GB8527627D0 - Cooling apparatus - Google Patents
Cooling apparatusInfo
- Publication number
- GB8527627D0 GB8527627D0 GB8527627A GB8527627A GB8527627D0 GB 8527627 D0 GB8527627 D0 GB 8527627D0 GB 8527627 A GB8527627 A GB 8527627A GB 8527627 A GB8527627 A GB 8527627A GB 8527627 D0 GB8527627 D0 GB 8527627D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- cooling apparatus
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23576084A JPS61113265A (en) | 1984-11-08 | 1984-11-08 | Cooling device for semiconductor element or the like |
Publications (2)
Publication Number | Publication Date |
---|---|
GB8527627D0 true GB8527627D0 (en) | 1985-12-11 |
GB2167550A GB2167550A (en) | 1986-05-29 |
Family
ID=16990827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8527627A Withdrawn GB2167550A (en) | 1984-11-08 | 1985-11-08 | Cooling apparatus for semiconductor device |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS61113265A (en) |
GB (1) | GB2167550A (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU1768914C (en) * | 1986-11-18 | 1992-10-15 | Киевский Политехнический Институт Им.50-Летия Великой Октябрьской Социалистической Революции | Heat transfer tube |
US4805691A (en) * | 1986-12-22 | 1989-02-21 | Sundstrand Corporation | Cooling technique for compact electronics inverter |
EP0539583B1 (en) * | 1989-02-06 | 1995-11-29 | The Furukawa Electric Co., Ltd. | Method of producing heat pipe-type semiconductor cooling device |
US4966226A (en) * | 1989-12-29 | 1990-10-30 | Digital Equipment Corporation | Composite graphite heat pipe apparatus and method |
US4995451A (en) * | 1989-12-29 | 1991-02-26 | Digital Equipment Corporation | Evaporator having etched fiber nucleation sites and method of fabricating same |
JP3284585B2 (en) * | 1992-04-10 | 2002-05-20 | ソニー株式会社 | Electronic equipment cooling device |
US5412535A (en) * | 1993-08-24 | 1995-05-02 | Convex Computer Corporation | Apparatus and method for cooling electronic devices |
JP3020790B2 (en) * | 1993-12-28 | 2000-03-15 | 株式会社日立製作所 | Heat pipe type cooling device and vehicle control device using the same |
FR2860368B1 (en) * | 2003-09-25 | 2007-07-27 | Omwave Sas | CENTRAL AUDIO, VIDEO, AND PC FUNCTION MANAGEMENT APPARATUS |
CN104654669B (en) * | 2015-02-03 | 2016-10-19 | 青岛海尔股份有限公司 | Heat-exchanger rig and there is its semiconductor freezer |
FR3043764B1 (en) * | 2015-11-16 | 2018-01-05 | Airbus Defence And Space Sas | THERMAL EXCHANGE DEVICE FOR ARTIFICIAL SATELLITE, WALL AND ASSEMBLY OF WALLS COMPRISING SUCH THERMAL EXCHANGE DEVICE |
-
1984
- 1984-11-08 JP JP23576084A patent/JPS61113265A/en active Pending
-
1985
- 1985-11-08 GB GB8527627A patent/GB2167550A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB2167550A (en) | 1986-05-29 |
JPS61113265A (en) | 1986-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |