DE3665858D1 - Process for forming a metallurgical system comprising a bottom layer of nickel and a top layer of gold - Google Patents

Process for forming a metallurgical system comprising a bottom layer of nickel and a top layer of gold

Info

Publication number
DE3665858D1
DE3665858D1 DE8686106186T DE3665858T DE3665858D1 DE 3665858 D1 DE3665858 D1 DE 3665858D1 DE 8686106186 T DE8686106186 T DE 8686106186T DE 3665858 T DE3665858 T DE 3665858T DE 3665858 D1 DE3665858 D1 DE 3665858D1
Authority
DE
Germany
Prior art keywords
gold
nickel
forming
layer
metallurgical system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8686106186T
Other languages
German (de)
English (en)
Inventor
Avinash Sripad Adwalpalker
Joseph Matthew Harvilchuck
Joseph Rocco Ranalli
David William Rich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3665858D1 publication Critical patent/DE3665858D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H10W70/05—
    • H10W70/093—
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • H10W72/536—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)
  • Die Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
DE8686106186T 1985-05-17 1986-05-06 Process for forming a metallurgical system comprising a bottom layer of nickel and a top layer of gold Expired DE3665858D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/735,040 US4601424A (en) 1985-05-17 1985-05-17 Stripped gold plating process

Publications (1)

Publication Number Publication Date
DE3665858D1 true DE3665858D1 (en) 1989-11-02

Family

ID=24954106

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686106186T Expired DE3665858D1 (en) 1985-05-17 1986-05-06 Process for forming a metallurgical system comprising a bottom layer of nickel and a top layer of gold

Country Status (5)

Country Link
US (1) US4601424A (enExample)
EP (1) EP0203423B1 (enExample)
JP (1) JPS61265853A (enExample)
CA (1) CA1232497A (enExample)
DE (1) DE3665858D1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI85835C (fi) * 1985-08-06 1992-06-10 Kureha Chemical Ind Co Ltd Roekbar syntetisk foerpackningsfilm foer livsmedel.
JP2781017B2 (ja) * 1989-09-04 1998-07-30 新光電気工業株式会社 セラミックパッケージ
US5038195A (en) * 1990-02-09 1991-08-06 Ibm Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
DE4107142A1 (de) * 1991-01-24 1992-07-30 Hoechst Ceram Tec Ag Verfahren zur herstellung von edelmetallbeschichteten schichten eines unedlen metalls
US5548486A (en) * 1994-01-21 1996-08-20 International Business Machines Corporation Pinned module
JP3000877B2 (ja) * 1995-02-20 2000-01-17 松下電器産業株式会社 金メッキ電極の形成方法、基板及びワイヤボンディング方法
US5878483A (en) * 1995-06-01 1999-03-09 International Business Machines Corporation Hammer for forming bulges in an array of compliant pin blanks
JPH10242205A (ja) * 1997-03-03 1998-09-11 Hitachi Chem Co Ltd ワイヤボンディング端子とその形成方法
DE10311031B4 (de) * 2003-03-13 2005-04-21 Siemens Ag Elektrochemischer Sensor und Verfahren zu dessen Herstellung
JP2005268672A (ja) * 2004-03-22 2005-09-29 Mitsubishi Electric Corp 基板
JP5927996B2 (ja) * 2012-03-02 2016-06-01 日産自動車株式会社 モータ配線構造
CN118731131A (zh) * 2017-06-29 2024-10-01 深圳市理邦精密仪器股份有限公司 用于血气生化测量的电极电路板以及制作电极的方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1031837A (en) * 1963-08-01 1966-06-02 Standard Telephones Cables Ltd Improvements in or relating to metal plating
US3386906A (en) * 1965-11-26 1968-06-04 Philips Corp Transistor base and method of making the same
DE1299769B (de) * 1966-08-26 1969-07-24 Bosch Gmbh Robert Verfahren zur Kontaktierung einer Halbleiteranordnung
US3982908A (en) * 1975-11-20 1976-09-28 Rca Corporation Nickel-gold-cobalt contact for silicon devices
US4268849A (en) * 1978-11-03 1981-05-19 National Semiconductor Corporation Raised bonding pad
US4268584A (en) * 1979-12-17 1981-05-19 International Business Machines Corporation Nickel-X/gold/nickel-X conductors for solid state devices where X is phosphorus, boron, or carbon
JPS5852900A (ja) * 1981-09-24 1983-03-29 株式会社日立製作所 セラミツク多層配線板の製造方法
US4442137A (en) * 1982-03-18 1984-04-10 International Business Machines Corporation Maskless coating of metallurgical features of a dielectric substrate

Also Published As

Publication number Publication date
JPH0253945B2 (enExample) 1990-11-20
JPS61265853A (ja) 1986-11-25
CA1232497A (en) 1988-02-09
EP0203423A1 (en) 1986-12-03
EP0203423B1 (en) 1989-09-27
US4601424A (en) 1986-07-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee