DE3617611C2 - - Google Patents

Info

Publication number
DE3617611C2
DE3617611C2 DE19863617611 DE3617611A DE3617611C2 DE 3617611 C2 DE3617611 C2 DE 3617611C2 DE 19863617611 DE19863617611 DE 19863617611 DE 3617611 A DE3617611 A DE 3617611A DE 3617611 C2 DE3617611 C2 DE 3617611C2
Authority
DE
Germany
Prior art keywords
cell
heat
conducting bracket
insulating
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19863617611
Other languages
German (de)
English (en)
Other versions
DE3617611A1 (de
Inventor
Joachim Dipl.-Ing. Manchen
Kurt Freudenthaler
Karl-Heinz 1000 Berlin De Bezold
Heinz 4788 Warstein De Juchmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alstom Transportation Germany GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19863617611 priority Critical patent/DE3617611A1/de
Publication of DE3617611A1 publication Critical patent/DE3617611A1/de
Application granted granted Critical
Publication of DE3617611C2 publication Critical patent/DE3617611C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19863617611 1986-05-24 1986-05-24 Thermisch leitende und elektrisch isolierende zwischenlage fuer aufbau und befestigung von halbleiterelementen und anordnung unter anwendung derartiger zwischenlagen Granted DE3617611A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19863617611 DE3617611A1 (de) 1986-05-24 1986-05-24 Thermisch leitende und elektrisch isolierende zwischenlage fuer aufbau und befestigung von halbleiterelementen und anordnung unter anwendung derartiger zwischenlagen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863617611 DE3617611A1 (de) 1986-05-24 1986-05-24 Thermisch leitende und elektrisch isolierende zwischenlage fuer aufbau und befestigung von halbleiterelementen und anordnung unter anwendung derartiger zwischenlagen

Publications (2)

Publication Number Publication Date
DE3617611A1 DE3617611A1 (de) 1987-11-26
DE3617611C2 true DE3617611C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-12-07

Family

ID=6301632

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863617611 Granted DE3617611A1 (de) 1986-05-24 1986-05-24 Thermisch leitende und elektrisch isolierende zwischenlage fuer aufbau und befestigung von halbleiterelementen und anordnung unter anwendung derartiger zwischenlagen

Country Status (1)

Country Link
DE (1) DE3617611A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9319259U1 (de) * 1993-12-15 1994-03-24 Siemens AG, 80333 München Kühlkörper

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3825979A1 (de) * 1988-07-27 1990-02-01 Licentia Gmbh Anordnung zur kuehlung von verlustleistung abgebenden bauelementen
DE4302816C2 (de) * 1993-01-28 1996-08-08 Aeg Westinghouse Transport Anordnung zur Kühlung von druckkontaktierbaren Leistungs-Scheibenhalbleitern
DE102005002508B4 (de) * 2004-02-13 2014-09-04 Heidelberger Druckmaschinen Ag Leiterplatte mit Oxidationsschicht

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2606157C2 (de) * 1976-02-17 1983-11-10 Brown, Boveri & Cie Ag, 6800 Mannheim Verbindung von Kühldose einer Kühleinrichtung mit einer Kühlflüssigkeitszuleitung oder- ableitung
DE3335599A1 (de) * 1983-09-30 1985-04-18 Siemens AG, 1000 Berlin und 8000 München Waermeableitscheibe
IT1213139B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
DE8506352U1 (de) * 1985-03-01 1985-05-02 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Thermisch leitende und elektrisch isolierende Zwischenlage

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9319259U1 (de) * 1993-12-15 1994-03-24 Siemens AG, 80333 München Kühlkörper

Also Published As

Publication number Publication date
DE3617611A1 (de) 1987-11-26

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: DAIMLERCHRYSLER RAIL SYSTEMS GMBH, 13627 BERLIN, D

8339 Ceased/non-payment of the annual fee