DE3766160D1 - Hochreines titan und verfahren zu seiner herstellung. - Google Patents

Hochreines titan und verfahren zu seiner herstellung.

Info

Publication number
DE3766160D1
DE3766160D1 DE8787107682T DE3766160T DE3766160D1 DE 3766160 D1 DE3766160 D1 DE 3766160D1 DE 8787107682 T DE8787107682 T DE 8787107682T DE 3766160 T DE3766160 T DE 3766160T DE 3766160 D1 DE3766160 D1 DE 3766160D1
Authority
DE
Germany
Prior art keywords
production
high purity
purity titanium
titanium
purity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787107682T
Other languages
English (en)
Inventor
Kazumi Shimotori
Yoshiharu Ochi
Hideo Ishihara
Takenori Umeki
Takashi Ishigami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Materials Co Ltd
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3766160D1 publication Critical patent/DE3766160D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
    • C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B34/00—Obtaining refractory metals
    • C22B34/10—Obtaining titanium, zirconium or hafnium
    • C22B34/12—Obtaining titanium or titanium compounds from ores or scrap by metallurgical processing; preparation of titanium compounds from other titanium compounds see C01G23/00 - C01G23/08
    • C22B34/129—Obtaining titanium or titanium compounds from ores or scrap by metallurgical processing; preparation of titanium compounds from other titanium compounds see C01G23/00 - C01G23/08 obtaining metallic titanium from titanium compounds by dissociation, e.g. thermic dissociation of titanium tetraiodide, or by electrolysis or with the use of an electric arc
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B34/00—Obtaining refractory metals
    • C22B34/10—Obtaining titanium, zirconium or hafnium
    • C22B34/12—Obtaining titanium or titanium compounds from ores or scrap by metallurgical processing; preparation of titanium compounds from other titanium compounds see C01G23/00 - C01G23/08
    • C22B34/1295—Refining, melting, remelting, working up of titanium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B9/00—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
    • C22B9/16—Remelting metals
    • C22B9/22—Remelting metals with heating by wave energy or particle radiation
    • C22B9/228—Remelting metals with heating by wave energy or particle radiation by particle radiation, e.g. electron beams
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C14/00—Alloys based on titanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53257—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a refractory metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Geology (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE8787107682T 1986-05-30 1987-05-26 Hochreines titan und verfahren zu seiner herstellung. Expired - Lifetime DE3766160D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61123463A JPS62280335A (ja) 1986-05-30 1986-05-30 薄膜形成用高純度チタン材、それを用いて形成されてなるターゲットおよび薄膜、および薄膜形成用高純度チタン材の製造方法

Publications (1)

Publication Number Publication Date
DE3766160D1 true DE3766160D1 (de) 1990-12-20

Family

ID=14861251

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787107682T Expired - Lifetime DE3766160D1 (de) 1986-05-30 1987-05-26 Hochreines titan und verfahren zu seiner herstellung.

Country Status (5)

Country Link
US (3) US4793854A (de)
EP (1) EP0248338B1 (de)
JP (1) JPS62280335A (de)
KR (1) KR900007453B1 (de)
DE (1) DE3766160D1 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2601843B2 (ja) * 1987-10-19 1997-04-16 株式会社東芝 半導体素子およびその製造方法
US5085830A (en) * 1989-03-24 1992-02-04 Comalco Aluminum Limited Process for making aluminum-lithium alloys of high toughness
JPH07103432B2 (ja) * 1989-07-14 1995-11-08 株式会社東芝 半導体素子形成用高純度チタン材、高純度チタン材の製造方法、それを用いたスパッタターゲットおよび高純度チタン膜
US5204057A (en) * 1989-07-14 1993-04-20 Kabushiki Kaisha Toshiba Highly purified titanium material and its named article, a sputtering target
US6210634B1 (en) 1989-07-14 2001-04-03 Kabushiki Kaisha Toshiba Highly purified titanium material, method for preparation of it and sputtering target using it
JP2921799B2 (ja) * 1990-02-15 1999-07-19 株式会社 東芝 半導体素子形成用高純度スパッタターゲットの製造方法
KR940008936B1 (ko) * 1990-02-15 1994-09-28 가부시끼가이샤 도시바 고순도 금속재와 그 성질을 이용한 반도체 장치 및 그 제조방법
JP2651945B2 (ja) * 1990-02-20 1997-09-10 株式会社ジャパンエナジー チタンの脱酸方法
JP2768109B2 (ja) * 1992-01-16 1998-06-25 三菱マテリアル株式会社 高純度誘電体薄膜
US5503655A (en) * 1994-02-23 1996-04-02 Orbit Technologies, Inc. Low cost titanium production
EP0700685A3 (de) * 1994-09-12 2000-01-12 Japan Energy Corporation Titanmaterial zur Implantation im Körper eines Lebewesens
US5700519A (en) * 1995-01-06 1997-12-23 Sony Corporation Method for producing ultra high purity titanium films
US5749937A (en) 1995-03-14 1998-05-12 Lockheed Idaho Technologies Company Fast quench reactor and method
US7576296B2 (en) * 1995-03-14 2009-08-18 Battelle Energy Alliance, Llc Thermal synthesis apparatus
US6821500B2 (en) 1995-03-14 2004-11-23 Bechtel Bwxt Idaho, Llc Thermal synthesis apparatus and process
JP3413782B2 (ja) * 1995-03-31 2003-06-09 日立金属株式会社 スパッタリング用チタンタ−ゲットおよびその製造方法
US5783487A (en) * 1996-02-20 1998-07-21 Motorola, Inc. Method of coupling titanium to a semiconductor substrate and semiconductor device thereof
US6309595B1 (en) 1997-04-30 2001-10-30 The Altalgroup, Inc Titanium crystal and titanium
US6024847A (en) * 1997-04-30 2000-02-15 The Alta Group, Inc. Apparatus for producing titanium crystal and titanium
US6063254A (en) * 1997-04-30 2000-05-16 The Alta Group, Inc. Method for producing titanium crystal and titanium
US6521173B2 (en) * 1999-08-19 2003-02-18 H.C. Starck, Inc. Low oxygen refractory metal powder for powder metallurgy
US6755948B1 (en) 1999-11-22 2004-06-29 Nikko Materials Company, Limited Titanium target for sputtering
AU2906401A (en) * 1999-12-21 2001-07-03 Bechtel Bwxt Idaho, Llc Hydrogen and elemental carbon production from natural gas and other hydrocarbons
US6827828B2 (en) 2001-03-29 2004-12-07 Honeywell International Inc. Mixed metal materials
US6824585B2 (en) * 2002-12-03 2004-11-30 Adrian Joseph Low cost high speed titanium and its alloy production
US7354561B2 (en) * 2004-11-17 2008-04-08 Battelle Energy Alliance, Llc Chemical reactor and method for chemically converting a first material into a second material
US8591821B2 (en) * 2009-04-23 2013-11-26 Battelle Energy Alliance, Llc Combustion flame-plasma hybrid reactor systems, and chemical reactant sources
EP3561091A1 (de) 2011-12-22 2019-10-30 Universal Achemetal Titanium, LLC Verfahren zur extraktion und reinigung von titan
US20150240332A1 (en) * 2013-01-25 2015-08-27 Nippon Steel & Sumitomo Metal Corporation Titanium alloy having high corrosion resistance in bromine-ion-containing environment
US9171497B2 (en) * 2013-05-06 2015-10-27 Shenzhen China Star Optoelectronics Technology Co., Ltd Method for inspecting packaging effectiveness of OLED panel
CN103540772B (zh) * 2013-09-12 2014-10-01 云南钛业股份有限公司 一种“两端设点”熔炼纯钛的方法
RU2750608C2 (ru) 2016-09-14 2021-06-29 ЮНИВЕРСАЛ АКЕМЕТАЛ ТИТАНИУМ, ЭлЭлСи Способ производства сплава титан-алюминий-ванадий
US20180202058A1 (en) 2017-01-13 2018-07-19 Universal Technical Resource Services, Inc. Titanium master alloy for titanium-aluminum based alloys
WO2019026251A1 (ja) * 2017-08-03 2019-02-07 新日鐵住金株式会社 チタン塊およびその製造方法、ならびに、チタンスラブ

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2698267A (en) * 1953-06-25 1954-12-28 Roy A Halversen Working of titanium
US2819158A (en) * 1953-08-07 1958-01-07 James H Johnston Method of arc-melting titanium
US2813921A (en) * 1954-05-10 1957-11-19 Rem Cru Titanium Inc Consumable electrode for melting of chemically reactive metals
US2878008A (en) * 1955-07-22 1959-03-17 Ishizuka Hiroshi Apparatus for continuous vacuum refining of sponge metallic titanium
US2777763A (en) * 1955-09-14 1957-01-15 Ethyl Corp Method of producing titanium
US3024102A (en) * 1956-03-16 1962-03-06 Union Carbide Corp High-vacuum titanium a. c. arc melting
US2977219A (en) * 1957-09-30 1961-03-28 Edward J Chapin Process for purifying titanium
FR1439859A (fr) * 1964-11-17 1966-05-27 Heurtey Sa Perfectionnements apportés aux procédés et aux dispositifs de purification des métaux à point de fusion élevé
US4111686A (en) * 1971-05-06 1978-09-05 Rene Antoine Paris Production of metals and metal alloys of high purity
US3784593A (en) * 1972-03-22 1974-01-08 P Taylor Process for class iv-b metals ore reduction (improvement)
US3948637A (en) * 1974-06-10 1976-04-06 Paul Franklin Taylor Process for class IV-B metals ore reduction
JPS6066425A (ja) * 1983-09-22 1985-04-16 Nippon Telegr & Teleph Corp <Ntt> Ｌｓｉ電極用の高純度モリブデンタ−ゲツトならびに高純度モリブデンシリサイドタ−ゲツトおよびその製造方法
US4580066A (en) * 1984-03-22 1986-04-01 Sperry Corporation Fast scan/set testable latch using two levels of series gating with two current sources
JPS61106731A (ja) * 1984-10-30 1986-05-24 Shinku Yakin Kk 高融点活性金属合金の溶製法
US4786962A (en) * 1986-06-06 1988-11-22 Hewlett-Packard Company Process for fabricating multilevel metal integrated circuits and structures produced thereby
KR940008936B1 (ko) * 1990-02-15 1994-09-28 가부시끼가이샤 도시바 고순도 금속재와 그 성질을 이용한 반도체 장치 및 그 제조방법

Also Published As

Publication number Publication date
USRE34598E (en) 1994-05-03
KR900007453B1 (ko) 1990-10-10
US4891066A (en) 1990-01-02
US4793854A (en) 1988-12-27
EP0248338B1 (de) 1990-11-14
KR870011265A (ko) 1987-12-22
JPS62280335A (ja) 1987-12-05
EP0248338A1 (de) 1987-12-09
JPH0475301B2 (de) 1992-11-30
US4793854B1 (de) 1992-10-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8327 Change in the person/name/address of the patent owner

Owner name: KABUSHIKI KAISHA TOSHIBA, TOKYO, JP

Owner name: TOSHIBA MATERIALS CO., LTD., YOKOHAMA, KANAGAW, JP