DE3874878T2 - Verfahren zur waermebehandlung von niedrigschmelzendem metall. - Google Patents

Verfahren zur waermebehandlung von niedrigschmelzendem metall.

Info

Publication number
DE3874878T2
DE3874878T2 DE8888100804T DE3874878T DE3874878T2 DE 3874878 T2 DE3874878 T2 DE 3874878T2 DE 8888100804 T DE8888100804 T DE 8888100804T DE 3874878 T DE3874878 T DE 3874878T DE 3874878 T2 DE3874878 T2 DE 3874878T2
Authority
DE
Germany
Prior art keywords
low
heat treatment
melting metal
melting
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888100804T
Other languages
English (en)
Other versions
DE3874878D1 (de
Inventor
Yasuhiro Shindo
Yukio Tsujimoto
Isami Saito
Isamu Hiraoka
Hiroshi Hirayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Panasonic Holdings Corp
Original Assignee
Sumitomo Metal Mining Co Ltd
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd, Matsushita Electric Industrial Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Publication of DE3874878D1 publication Critical patent/DE3874878D1/de
Application granted granted Critical
Publication of DE3874878T2 publication Critical patent/DE3874878T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/065—Spherical particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
DE8888100804T 1986-07-22 1988-01-20 Verfahren zur waermebehandlung von niedrigschmelzendem metall. Expired - Fee Related DE3874878T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61172085A JPH0776412B2 (ja) 1986-07-22 1986-07-22 回路基板の電極処理方法
EP88100804A EP0325660B1 (de) 1986-07-22 1988-01-20 Verfahren zur Wärmebehandlung von niedrigschmelzendem Metall

Publications (2)

Publication Number Publication Date
DE3874878D1 DE3874878D1 (de) 1992-10-29
DE3874878T2 true DE3874878T2 (de) 1993-02-04

Family

ID=39682678

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888100804T Expired - Fee Related DE3874878T2 (de) 1986-07-22 1988-01-20 Verfahren zur waermebehandlung von niedrigschmelzendem metall.

Country Status (4)

Country Link
US (1) US4842654A (de)
EP (1) EP0325660B1 (de)
JP (1) JPH0776412B2 (de)
DE (1) DE3874878T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761779A (en) * 1989-12-07 1998-06-09 Nippon Steel Corporation Method of producing fine metal spheres of uniform size
WO1991008850A1 (en) * 1989-12-07 1991-06-27 Nippon Steel Corporation Method of manufacturing minute metallic balls uniform in size
DE69221212T2 (de) * 1991-05-22 1998-01-22 Plata Ltd Co Verfahren zur behälterlosen Behandlung von sich in einem Zustand von kompensierter Schwerkraft befindlichen Materialien und Vorrichtung dafür
FR2688727B1 (fr) * 1992-03-19 1996-03-15 Fujitsu Ltd Procedes pour rendre spherique une particule metallique et pour eliminer un film d'oxyde, pate a souder et procede de soudure.
US5653783A (en) * 1994-01-20 1997-08-05 Nippon Steel Corporation Method of producing fine metal balls
JP3142232B2 (ja) * 1995-12-21 2001-03-07 釜屋電機株式会社 低抵抗のチップ形抵抗器、及び該抵抗器の製造方法
JP6273608B2 (ja) * 2014-02-21 2018-02-07 株式会社流機エンジニアリング 低融点合金の回収方法
CN105568184B (zh) * 2016-02-02 2018-06-01 西安建筑科技大学 一种低熔点金属磁致塑性环向辗摩超细化方法及其装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA641010A (en) * 1962-05-08 N.V. Philips Gloeilampenfabrieken Method of manufacturing pellets
CA662957A (en) * 1963-05-14 H. Turner Gordon Method for producing metal spheres
US2952868A (en) * 1958-03-07 1960-09-20 Indium Corp America Manufacture of indium spheres
GB904211A (en) * 1958-12-10 1962-08-22 Mullard Ltd Improvements in and relating to methods of manufacturing pellets
US3019485A (en) * 1960-01-11 1962-02-06 Accurate Specialties Inc Method of producing metal spheres
US3063099A (en) * 1961-01-16 1962-11-13 Cons Mining & Smelting Co Method for producing metal spheres
GB925128A (en) * 1961-10-02 1963-05-01 Cons Mining & Smelting Co Method of producing metal spheres
US3708560A (en) * 1971-07-12 1973-01-02 Standard Oil Co Hydraulic fracturing proppant composition and method for forming such proppants
GB1536772A (en) * 1977-04-06 1978-12-20 Nevin Electric Ltd Selectively solder-plated printed circuit boards
JPS5684401A (en) * 1979-12-11 1981-07-09 Matsushita Electric Ind Co Ltd Manufacture of spherical metal grain
DE3104419C2 (de) * 1981-02-09 1983-06-09 Draloric Electronic GmbH, 8672 Selb Verfahren zur Herstellung von Chipwiderständen
DE3328342C3 (de) * 1983-07-01 1999-03-18 Bosch Gmbh Robert Verfahren zum Einlöten von Chipbauelementen auf Leiterplatten
US4566624A (en) * 1983-12-16 1986-01-28 Hollis Automation, Inc. Mass wave soldering system

Also Published As

Publication number Publication date
EP0325660B1 (de) 1992-09-23
JPH0776412B2 (ja) 1995-08-16
DE3874878D1 (de) 1992-10-29
US4842654A (en) 1989-06-27
EP0325660A1 (de) 1989-08-02
JPS6328851A (ja) 1988-02-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee