DE3789034D1 - Vorrichtung und Verfahren zum Bandlöten. - Google Patents

Vorrichtung und Verfahren zum Bandlöten.

Info

Publication number
DE3789034D1
DE3789034D1 DE87401304T DE3789034T DE3789034D1 DE 3789034 D1 DE3789034 D1 DE 3789034D1 DE 87401304 T DE87401304 T DE 87401304T DE 3789034 T DE3789034 T DE 3789034T DE 3789034 D1 DE3789034 D1 DE 3789034D1
Authority
DE
Germany
Prior art keywords
band soldering
soldering
band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE87401304T
Other languages
English (en)
Other versions
DE3789034T2 (de
Inventor
Fred Drummond
James W Clark
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fairchild Semiconductor Corp
Original Assignee
Fairchild Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Semiconductor Corp filed Critical Fairchild Semiconductor Corp
Publication of DE3789034D1 publication Critical patent/DE3789034D1/de
Application granted granted Critical
Publication of DE3789034T2 publication Critical patent/DE3789034T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
DE3789034T 1986-06-19 1987-06-11 Vorrichtung und Verfahren zum Bandlöten. Expired - Fee Related DE3789034T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87631786A 1986-06-19 1986-06-19

Publications (2)

Publication Number Publication Date
DE3789034D1 true DE3789034D1 (de) 1994-03-24
DE3789034T2 DE3789034T2 (de) 1994-08-11

Family

ID=25367425

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3789034T Expired - Fee Related DE3789034T2 (de) 1986-06-19 1987-06-11 Vorrichtung und Verfahren zum Bandlöten.

Country Status (4)

Country Link
EP (1) EP0250296B1 (de)
JP (1) JPH0770563B2 (de)
KR (1) KR880001031A (de)
DE (1) DE3789034T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940003241B1 (ko) * 1991-05-23 1994-04-16 금성일렉트론 주식회사 To-220 반도체 제조기의 리드프레임 자동 공급장치
KR102115935B1 (ko) * 2017-09-01 2020-05-28 주식회사 에이치앤이루자 히터 어셈블리
CN111212489A (zh) * 2018-11-21 2020-05-29 南韩商H&世温股份有限公司 加热器组件

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2439322A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Procede et dispositif de liaison de deux elements et outil pour l'execution du procede
US4342151A (en) * 1979-06-18 1982-08-03 Eastman Kodak Company Blank and process for the formation of beam leads for IC chip bonding
CH639306A5 (fr) * 1980-12-19 1983-11-15 Far Fab Assortiments Reunies Outil de soudage.
DE3144048A1 (de) * 1981-09-18 1983-04-21 Zschimmer, Gero, 8000 München Stromdurchfliessbarer loetstempel

Also Published As

Publication number Publication date
JPS6367740A (ja) 1988-03-26
EP0250296A2 (de) 1987-12-23
EP0250296A3 (en) 1990-07-11
EP0250296B1 (de) 1994-02-09
KR880001031A (ko) 1988-03-31
DE3789034T2 (de) 1994-08-11
JPH0770563B2 (ja) 1995-07-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee