DE3614086C2 - Vorrichtung zur Wärmeableitung von einer elektronische Komponenten enthaltenden Baueinheit und Verfahren zum thermischen Koppeln einer elektronische Komponenten enthaltenden Baueinheit - Google Patents
Vorrichtung zur Wärmeableitung von einer elektronische Komponenten enthaltenden Baueinheit und Verfahren zum thermischen Koppeln einer elektronische Komponenten enthaltenden BaueinheitInfo
- Publication number
- DE3614086C2 DE3614086C2 DE3614086A DE3614086A DE3614086C2 DE 3614086 C2 DE3614086 C2 DE 3614086C2 DE 3614086 A DE3614086 A DE 3614086A DE 3614086 A DE3614086 A DE 3614086A DE 3614086 C2 DE3614086 C2 DE 3614086C2
- Authority
- DE
- Germany
- Prior art keywords
- assembly
- cooling plate
- circuit board
- spring clip
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 9
- 238000000034 method Methods 0.000 title claims description 7
- 230000008878 coupling Effects 0.000 title claims description 4
- 238000010168 coupling process Methods 0.000 title claims description 4
- 238000005859 coupling reaction Methods 0.000 title claims description 4
- 238000001816 cooling Methods 0.000 claims description 34
- 239000004020 conductor Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10393—Clamping a component by an element or a set of elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8520503A IT1215267B (it) | 1985-04-26 | 1985-04-26 | Apparecchio e metodo per il perfezionato accoppiamento termico di un contenitore di semiconduttore ad una piastra di raffreddamento e l'aumentato accoppiamento elettrico dei conduttori del contenitore su piu' di un lato del contenitore ad una scheda circuitale. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3614086A1 DE3614086A1 (de) | 1986-10-30 |
DE3614086C2 true DE3614086C2 (de) | 1998-06-04 |
Family
ID=11167919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3614086A Expired - Fee Related DE3614086C2 (de) | 1985-04-26 | 1986-04-25 | Vorrichtung zur Wärmeableitung von einer elektronische Komponenten enthaltenden Baueinheit und Verfahren zum thermischen Koppeln einer elektronische Komponenten enthaltenden Baueinheit |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE3614086C2 (fr) |
FR (1) | FR2581250B1 (fr) |
IT (1) | IT1215267B (fr) |
NL (1) | NL193232C (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3633625A1 (de) * | 1985-12-04 | 1987-06-11 | Vdo Schindling | Traegerplatte |
DE4037488A1 (de) * | 1990-11-24 | 1992-05-27 | Bosch Gmbh Robert | Leistungsbausteine mit elektrisch isolierender thermischer ankopplung |
DE4141650C2 (de) * | 1991-12-17 | 1997-03-13 | Vero Electronics Gmbh | Kühlkörper mit abnehmbarer Andruckklammer |
DE4218224A1 (de) * | 1992-06-03 | 1993-12-09 | Asea Brown Boveri | Vorrichtung zum Befestigen mindestens eines Bauelementes an einem Träger |
US5283467A (en) * | 1992-06-05 | 1994-02-01 | Eaton Corporation | Heat sink mounting system for semiconductor devices |
DE4331377A1 (de) * | 1993-09-15 | 1995-03-16 | Siemens Matsushita Components | Elektrisches Bauelement |
DE19952768A1 (de) * | 1999-11-02 | 2001-05-31 | Wincor Nixdorf Gmbh & Co Kg | Vorrichtung zum thermischen Verbinden eines elektronischen Bauelementes mit einem Kühlkörper |
DE102015219851B4 (de) * | 2015-10-13 | 2018-05-17 | Zf Friedrichshafen Ag | Steuergerät |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3480836A (en) * | 1966-08-11 | 1969-11-25 | Ibm | Component mounted in a printed circuit |
DE7906405U1 (de) * | 1978-03-09 | 1979-07-26 | Sgs-Ates Componenti Elettronici S.P.A., Agrate Brianza, Mailand (Italien) | Klammer zum befestigen eines halbleiterbauelements an einem kuehlkoerper |
DE2823699A1 (de) * | 1978-05-31 | 1979-12-06 | Bosch Gmbh Robert | Anordnung mit einem kuehlkoerper fuer zwei halbleiterbauelemente |
DE2919058A1 (de) * | 1979-05-10 | 1980-11-20 | Siemens Ag | Elektronisches geraet mit mindestens einer leiterplatte |
DE8024180U1 (de) * | 1980-09-10 | 1980-12-04 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Baugruppe |
DE3128856A1 (de) * | 1981-07-22 | 1983-02-10 | Oelsch KG, 1000 Berlin | Vorrichtung zum befestigen elektronischer bauteile auf einer leiterplatte |
GB2129223A (en) * | 1982-10-09 | 1984-05-10 | Welwyn Electronics Ltd | Printed circuit boards |
DE3315583A1 (de) * | 1983-04-29 | 1984-10-31 | Siemens AG, 1000 Berlin und 8000 München | Ein elektrisches bauteil tragendes, gut kuehlbares schaltungsmodul |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8130512U1 (de) * | 1981-10-19 | 1982-06-16 | GARDENA Präzisionstechnik GmbH, 7907 Niederstotzingen | Clip zur befestigung von kuehlblechen an transistoren und dioden |
JPS59208762A (ja) * | 1983-05-09 | 1984-11-27 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | ソリツドステ−ト装置を放熱部材に圧接する装置 |
FR2567324B1 (fr) * | 1984-07-06 | 1986-11-28 | Telemecanique Electrique | Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique |
-
1985
- 1985-04-26 IT IT8520503A patent/IT1215267B/it active
-
1986
- 1986-04-25 DE DE3614086A patent/DE3614086C2/de not_active Expired - Fee Related
- 1986-04-25 NL NL8601072A patent/NL193232C/nl not_active IP Right Cessation
- 1986-04-25 FR FR868606059A patent/FR2581250B1/fr not_active Expired - Lifetime
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3480836A (en) * | 1966-08-11 | 1969-11-25 | Ibm | Component mounted in a printed circuit |
DE7906405U1 (de) * | 1978-03-09 | 1979-07-26 | Sgs-Ates Componenti Elettronici S.P.A., Agrate Brianza, Mailand (Italien) | Klammer zum befestigen eines halbleiterbauelements an einem kuehlkoerper |
DE2823699A1 (de) * | 1978-05-31 | 1979-12-06 | Bosch Gmbh Robert | Anordnung mit einem kuehlkoerper fuer zwei halbleiterbauelemente |
DE2919058A1 (de) * | 1979-05-10 | 1980-11-20 | Siemens Ag | Elektronisches geraet mit mindestens einer leiterplatte |
DE8024180U1 (de) * | 1980-09-10 | 1980-12-04 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Baugruppe |
DE3128856A1 (de) * | 1981-07-22 | 1983-02-10 | Oelsch KG, 1000 Berlin | Vorrichtung zum befestigen elektronischer bauteile auf einer leiterplatte |
GB2129223A (en) * | 1982-10-09 | 1984-05-10 | Welwyn Electronics Ltd | Printed circuit boards |
DE3315583A1 (de) * | 1983-04-29 | 1984-10-31 | Siemens AG, 1000 Berlin und 8000 München | Ein elektrisches bauteil tragendes, gut kuehlbares schaltungsmodul |
Also Published As
Publication number | Publication date |
---|---|
NL8601072A (nl) | 1986-11-17 |
FR2581250A1 (fr) | 1986-10-31 |
DE3614086A1 (de) | 1986-10-30 |
NL193232B (nl) | 1998-11-02 |
FR2581250B1 (fr) | 1991-06-21 |
IT1215267B (it) | 1990-01-31 |
IT8520503A0 (it) | 1985-04-26 |
NL193232C (nl) | 1999-03-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |