DE3528427A1 - Elektrische verbindungslasche fuer halbleiterbauelemente - Google Patents

Elektrische verbindungslasche fuer halbleiterbauelemente

Info

Publication number
DE3528427A1
DE3528427A1 DE19853528427 DE3528427A DE3528427A1 DE 3528427 A1 DE3528427 A1 DE 3528427A1 DE 19853528427 DE19853528427 DE 19853528427 DE 3528427 A DE3528427 A DE 3528427A DE 3528427 A1 DE3528427 A1 DE 3528427A1
Authority
DE
Germany
Prior art keywords
soldering
connecting strap
solder
connecting tab
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19853528427
Other languages
German (de)
English (en)
Other versions
DE3528427C2 (https=
Inventor
Bertold Hahn
Dieter Dipl Phys Eisele
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB AG Germany
Original Assignee
Brown Boveri und Cie AG Germany
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brown Boveri und Cie AG Germany, BBC Brown Boveri AG Germany filed Critical Brown Boveri und Cie AG Germany
Priority to DE19853528427 priority Critical patent/DE3528427A1/de
Publication of DE3528427A1 publication Critical patent/DE3528427A1/de
Application granted granted Critical
Publication of DE3528427C2 publication Critical patent/DE3528427C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/655—Materials of strap connectors of outermost layers of multilayered strap connectors, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
DE19853528427 1985-08-08 1985-08-08 Elektrische verbindungslasche fuer halbleiterbauelemente Granted DE3528427A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19853528427 DE3528427A1 (de) 1985-08-08 1985-08-08 Elektrische verbindungslasche fuer halbleiterbauelemente

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853528427 DE3528427A1 (de) 1985-08-08 1985-08-08 Elektrische verbindungslasche fuer halbleiterbauelemente

Publications (2)

Publication Number Publication Date
DE3528427A1 true DE3528427A1 (de) 1987-04-02
DE3528427C2 DE3528427C2 (https=) 1989-04-06

Family

ID=6277990

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853528427 Granted DE3528427A1 (de) 1985-08-08 1985-08-08 Elektrische verbindungslasche fuer halbleiterbauelemente

Country Status (1)

Country Link
DE (1) DE3528427A1 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0362547A1 (en) * 1988-09-09 1990-04-11 Motorola, Inc. Power device with self-centering electrode
EP0292848A3 (en) * 1987-05-23 1990-09-26 Asea Brown Boveri Aktiengesellschaft Semiconductor power module and method of manufacturing it
US4994412A (en) * 1990-02-09 1991-02-19 Motorola Inc. Self-centering electrode for power devices
US5001545A (en) * 1988-09-09 1991-03-19 Motorola, Inc. Formed top contact for non-flat semiconductor devices
WO1998012745A1 (de) * 1996-09-18 1998-03-26 Siemens Aktiengesellschaft Stromanschluss für leistungshalbleiterbauelement
EP0966038A3 (en) * 1998-06-15 2001-02-28 Ford Motor Company Bonding of semiconductor power devices
EP3336881A1 (en) * 2016-12-19 2018-06-20 Nexperia B.V. Semiconductor device and method with clip arrangement in ic package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4300516C2 (de) * 1993-01-12 2001-05-17 Ixys Semiconductor Gmbh Leistungshalbleitermodul

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1930440A1 (de) * 1968-06-18 1970-01-02 Westinghouse Brake & Signal Halbleitervorrichtung mit mehreren Anschluessen
DE3127458A1 (de) * 1981-07-11 1983-02-03 Brown, Boveri & Cie Ag, 6800 Mannheim Elektrische verbindungslasche fuer halbleiterbauelemente
DE3232157A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Halbleiter-modul
DE3241508A1 (de) * 1982-11-10 1984-05-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungstransistor-modul
DE3406538A1 (de) * 1984-02-23 1985-08-29 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1930440A1 (de) * 1968-06-18 1970-01-02 Westinghouse Brake & Signal Halbleitervorrichtung mit mehreren Anschluessen
DE3127458A1 (de) * 1981-07-11 1983-02-03 Brown, Boveri & Cie Ag, 6800 Mannheim Elektrische verbindungslasche fuer halbleiterbauelemente
DE3232157A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Halbleiter-modul
DE3241508A1 (de) * 1982-11-10 1984-05-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungstransistor-modul
DE3406538A1 (de) * 1984-02-23 1985-08-29 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
US-Prospekt: Triac, SCR and Diac Chips, Technical Data T-1064, Teccor Electronics Inc. *

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0292848A3 (en) * 1987-05-23 1990-09-26 Asea Brown Boveri Aktiengesellschaft Semiconductor power module and method of manufacturing it
EP0362547A1 (en) * 1988-09-09 1990-04-11 Motorola, Inc. Power device with self-centering electrode
US4935803A (en) * 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
US5001545A (en) * 1988-09-09 1991-03-19 Motorola, Inc. Formed top contact for non-flat semiconductor devices
EP0358077A3 (en) * 1988-09-09 1991-04-03 Motorola, Inc. Semiconductor device and method of forming it
US4994412A (en) * 1990-02-09 1991-02-19 Motorola Inc. Self-centering electrode for power devices
WO1998012745A1 (de) * 1996-09-18 1998-03-26 Siemens Aktiengesellschaft Stromanschluss für leistungshalbleiterbauelement
US6175148B1 (en) 1996-09-18 2001-01-16 Siemens Aktiengesellschaft Electrical connection for a power semiconductor component
EP0966038A3 (en) * 1998-06-15 2001-02-28 Ford Motor Company Bonding of semiconductor power devices
EP3336881A1 (en) * 2016-12-19 2018-06-20 Nexperia B.V. Semiconductor device and method with clip arrangement in ic package
US10825757B2 (en) 2016-12-19 2020-11-03 Nexperia B.V. Semiconductor device and method with clip arrangement in IC package

Also Published As

Publication number Publication date
DE3528427C2 (https=) 1989-04-06

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Legal Events

Date Code Title Description
8101 Request for examination as to novelty
8105 Search report available
8110 Request for examination paragraph 44
8127 New person/name/address of the applicant

Owner name: BBC BROWN BOVERI AG, 6800 MANNHEIM, DE

8127 New person/name/address of the applicant

Owner name: ASEA BROWN BOVERI AG, 6800 MANNHEIM, DE

D2 Grant after examination
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee