DE3667360D1 - Verfahren zum herstellen eines halbleiterelementes mit daran haftender klebeschicht. - Google Patents

Verfahren zum herstellen eines halbleiterelementes mit daran haftender klebeschicht.

Info

Publication number
DE3667360D1
DE3667360D1 DE8686201393T DE3667360T DE3667360D1 DE 3667360 D1 DE3667360 D1 DE 3667360D1 DE 8686201393 T DE8686201393 T DE 8686201393T DE 3667360 T DE3667360 T DE 3667360T DE 3667360 D1 DE3667360 D1 DE 3667360D1
Authority
DE
Germany
Prior art keywords
producing
semiconductor element
adhesive coating
adhesive
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686201393T
Other languages
English (en)
Inventor
Mark S Lang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ingredion Inc
Original Assignee
National Starch and Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Starch and Chemical Corp filed Critical National Starch and Chemical Corp
Application granted granted Critical
Publication of DE3667360D1 publication Critical patent/DE3667360D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
DE8686201393T 1985-08-08 1986-08-07 Verfahren zum herstellen eines halbleiterelementes mit daran haftender klebeschicht. Expired - Lifetime DE3667360D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76350685A 1985-08-08 1985-08-08

Publications (1)

Publication Number Publication Date
DE3667360D1 true DE3667360D1 (de) 1990-01-11

Family

ID=25068017

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686201393T Expired - Lifetime DE3667360D1 (de) 1985-08-08 1986-08-07 Verfahren zum herstellen eines halbleiterelementes mit daran haftender klebeschicht.

Country Status (4)

Country Link
EP (1) EP0215502B1 (de)
JP (1) JPS6235633A (de)
KR (1) KR870002636A (de)
DE (1) DE3667360D1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1290676C (en) * 1987-03-30 1991-10-15 William Frank Graham Method for bonding integrated circuit chips
US5296074A (en) * 1987-03-30 1994-03-22 E. I. Du Pont De Nemours And Company Method for bonding small electronic components
DE10258800A1 (de) * 2002-12-16 2004-07-08 Siemens Ag Verfahren und Vorrichtung zum Aufbringen einer Klebstoffschicht auf flächige Bauelemente, Bestückvorrichtung zum Bestücken von flächigen Bauelementen
CN101686771B (zh) 2007-06-05 2012-05-30 雀巢产品技术援助有限公司 用于通过离心法来制备容器中容纳的食品液体的胶囊系统、设备和方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4688075A (en) * 1983-07-22 1987-08-18 Fairchild Semiconductor Corporation Integrated circuit having a pre-attached conductive mounting media and method of making the same
CA1222071A (en) * 1984-01-30 1987-05-19 Joseph A. Aurichio Conductive die attach tape

Also Published As

Publication number Publication date
EP0215502A1 (de) 1987-03-25
JPS6235633A (ja) 1987-02-16
KR870002636A (ko) 1987-04-06
EP0215502B1 (de) 1989-12-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee