuit board with a multilayer integral thin-film metal resistor and method therefor
US7446030B2 (en) * 1999-08-27 2008-11-04 Shocking Technologies, Inc. Methods for fabricating current-carrying structures using voltage switchable dielectric materials
US7825491B2 (en) * 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
US7695644B2 (en) * 1999-08-27 2010-04-13 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
US20080035370A1 (en) * 1999-08-27 2008-02-14 Lex Kosowsky Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material
US20100044079A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
AU6531600A (en) * 1999-08-27 2001-03-26 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US20100044080A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
US6489034B1 (en) 2000-02-08 2002-12-03 Gould Electronics Inc. Method of forming chromium coated copper for printed circuit boards
US6489035B1 (en) 2000-02-08 2002-12-03 Gould Electronics Inc. Applying resistive layer onto copper
US6622374B1 (en) 2000-09-22 2003-09-23 Gould Electronics Inc. Resistor component with multiple layers of resistive material
US6585904B2 (en) 2001-02-15 2003-07-01 Peter Kukanskis Method for the manufacture of printed circuit boards with plated resistors
DE10254622A1 (de) * 2002-11-22 2004-09-02 Hueck Folien Gesellschaft M.B.H. Hochbelastbar, beständige, flexible Folie
JP3954958B2 (ja) * 2002-11-26 2007-08-08 古河テクノリサーチ株式会社 抵抗層付き銅箔及び抵抗層付き回路基板材料
US20040113127A1 (en) * 2002-12-17 2004-06-17 Min Gary Yonggang Resistor compositions having a substantially neutral temperature coefficient of resistance and methods and compositions relating thereto
JP4217778B2 (ja) * 2003-04-11 2009-02-04 古河電気工業株式会社 抵抗層付き導電性基材、抵抗層付き回路基板及び抵抗回路配線板
KR100754065B1 (ko) * 2003-11-05 2007-08-31 삼성전기주식회사 매립된 저항을 갖는 인쇄회로기판 제조 방법
US7022464B2 (en) 2004-08-25 2006-04-04 Peter Kukanskis Integral plated resistor and method for the manufacture of printed circuit boards comprising the same
US7596842B2 (en) * 2005-02-22 2009-10-06 Oak-Mitsui Inc. Method of making multilayered construction for use in resistors and capacitors
US7192654B2 (en) * 2005-02-22 2007-03-20 Oak-Mitsui Inc. Multilayered construction for resistor and capacitor formation
US20060286696A1 (en) * 2005-06-21 2006-12-21 Peiffer Joel S Passive electrical article
KR20080084812A (ko) 2005-11-22 2008-09-19 쇼킹 테크놀로지스 인코포레이티드 과전압 보호를 위해 전압 변환가능 재료를 포함하는 반도체디바이스
US20100263200A1 (en) * 2005-11-22 2010-10-21 Lex Kosowsky Wireless communication device using voltage switchable dielectric material
US20070215962A1 (en) * 2006-03-20 2007-09-20 Knowles Elecronics, Llc Microelectromechanical system assembly and method for manufacturing thereof
US7968010B2 (en) * 2006-07-29 2011-06-28 Shocking Technologies, Inc. Method for electroplating a substrate
US20080032049A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having high aspect ratio particles
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
KR20090055017A (ko) * 2006-09-24 2009-06-01 쇼킹 테크놀로지스 인코포레이티드 스탭 전압 응답을 가진 전압 가변 유전 재료를 위한 조성물및 그 제조 방법
US20120119168A9 (en) * 2006-11-21 2012-05-17 Robert Fleming Voltage switchable dielectric materials with low band gap polymer binder or composite
US7793236B2 (en) * 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US8206614B2 (en) * 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US8203421B2 (en) * 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US20100047535A1 (en) * 2008-08-22 2010-02-25 Lex Kosowsky Core layer structure having voltage switchable dielectric material
WO2010033635A1 (en) * 2008-09-17 2010-03-25 Shocking Technologies, Inc. Voltage switchable dielectric material containing boron compound
WO2010039902A2 (en) * 2008-09-30 2010-04-08 Shocking Technologies, Inc. Voltage switchable dielectric material containing conductive core shelled particles
US9208931B2 (en) * 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
US8362871B2 (en) * 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
CN102550132A (zh) 2009-03-26 2012-07-04 肖克科技有限公司 具有电压可切换电介质材料的元件
US9053844B2 (en) 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
US20110198544A1 (en) * 2010-02-18 2011-08-18 Lex Kosowsky EMI Voltage Switchable Dielectric Materials Having Nanophase Materials
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9320135B2 (en) * 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9224728B2 (en) * 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
WO2014113703A1 (en) * 2013-01-18 2014-07-24 Ohmega Technologies, Inc. Improved circuit board material
US9786354B2 (en) 2013-07-10 2017-10-10 Samsung Electronics Co., Ltd. Memory module

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2662957A (en) * 1949-10-29 1953-12-15 Eisler Paul Electrical resistor or semiconductor
US2644787A (en) * 1950-01-05 1953-07-07 Eckert Mauchly Comp Corp Electrodeposition of a magnetic coating
US3500926A (en) * 1967-12-22 1970-03-17 Shell Oil Co Electroless metal bonding of unconsolidated formations into consolidated formations
US3691007A (en) * 1969-08-14 1972-09-12 Mica Corp The Printed circuit board fabrication by electroplating a surface through a porous membrane
US3808576A (en) * 1971-01-15 1974-04-30 Mica Corp Circuit board with resistance layer
US3857683A (en) * 1973-07-27 1974-12-31 Mica Corp Printed circuit board material incorporating binary alloys
US4002778A (en) * 1973-08-15 1977-01-11 E. I. Du Pont De Nemours And Company Chemical plating process
US4632857A (en) * 1974-05-24 1986-12-30 Richardson Chemical Company Electrolessly plated product having a polymetallic catalytic film underlayer
US4232060A (en) * 1979-01-22 1980-11-04 Richardson Chemical Company Method of preparing substrate surface for electroless plating and products produced thereby
US4101389A (en) * 1976-05-20 1978-07-18 Sony Corporation Method of manufacturing amorphous alloy
US4459184A (en) * 1980-08-12 1984-07-10 Macdermid, Inc. Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential
US4299670A (en) * 1980-09-22 1981-11-10 Bell Telephone Laboratories, Incorporated Palladium plating procedure and bath
NL8302150A (nl) * 1982-06-16 1984-01-16 Nitto Electric Ind Co Uitgangsplaat voor een gedrukte schakeling met een weerstandslaag en werkwijze voor de vervaardiging daarvan.
US4888574A (en) * 1985-05-29 1989-12-19 501 Ohmega Electronics, Inc. Circuit board material and method of making
US4808967A (en) * 1985-05-29 1989-02-28 Ohmega Electronics Circuit board material
US4770751A (en) * 1986-12-30 1988-09-13 Okuno Chemical Industry Co., Ltd. Method for forming on a nonconductor a shielding layer against electromagnetic radiation

Also Published As

Publication number Publication date
US4892776A (en) 1990-01-09
WO1989002212A3 (en) 1989-04-06
DE3885295T2 (de) 1994-04-21
CA1338186C (en) 1996-03-26
US5336391A (en) 1994-08-09
WO1989002212A2 (en) 1989-03-09
EP0380545A1 (de) 1990-08-08
EP0380545B1 (de) 1993-10-27

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