DE3750279D1 - Abbildungsverfahren für den Aufbau keramischer elektronischer Schaltkreise. - Google Patents

Abbildungsverfahren für den Aufbau keramischer elektronischer Schaltkreise.

Info

Publication number
DE3750279D1
DE3750279D1 DE3750279T DE3750279T DE3750279D1 DE 3750279 D1 DE3750279 D1 DE 3750279D1 DE 3750279 T DE3750279 T DE 3750279T DE 3750279 T DE3750279 T DE 3750279T DE 3750279 D1 DE3750279 D1 DE 3750279D1
Authority
DE
Germany
Prior art keywords
construction
electronic circuits
ceramic electronic
mapping process
mapping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3750279T
Other languages
English (en)
Other versions
DE3750279T2 (de
Inventor
John Wing-Keung Lau
Kevin Elliott Bennet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WR Grace and Co Conn
WR Grace and Co
Original Assignee
WR Grace and Co Conn
WR Grace and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WR Grace and Co Conn, WR Grace and Co filed Critical WR Grace and Co Conn
Publication of DE3750279D1 publication Critical patent/DE3750279D1/de
Application granted granted Critical
Publication of DE3750279T2 publication Critical patent/DE3750279T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Ceramic Capacitors (AREA)
DE3750279T 1986-07-02 1987-05-22 Abbildungsverfahren für den Aufbau keramischer elektronischer Schaltkreise. Expired - Lifetime DE3750279T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/881,421 US4828961A (en) 1986-07-02 1986-07-02 Imaging process for forming ceramic electronic circuits

Publications (2)

Publication Number Publication Date
DE3750279D1 true DE3750279D1 (de) 1994-09-01
DE3750279T2 DE3750279T2 (de) 1994-11-17

Family

ID=25378447

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3750279T Expired - Lifetime DE3750279T2 (de) 1986-07-02 1987-05-22 Abbildungsverfahren für den Aufbau keramischer elektronischer Schaltkreise.

Country Status (4)

Country Link
US (1) US4828961A (de)
EP (1) EP0250842B1 (de)
JP (1) JPS6315491A (de)
DE (1) DE3750279T2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01248593A (ja) * 1988-03-30 1989-10-04 Ngk Insulators Ltd セラミック多層配線基板
US5209688A (en) * 1988-12-19 1993-05-11 Narumi China Corporation Plasma display panel
JP2748187B2 (ja) * 1990-11-14 1998-05-06 株式会社トキメック ジャイロコンパスの誤差修正装置
US5627013A (en) * 1991-11-14 1997-05-06 Rohm Co., Ltd. Method of forming a fine pattern of ferroelectric film
US5184286A (en) * 1992-03-18 1993-02-02 Martin Marietta Energy Systems, Inc. Process for manufacturing tantalum capacitors
US5481428A (en) * 1992-06-18 1996-01-02 Martin Marietta Energy Systems, Inc. Process for manufacturing multilayer capacitors
US5496682A (en) * 1993-10-15 1996-03-05 W. R. Grace & Co.-Conn. Three dimensional sintered inorganic structures using photopolymerization
DE4440230C2 (de) * 1993-11-10 1999-03-18 Hyundai Electronics Ind Verfahren zur Bildung feiner Strukturen eines Halbleiterbauelements
US6117612A (en) * 1995-04-24 2000-09-12 Regents Of The University Of Michigan Stereolithography resin for rapid prototyping of ceramics and metals
US7418993B2 (en) 1998-11-20 2008-09-02 Rolls-Royce Corporation Method and apparatus for production of a cast component
US6932145B2 (en) * 1998-11-20 2005-08-23 Rolls-Royce Corporation Method and apparatus for production of a cast component
US6602766B2 (en) * 2000-12-07 2003-08-05 Aem, Inc. Ultraviolet/electron beam forming process for multi-layer electronic components and products thereof
US6652956B2 (en) * 2001-07-24 2003-11-25 International Business Machines Corporation X-ray printing personalization technique
US20060163989A1 (en) * 2002-07-10 2006-07-27 Koji Kawaguchi Blue color filter, and organic electroluminescent device using the same
JP3683891B2 (ja) * 2003-01-31 2005-08-17 Ｔｄｋ株式会社 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP4151846B2 (ja) * 2004-03-03 2008-09-17 Ｔｄｋ株式会社 積層セラミック電子部品、回路基板等、および当該部品、基板等の製造に供せられるセラミックグリーンシートの製造方法
US20090199392A1 (en) * 2008-02-11 2009-08-13 General Electric Company Ultrasound transducer probes and system and method of manufacture
US8853918B2 (en) * 2011-09-22 2014-10-07 General Electric Company Transducer structure for a transducer probe and methods of fabricating same
CN104204949A (zh) * 2012-03-28 2014-12-10 东丽株式会社 感光性导电糊剂以及导电图案的制造方法
US10321560B2 (en) 2015-11-12 2019-06-11 Multek Technologies Limited Dummy core plus plating resist restrict resin process and structure
US9999134B2 (en) 2016-03-14 2018-06-12 Multek Technologies Limited Self-decap cavity fabrication process and structure
US10064292B2 (en) * 2016-03-21 2018-08-28 Multek Technologies Limited Recessed cavity in printed circuit board protected by LPI
US11224117B1 (en) 2018-07-05 2022-01-11 Flex Ltd. Heat transfer in the printed circuit board of an SMPS by an integrated heat exchanger

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE631489A (de) * 1962-04-27
US3549784A (en) * 1968-02-01 1970-12-22 American Lava Corp Ceramic-metallic composite substrate
DE2003982A1 (de) * 1969-02-03 1970-08-06 Cincinnati Milling Machine Co Kupferkaschierte Kunststoffplatte und Verfahren zur Herstellung derselben
DE2003983B2 (de) * 1969-05-23 1971-04-15 North American Rockwell Corp , El Segundo, Calif (V St A ) Photographisches verfahren zur herstellung elektrischer schaltungen
US3978248A (en) * 1970-12-18 1976-08-31 Hitachi, Ltd. Method for manufacturing composite sintered structure
CH576739A5 (de) * 1972-08-25 1976-06-15 Ciba Geigy Ag
US3914128A (en) * 1973-06-08 1975-10-21 Du Pont Photohardenable paste compositions having high resolution
US4422914A (en) * 1981-01-16 1983-12-27 W. R. Grace & Co. Polymer composition having terminal alkene and terminal carboxyl groups
US4336320A (en) * 1981-03-12 1982-06-22 Honeywell Inc. Process for dielectric stenciled microcircuits
JPS58108794A (ja) * 1981-12-23 1983-06-28 株式会社日立製作所 セラミツク多層配線基板の製造方法
JPS5929160A (ja) * 1982-08-10 1984-02-16 三井化学株式会社 積層成形体
JPS59150453A (ja) * 1982-12-23 1984-08-28 Toshiba Corp 半導体モジユ−ル用基板の製造方法
US4586972A (en) * 1983-04-05 1986-05-06 Matsushita Electric Industrial Co., Ltd. Method for making multilayer ceramic body
US4555285A (en) * 1983-12-14 1985-11-26 International Business Machines Corporation Forming patterns in metallic or ceramic substrates
JPS62247587A (ja) * 1986-03-17 1987-10-28 日東電工株式会社 セラミツク基板の製造方法

Also Published As

Publication number Publication date
JPS6315491A (ja) 1988-01-22
EP0250842A3 (en) 1990-05-02
US4828961A (en) 1989-05-09
DE3750279T2 (de) 1994-11-17
EP0250842B1 (de) 1994-07-27
EP0250842A2 (de) 1988-01-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition