DE3573193D1 - Apparatus for conduction cooling - Google Patents
Apparatus for conduction coolingInfo
- Publication number
- DE3573193D1 DE3573193D1 DE8585107251T DE3573193T DE3573193D1 DE 3573193 D1 DE3573193 D1 DE 3573193D1 DE 8585107251 T DE8585107251 T DE 8585107251T DE 3573193 T DE3573193 T DE 3573193T DE 3573193 D1 DE3573193 D1 DE 3573193D1
- Authority
- DE
- Germany
- Prior art keywords
- conduction cooling
- conduction
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W40/611—
-
- H10W40/774—
-
- H10W72/07251—
-
- H10W72/20—
-
- H10W72/877—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US62655484A | 1984-06-29 | 1984-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3573193D1 true DE3573193D1 (en) | 1989-10-26 |
Family
ID=24510887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE8585107251T Expired DE3573193D1 (en) | 1984-06-29 | 1985-06-14 | Apparatus for conduction cooling |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0167033B1 (enExample) |
| JP (1) | JPS6115353A (enExample) |
| DE (1) | DE3573193D1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62238653A (ja) * | 1986-04-09 | 1987-10-19 | Nec Corp | 冷却構造 |
| JPH063831B2 (ja) * | 1987-04-08 | 1994-01-12 | 株式会社日立製作所 | 冷却装置及びそれを用いた半導体装置 |
| JPH0310224A (ja) * | 1989-06-07 | 1991-01-17 | Sharp Corp | 表示装置 |
| DE3927755C2 (de) * | 1989-08-23 | 1997-09-11 | Sel Alcatel Ag | Wärmeableitvorrichtung für elektrische Bauelemente |
| US5161089A (en) * | 1990-06-04 | 1992-11-03 | International Business Machines Corporation | Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same |
| DE4404035A1 (de) * | 1994-02-09 | 1995-08-10 | Sel Alcatel Ag | Wärmeleitvorrichtung für elektrische Bauelemente |
| DE19612259A1 (de) * | 1996-03-28 | 1997-10-02 | Sel Alcatel Ag | IC-Bauelement mit Kühlanordnung |
| JP3241639B2 (ja) | 1997-06-30 | 2001-12-25 | 日本電気株式会社 | マルチチップモジュールの冷却構造およびその製造方法 |
| JP3532871B2 (ja) | 2001-02-28 | 2004-05-31 | 株式会社東芝 | 冷却装置およびこの冷却装置を有する電子機器 |
| US9313923B2 (en) | 2014-05-07 | 2016-04-12 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Multi-component heatsink with self-adjusting pin fins |
| JP7315210B2 (ja) * | 2019-09-26 | 2023-07-26 | 株式会社フォブ | 光検出装置、及び製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3972012A (en) * | 1974-12-23 | 1976-07-27 | Rca Corporation | Apparatus for mounting a diode in a microwave circuit |
| US3993123A (en) * | 1975-10-28 | 1976-11-23 | International Business Machines Corporation | Gas encapsulated cooling module |
| JPS58501648A (ja) * | 1981-12-29 | 1983-09-29 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 冷却手段を備えた半導体組立体 |
-
1985
- 1985-03-29 JP JP60064029A patent/JPS6115353A/ja active Granted
- 1985-06-14 EP EP85107251A patent/EP0167033B1/en not_active Expired
- 1985-06-14 DE DE8585107251T patent/DE3573193D1/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0354864B2 (enExample) | 1991-08-21 |
| JPS6115353A (ja) | 1986-01-23 |
| EP0167033B1 (en) | 1989-09-20 |
| EP0167033A2 (en) | 1986-01-08 |
| EP0167033A3 (en) | 1987-03-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |