DE3760833D1 - Method of detecting the presence or absence of defect of transparent circuit board having fine transparent electric conductive circuit - Google Patents
Method of detecting the presence or absence of defect of transparent circuit board having fine transparent electric conductive circuitInfo
- Publication number
- DE3760833D1 DE3760833D1 DE8787303908T DE3760833T DE3760833D1 DE 3760833 D1 DE3760833 D1 DE 3760833D1 DE 8787303908 T DE8787303908 T DE 8787303908T DE 3760833 T DE3760833 T DE 3760833T DE 3760833 D1 DE3760833 D1 DE 3760833D1
- Authority
- DE
- Germany
- Prior art keywords
- transparent
- defect
- absence
- detecting
- electric conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/91—Investigating the presence of flaws or contamination using penetration of dyes, e.g. fluorescent ink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
Landscapes
- General Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Pathology (AREA)
- Liquid Crystal (AREA)
- Manufacturing Of Electric Cables (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Optical Filters (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61101714A JPH0690151B2 (ja) | 1986-05-01 | 1986-05-01 | 微細な透明導電回路を有する透明回路基板の欠陥の有無検出法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3760833D1 true DE3760833D1 (en) | 1989-11-23 |
Family
ID=14307971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787303908T Expired DE3760833D1 (en) | 1986-05-01 | 1987-04-30 | Method of detecting the presence or absence of defect of transparent circuit board having fine transparent electric conductive circuit |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0244259B1 (de) |
JP (1) | JPH0690151B2 (de) |
DE (1) | DE3760833D1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103809309A (zh) * | 2014-01-22 | 2014-05-21 | 北京京东方显示技术有限公司 | 基板检测设备及方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2642462B2 (ja) * | 1988-12-12 | 1997-08-20 | シャープ株式会社 | マトリクス形表示装置用基板および検査修正方法 |
US5937512A (en) * | 1996-01-11 | 1999-08-17 | Micron Communications, Inc. | Method of forming a circuit board |
CN103792705B (zh) * | 2014-01-28 | 2017-02-01 | 北京京东方显示技术有限公司 | 检测基板缺陷的检测方法及检测装置 |
JP6323266B2 (ja) * | 2014-09-03 | 2018-05-16 | 大日本印刷株式会社 | 蒸着マスクの検査方法 |
CN109683358B (zh) * | 2019-01-22 | 2022-08-12 | 成都中电熊猫显示科技有限公司 | 检测方法、装置和存储介质 |
JP7274377B2 (ja) * | 2019-07-19 | 2023-05-16 | 信越ポリマー株式会社 | 多層回路基板 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5683093A (en) * | 1979-12-11 | 1981-07-07 | Fujitsu Ltd | Method of inspecting printed circuit pattern |
US4400618A (en) * | 1981-08-06 | 1983-08-23 | International Business Machines Corporation | Method of detecting and analyzing damage in printed circuit boards |
-
1986
- 1986-05-01 JP JP61101714A patent/JPH0690151B2/ja not_active Expired - Lifetime
-
1987
- 1987-04-30 EP EP19870303908 patent/EP0244259B1/de not_active Expired
- 1987-04-30 DE DE8787303908T patent/DE3760833D1/de not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103809309A (zh) * | 2014-01-22 | 2014-05-21 | 北京京东方显示技术有限公司 | 基板检测设备及方法 |
CN103809309B (zh) * | 2014-01-22 | 2016-07-06 | 北京京东方显示技术有限公司 | 基板检测设备及方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS62258490A (ja) | 1987-11-10 |
EP0244259B1 (de) | 1989-10-18 |
JPH0690151B2 (ja) | 1994-11-14 |
EP0244259A1 (de) | 1987-11-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |