DE3783864D1 - System mit umschaltbarer gittervorspannung zum kontaktlosen testen mit einem elektronenstrahl. - Google Patents

System mit umschaltbarer gittervorspannung zum kontaktlosen testen mit einem elektronenstrahl.

Info

Publication number
DE3783864D1
DE3783864D1 DE8787113821T DE3783864T DE3783864D1 DE 3783864 D1 DE3783864 D1 DE 3783864D1 DE 8787113821 T DE8787113821 T DE 8787113821T DE 3783864 T DE3783864 T DE 3783864T DE 3783864 D1 DE3783864 D1 DE 3783864D1
Authority
DE
Germany
Prior art keywords
electron beam
tension system
contactless testing
grid tension
switchable grid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787113821T
Other languages
English (en)
Other versions
DE3783864T2 (de
Inventor
Steven Douglas Golladay
Fritz Juergen Hohn
Hans Christian Pfeiffer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3783864D1 publication Critical patent/DE3783864D1/de
Publication of DE3783864T2 publication Critical patent/DE3783864T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams
    • G01R31/306—Contactless testing using electron beams of printed or hybrid circuits
DE8787113821T 1986-10-30 1987-09-22 System mit umschaltbarer gittervorspannung zum kontaktlosen testen mit einem elektronenstrahl. Expired - Fee Related DE3783864T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/925,764 US4843330A (en) 1986-10-30 1986-10-30 Electron beam contactless testing system with grid bias switching

Publications (2)

Publication Number Publication Date
DE3783864D1 true DE3783864D1 (de) 1993-03-11
DE3783864T2 DE3783864T2 (de) 1993-08-19

Family

ID=25452199

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787113821T Expired - Fee Related DE3783864T2 (de) 1986-10-30 1987-09-22 System mit umschaltbarer gittervorspannung zum kontaktlosen testen mit einem elektronenstrahl.

Country Status (4)

Country Link
US (1) US4843330A (de)
EP (1) EP0266535B1 (de)
JP (1) JPH0729639Y2 (de)
DE (1) DE3783864T2 (de)

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JPH065691B2 (ja) * 1987-09-26 1994-01-19 株式会社東芝 半導体素子の試験方法および試験装置
US4963823A (en) * 1988-06-27 1990-10-16 Siemens Aktiengesellschaft Electron beam measuring instrument
US4943769A (en) * 1989-03-21 1990-07-24 International Business Machines Corporation Apparatus and method for opens/shorts testing of capacitively coupled networks in substrates using electron beams
EP0402499A1 (de) * 1989-06-13 1990-12-19 Siemens Aktiengesellschaft Verfahren zur Prüfung einer Leiterplatte mit einer Teilchensonde
EP0405672A1 (de) * 1989-06-30 1991-01-02 Koninklijke Philips Electronics N.V. Verfahren zur Messung einer Spannungsverteilung auf ein Leitermuster
US5017863A (en) * 1989-10-20 1991-05-21 Digital Equipment Corporation Electro-emissive laser stimulated test
US5210487A (en) * 1991-06-04 1993-05-11 Schlumberger Technologies Inc. Double-gated integrating scheme for electron beam tester
US5258706A (en) * 1991-10-16 1993-11-02 Siemens Aktiengesellschaft Method for the recognition of testing errors in the test of microwirings
US5404110A (en) * 1993-03-25 1995-04-04 International Business Machines Corporation System using induced current for contactless testing of wiring networks
US5614833A (en) * 1994-10-25 1997-03-25 International Business Machines Corporation Objective lens with large field deflection system and homogeneous large area secondary electron extraction field
US5587664A (en) * 1995-07-12 1996-12-24 Exsight Ltd. Laser-induced metallic plasma for non-contact inspection
US5844416A (en) * 1995-11-02 1998-12-01 Sandia Corporation Ion-beam apparatus and method for analyzing and controlling integrated circuits
US6172363B1 (en) * 1996-03-05 2001-01-09 Hitachi, Ltd. Method and apparatus for inspecting integrated circuit pattern
US5781017A (en) * 1996-04-26 1998-07-14 Sandia Corporation Capacitive charge generation apparatus and method for testing circuits
US6163159A (en) * 1997-06-02 2000-12-19 Advantest Corp Charged particle beam test system
US6504393B1 (en) 1997-07-15 2003-01-07 Applied Materials, Inc. Methods and apparatus for testing semiconductor and integrated circuit structures
US5973323A (en) 1997-11-05 1999-10-26 Kla-Tencor Corporation Apparatus and method for secondary electron emission microscope
US6232787B1 (en) * 1999-01-08 2001-05-15 Schlumberger Technologies, Inc. Microstructure defect detection
US6344750B1 (en) * 1999-01-08 2002-02-05 Schlumberger Technologies, Inc. Voltage contrast method for semiconductor inspection using low voltage particle beam
US6252412B1 (en) 1999-01-08 2001-06-26 Schlumberger Technologies, Inc. Method of detecting defects in patterned substrates
US6586733B1 (en) 1999-05-25 2003-07-01 Kla-Tencor Apparatus and methods for secondary electron emission microscope with dual beam
EP1183707B1 (de) * 1999-05-25 2009-10-07 KLA-Tencor Corporation Gerät und verfahren zur sekundärelektronen-mikroskopie mittels doppelten strahles
DE69900869T2 (de) * 1999-07-29 2002-07-18 Advantest Corp Verfahren und Vorrichtung zur Prüfung eines elektronischen Bauteils
US6359451B1 (en) 2000-02-11 2002-03-19 Image Graphics Incorporated System for contactless testing of printed circuit boards
AU3354401A (en) 2000-02-14 2001-08-20 Eco 3 Max Inc. Process for removing volatile organic compounds from an air stream and apparatustherefor
US7038224B2 (en) * 2002-07-30 2006-05-02 Applied Materials, Israel, Ltd. Contact opening metrology
US7528614B2 (en) * 2004-12-22 2009-05-05 Applied Materials, Inc. Apparatus and method for voltage contrast analysis of a wafer using a tilted pre-charging beam
US6812462B1 (en) 2003-02-21 2004-11-02 Kla-Tencor Technologies Corporation Dual electron beam instrument for multi-perspective
JP5016799B2 (ja) * 2005-08-05 2012-09-05 株式会社日立製作所 荷電粒子ビームを用いた検査装置
US7560939B1 (en) * 2006-02-17 2009-07-14 Kla-Tencor Technologies Corporation Electrical defect detection using pre-charge and sense scanning with prescribed delays
US8748815B2 (en) * 2006-08-31 2014-06-10 Hermes Microvision, Inc. Method and system for detecting or reviewing open contacts on a semiconductor device
US20080296496A1 (en) * 2007-05-30 2008-12-04 Hermes Microvision, Inc. (Taiwan) Method and apparatus of wafer surface potential regulation
GB0713276D0 (en) * 2007-07-09 2007-08-15 Medical Res Council Transmission electron microscope

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL134392C (de) * 1965-09-21
US3448377A (en) * 1967-10-12 1969-06-03 Atomic Energy Commission Method utilizing an electron beam for nondestructively measuring the dielectric properties of a sample
US3448776A (en) * 1967-10-26 1969-06-10 Marshall John D Picker stick
JPS4823385A (de) * 1971-07-28 1973-03-26
US3984683A (en) * 1975-05-27 1976-10-05 Rca Corporation Apparatus and method for analyzing biological cells for malignancy
DE2814049A1 (de) * 1978-03-31 1979-10-18 Siemens Ag Verfahren zur beruehrungslosen messung des potentialverlaufs in einem elektronischen bauelement und anordnung zur durchfuehrung des verfahrens
DE2902495A1 (de) * 1979-01-23 1980-07-31 Siemens Ag Einrichtung zur beruehrungslosen potentialmessung
US4417203A (en) * 1981-05-26 1983-11-22 International Business Machines Corporation System for contactless electrical property testing of multi-layer ceramics
US4415851A (en) * 1981-05-26 1983-11-15 International Business Machines Corporation System for contactless testing of multi-layer ceramics
DE3235461A1 (de) * 1982-09-24 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Verfahren zur kontaktlosen pruefung eines objekts, insbesondere von mikroverdrahtungen, mit einer korpuskularstrahl-sonde
DE3334494A1 (de) * 1983-09-23 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Verfahren zum messen niederfrequenter signalverlaeufe innerhalb integrierter schaltungen mit der elektronensonde
US4596929A (en) * 1983-11-21 1986-06-24 Nanometrics Incorporated Three-stage secondary emission electron detection in electron microscopes
DE3576213D1 (de) * 1984-09-18 1990-04-05 Integrated Circuit Testing Gegenfeld-spektrometer fuer die elektronenstrahl-messtechnik.
US4695794A (en) * 1985-05-31 1987-09-22 Santa Barbara Research Center Voltage calibration in E-beam probe using optical flooding

Also Published As

Publication number Publication date
DE3783864T2 (de) 1993-08-19
US4843330A (en) 1989-06-27
JPH0729639Y2 (ja) 1995-07-05
JPS6371537U (de) 1988-05-13
EP0266535A1 (de) 1988-05-11
EP0266535B1 (de) 1993-01-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee