DE3878393T2 - Herstellung einer originaldruckplatte oder eines gedruckten schaltkreises. - Google Patents
Herstellung einer originaldruckplatte oder eines gedruckten schaltkreises.Info
- Publication number
- DE3878393T2 DE3878393T2 DE8888114740T DE3878393T DE3878393T2 DE 3878393 T2 DE3878393 T2 DE 3878393T2 DE 8888114740 T DE8888114740 T DE 8888114740T DE 3878393 T DE3878393 T DE 3878393T DE 3878393 T2 DE3878393 T2 DE 3878393T2
- Authority
- DE
- Germany
- Prior art keywords
- production
- printed circuit
- printing plate
- original printing
- original
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
- B41M5/3825—Electric current carrying heat transfer sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/115,471 US4800397A (en) | 1987-10-30 | 1987-10-30 | Metal transfer to form printing master plate or printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3878393D1 DE3878393D1 (de) | 1993-03-25 |
DE3878393T2 true DE3878393T2 (de) | 1993-08-12 |
Family
ID=22361624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8888114740T Expired - Fee Related DE3878393T2 (de) | 1987-10-30 | 1988-09-09 | Herstellung einer originaldruckplatte oder eines gedruckten schaltkreises. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4800397A (de) |
EP (1) | EP0313778B1 (de) |
JP (1) | JPH01123792A (de) |
DE (1) | DE3878393T2 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008018704A1 (de) * | 2008-04-07 | 2009-10-29 | Sächsische Walzengravur GmbH | Tiefdruck-oder Prägeform als Sleeve oder Zylinder |
DE102008029195A1 (de) * | 2008-06-19 | 2009-12-24 | Koenig & Bauer Aktiengesellschaft | Druckplatte zum Aufspannen auf einem Plattenzylinder einer Rotationsdruckmaschine |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4915519A (en) * | 1987-10-30 | 1990-04-10 | International Business Machines Corp. | Direct negative from resistive ribbon |
US4985321A (en) * | 1988-12-13 | 1991-01-15 | Minnesota Mining And Manufacturing Company | Thermal mass transfer of metallic images |
AU631595B2 (en) * | 1988-12-24 | 1992-12-03 | Technology Applications Company Limited | Improved method for making printed circuits |
AU6728490A (en) * | 1989-10-26 | 1991-05-31 | Kroy Inc. | Negative image thermal print system |
JPH03297103A (ja) * | 1990-04-17 | 1991-12-27 | Cmk Corp | プリント配線板におけるカーボン抵抗体の形成方法 |
US5169471A (en) * | 1991-07-29 | 1992-12-08 | Strasser Gene W | Auto electrical connecting circuit board assembly |
DE69218785T2 (de) * | 1991-10-11 | 1997-10-09 | Minnesota Mining & Mfg | Dünne bildübertragungsschicht |
US5470644A (en) * | 1994-04-21 | 1995-11-28 | Durant; David | Apparatus and method for fabrication of printed circuit boards |
US6025860A (en) * | 1997-01-28 | 2000-02-15 | Gsi Lumonics, Inc. | Digital decorating system |
US6892441B2 (en) * | 2001-04-23 | 2005-05-17 | Appleton Papers Inc. | Method for forming electrically conductive pathways |
US6779246B2 (en) * | 2001-04-23 | 2004-08-24 | Appleton Papers Inc. | Method and system for forming RF reflective pathways |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0028334A3 (de) * | 1979-11-01 | 1982-12-29 | International Business Machines Corporation | Verfahren und Vorrichtung, um Aufzeichnungsmaterial thermographisch zu bebildern |
US4614837A (en) * | 1985-04-03 | 1986-09-30 | Allied Corporation | Method for placing electrically conductive paths on a substrate |
JPS6290288A (ja) * | 1985-10-16 | 1987-04-24 | Fuji Xerox Co Ltd | 熱転写記録媒体 |
-
1987
- 1987-10-30 US US07/115,471 patent/US4800397A/en not_active Expired - Fee Related
-
1988
- 1988-09-09 DE DE8888114740T patent/DE3878393T2/de not_active Expired - Fee Related
- 1988-09-09 EP EP88114740A patent/EP0313778B1/de not_active Expired - Lifetime
- 1988-09-19 JP JP63232782A patent/JPH01123792A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008018704A1 (de) * | 2008-04-07 | 2009-10-29 | Sächsische Walzengravur GmbH | Tiefdruck-oder Prägeform als Sleeve oder Zylinder |
DE102008018704B4 (de) * | 2008-04-07 | 2013-11-28 | Sächsische Walzengravur GmbH | Tiefdruck-oder Prägeform als Sleeve oder Zylinder |
DE102008029195A1 (de) * | 2008-06-19 | 2009-12-24 | Koenig & Bauer Aktiengesellschaft | Druckplatte zum Aufspannen auf einem Plattenzylinder einer Rotationsdruckmaschine |
Also Published As
Publication number | Publication date |
---|---|
EP0313778A2 (de) | 1989-05-03 |
EP0313778A3 (en) | 1990-06-06 |
JPH01123792A (ja) | 1989-05-16 |
EP0313778B1 (de) | 1993-02-10 |
JPH0371278B2 (de) | 1991-11-12 |
US4800397A (en) | 1989-01-24 |
DE3878393D1 (de) | 1993-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |