GB8527627D0 - Cooling apparatus - Google Patents

Cooling apparatus

Info

Publication number
GB8527627D0
GB8527627D0 GB8527627A GB8527627A GB8527627D0 GB 8527627 D0 GB8527627 D0 GB 8527627D0 GB 8527627 A GB8527627 A GB 8527627A GB 8527627 A GB8527627 A GB 8527627A GB 8527627 D0 GB8527627 D0 GB 8527627D0
Authority
GB
United Kingdom
Prior art keywords
cooling apparatus
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8527627A
Other versions
GB2167550A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB8527627D0 publication Critical patent/GB8527627D0/en
Publication of GB2167550A publication Critical patent/GB2167550A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB8527627A 1984-11-08 1985-11-08 Cooling apparatus for semiconductor device Withdrawn GB2167550A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23576084A JPS61113265A (en) 1984-11-08 1984-11-08 Cooling device for semiconductor element or the like

Publications (2)

Publication Number Publication Date
GB8527627D0 true GB8527627D0 (en) 1985-12-11
GB2167550A GB2167550A (en) 1986-05-29

Family

ID=16990827

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8527627A Withdrawn GB2167550A (en) 1984-11-08 1985-11-08 Cooling apparatus for semiconductor device

Country Status (2)

Country Link
JP (1) JPS61113265A (en)
GB (1) GB2167550A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU1768914C (en) * 1986-11-18 1992-10-15 Киевский Политехнический Институт Им.50-Летия Великой Октябрьской Социалистической Революции Heat transfer tube
US4805691A (en) * 1986-12-22 1989-02-21 Sundstrand Corporation Cooling technique for compact electronics inverter
EP0539583B1 (en) * 1989-02-06 1995-11-29 The Furukawa Electric Co., Ltd. Method of producing heat pipe-type semiconductor cooling device
US4966226A (en) * 1989-12-29 1990-10-30 Digital Equipment Corporation Composite graphite heat pipe apparatus and method
US4995451A (en) * 1989-12-29 1991-02-26 Digital Equipment Corporation Evaporator having etched fiber nucleation sites and method of fabricating same
JP3284585B2 (en) * 1992-04-10 2002-05-20 ソニー株式会社 Electronic equipment cooling device
US5412535A (en) * 1993-08-24 1995-05-02 Convex Computer Corporation Apparatus and method for cooling electronic devices
JP3020790B2 (en) * 1993-12-28 2000-03-15 株式会社日立製作所 Heat pipe type cooling device and vehicle control device using the same
FR2860368B1 (en) * 2003-09-25 2007-07-27 Omwave Sas CENTRAL AUDIO, VIDEO, AND PC FUNCTION MANAGEMENT APPARATUS
CN104654669B (en) * 2015-02-03 2016-10-19 青岛海尔股份有限公司 Heat-exchanger rig and there is its semiconductor freezer
FR3043764B1 (en) * 2015-11-16 2018-01-05 Airbus Defence And Space Sas THERMAL EXCHANGE DEVICE FOR ARTIFICIAL SATELLITE, WALL AND ASSEMBLY OF WALLS COMPRISING SUCH THERMAL EXCHANGE DEVICE

Also Published As

Publication number Publication date
GB2167550A (en) 1986-05-29
JPS61113265A (en) 1986-05-31

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)