DE3851985T2 - Wärmeleitende Packung für elektronische Bauelemente. - Google Patents
Wärmeleitende Packung für elektronische Bauelemente.Info
- Publication number
- DE3851985T2 DE3851985T2 DE3851985T DE3851985T DE3851985T2 DE 3851985 T2 DE3851985 T2 DE 3851985T2 DE 3851985 T DE3851985 T DE 3851985T DE 3851985 T DE3851985 T DE 3851985T DE 3851985 T2 DE3851985 T2 DE 3851985T2
- Authority
- DE
- Germany
- Prior art keywords
- heat
- distributor
- carrier plate
- carrier
- board wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012856 packing Methods 0.000 title description 3
- 239000004020 conductor Substances 0.000 claims description 25
- 229920001971 elastomer Polymers 0.000 claims description 6
- 239000006260 foam Substances 0.000 claims description 5
- 238000012546 transfer Methods 0.000 description 15
- 238000001816 cooling Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/069,406 US4887147A (en) | 1987-07-01 | 1987-07-01 | Thermal package for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3851985D1 DE3851985D1 (de) | 1994-12-08 |
| DE3851985T2 true DE3851985T2 (de) | 1995-05-18 |
Family
ID=22088776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE3851985T Expired - Fee Related DE3851985T2 (de) | 1987-07-01 | 1988-06-30 | Wärmeleitende Packung für elektronische Bauelemente. |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4887147A (enrdf_load_stackoverflow) |
| EP (1) | EP0297894B1 (enrdf_load_stackoverflow) |
| JP (1) | JPS6489451A (enrdf_load_stackoverflow) |
| CA (1) | CA1282866C (enrdf_load_stackoverflow) |
| DE (1) | DE3851985T2 (enrdf_load_stackoverflow) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6478356B1 (en) * | 2000-01-05 | 2002-11-12 | Mark Wayne | Cargo area structure |
| US5218215A (en) * | 1990-12-19 | 1993-06-08 | Vlsi Technology, Inc. | Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path |
| US5162975A (en) * | 1991-10-15 | 1992-11-10 | Hewlett-Packard Company | Integrated circuit demountable TAB apparatus |
| US5262925A (en) * | 1991-10-15 | 1993-11-16 | Hewlett-Packard Company | Tab frame with area array edge contacts |
| US5504652A (en) * | 1994-09-16 | 1996-04-02 | Apple Computer, Inc. | Unitary heat sink for integrated circuits |
| US5548090A (en) * | 1995-08-21 | 1996-08-20 | Northern Telecom Limited | Heat sink and printed circuit board combination |
| KR20010024447A (ko) * | 1997-10-07 | 2001-03-26 | 릴라이어빌리티 인코포레이티드 | 적응성 있는 방열 장치를 구비한 번인 보드 |
| KR20010024445A (ko) | 1997-10-07 | 2001-03-26 | 릴라이어빌리티 인코포레이티드 | 높은 열 방출 능력을 갖는 번인 보드 |
| US6072322A (en) * | 1997-12-30 | 2000-06-06 | Intel Corporation | Thermally enhanced test socket |
| US6570247B1 (en) | 1997-12-30 | 2003-05-27 | Intel Corporation | Integrated circuit device having an embedded heat slug |
| US6049217A (en) * | 1997-12-30 | 2000-04-11 | Intel Corporation | Thermally enhanced test contactor |
| US6545352B1 (en) | 2002-02-15 | 2003-04-08 | Ericsson Inc. | Assembly for mounting power semiconductive modules to heat dissipators |
| US6999317B2 (en) * | 2003-08-12 | 2006-02-14 | Delphi Technologies, Inc. | Thermally enhanced electronic module with self-aligning heat sink |
| US8686277B2 (en) * | 2004-12-27 | 2014-04-01 | Intel Corporation | Microelectronic assembly including built-in thermoelectric cooler and method of fabricating same |
| US7532474B2 (en) * | 2006-02-21 | 2009-05-12 | 3Com Corporation | Apparatus for dissipating heat from electronic components in an enclosed housing |
| US7679917B2 (en) * | 2007-02-02 | 2010-03-16 | Deck Joseph F | Electronic assembly cooling |
| JP2009059760A (ja) * | 2007-08-30 | 2009-03-19 | Toshiba Corp | 電子回路基板の放熱構造体 |
| DE102008028299B3 (de) * | 2008-06-13 | 2009-07-30 | Epcos Ag | Systemträger für elektronische Komponente und Verfahren für dessen Herstellung |
| US8902588B2 (en) | 2009-12-09 | 2014-12-02 | Thomson Licensing | Set-top box having microperforations |
| WO2011106082A1 (en) | 2010-02-25 | 2011-09-01 | Thomson Licensing | Miniature multilayer radiative cooling case with hidden quick release snaps |
| KR20130077841A (ko) | 2010-05-19 | 2013-07-09 | 톰슨 라이센싱 | 열 부하를 발산하는 셋탑 박스 |
| KR20140061299A (ko) | 2011-03-09 | 2014-05-21 | 톰슨 라이센싱 | 스냅-인 히트 싱크 및 스마트 카드 판독기를 갖는 셋톱 박스 또는 서버 |
| BR112014000762A2 (pt) | 2011-07-14 | 2017-02-14 | Thomson Licensing | conversor set top bos tendo dissipador de calor snap-in e leitor de cartão inteligente com uma contenção para reter o dissipador de calor |
| US11807381B2 (en) * | 2021-03-16 | 2023-11-07 | Rolls-Royce Corporation | Aircraft hybrid propulsion system including cold plate for a high density power converter |
| US20230262935A1 (en) * | 2022-01-26 | 2023-08-17 | Celsia Technologies Taiwan, Inc. | Heat dissipation device and anti-vibration heat conduction structure thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1327352A (en) * | 1971-10-02 | 1973-08-22 | Kyoto Ceramic | Semiconductor device |
| US4396935A (en) * | 1980-10-06 | 1983-08-02 | Ncr Corporation | VLSI Packaging system |
| JPS58169943A (ja) * | 1982-03-29 | 1983-10-06 | Fujitsu Ltd | 半導体装置 |
| JPS58173790A (ja) * | 1982-04-06 | 1983-10-12 | シチズン時計株式会社 | 表示装置と半導体装置の接続構造 |
| US4620215A (en) * | 1982-04-16 | 1986-10-28 | Amdahl Corporation | Integrated circuit packaging systems with double surface heat dissipation |
| US4479140A (en) * | 1982-06-28 | 1984-10-23 | International Business Machines Corporation | Thermal conduction element for conducting heat from semiconductor devices to a cold plate |
| ATE39788T1 (de) * | 1982-09-09 | 1989-01-15 | Siemens Ag | Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen. |
| US4647959A (en) * | 1985-05-20 | 1987-03-03 | Tektronix, Inc. | Integrated circuit package, and method of forming an integrated circuit package |
-
1987
- 1987-07-01 US US07/069,406 patent/US4887147A/en not_active Expired - Lifetime
-
1988
- 1988-06-30 DE DE3851985T patent/DE3851985T2/de not_active Expired - Fee Related
- 1988-06-30 CA CA000570919A patent/CA1282866C/en not_active Expired - Fee Related
- 1988-06-30 EP EP88305992A patent/EP0297894B1/en not_active Expired - Lifetime
- 1988-06-30 JP JP63164096A patent/JPS6489451A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| EP0297894B1 (en) | 1994-11-02 |
| EP0297894A2 (en) | 1989-01-04 |
| JPS6489451A (en) | 1989-04-03 |
| EP0297894A3 (en) | 1989-06-14 |
| US4887147A (en) | 1989-12-12 |
| JPH0581185B2 (enrdf_load_stackoverflow) | 1993-11-11 |
| CA1282866C (en) | 1991-04-09 |
| DE3851985D1 (de) | 1994-12-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |