DE3528291A1 - Anordnung zur kuehlung elektronischer bauelemente - Google Patents

Anordnung zur kuehlung elektronischer bauelemente

Info

Publication number
DE3528291A1
DE3528291A1 DE19853528291 DE3528291A DE3528291A1 DE 3528291 A1 DE3528291 A1 DE 3528291A1 DE 19853528291 DE19853528291 DE 19853528291 DE 3528291 A DE3528291 A DE 3528291A DE 3528291 A1 DE3528291 A1 DE 3528291A1
Authority
DE
Germany
Prior art keywords
cooling
components
heat
bulk material
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19853528291
Other languages
German (de)
English (en)
Other versions
DE3528291C2 (enExample
Inventor
Rainer Gumbsheimer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Karlsruher Institut fuer Technologie KIT
Original Assignee
Kernforschungszentrum Karlsruhe GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kernforschungszentrum Karlsruhe GmbH filed Critical Kernforschungszentrum Karlsruhe GmbH
Priority to DE19853528291 priority Critical patent/DE3528291A1/de
Publication of DE3528291A1 publication Critical patent/DE3528291A1/de
Application granted granted Critical
Publication of DE3528291C2 publication Critical patent/DE3528291C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE19853528291 1985-08-07 1985-08-07 Anordnung zur kuehlung elektronischer bauelemente Granted DE3528291A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19853528291 DE3528291A1 (de) 1985-08-07 1985-08-07 Anordnung zur kuehlung elektronischer bauelemente

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853528291 DE3528291A1 (de) 1985-08-07 1985-08-07 Anordnung zur kuehlung elektronischer bauelemente

Publications (2)

Publication Number Publication Date
DE3528291A1 true DE3528291A1 (de) 1987-02-19
DE3528291C2 DE3528291C2 (enExample) 1988-07-07

Family

ID=6277899

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853528291 Granted DE3528291A1 (de) 1985-08-07 1985-08-07 Anordnung zur kuehlung elektronischer bauelemente

Country Status (1)

Country Link
DE (1) DE3528291A1 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0551726A1 (en) * 1991-12-16 1993-07-21 AT&T Corp. Circuit pack layout with improved dissipation of heat produced by high power electronic components
EP0552538A1 (en) * 1991-12-16 1993-07-28 AT&T Corp. Narrow channel finned heat sinking for cooling high power electronic components
EP0831684A3 (de) * 1996-09-23 1998-05-13 D-Tech GmbH Antriebstechnik und Mikroelektronik Verpackung für Leistungselektronik
DE19739591A1 (de) * 1997-09-10 1999-03-11 Wuerth Elektronik Gmbh & Co Kg Recyclingfähige Leiterplatte, bestehend aus einem Folien- und Trägersystem
EP0877541A3 (de) * 1997-04-10 1999-03-17 Georg Schlomka Gehäuse für hochfrequent lärm- und wärmeemittierende Baugruppen
DE19836229C1 (de) * 1998-08-04 2000-03-23 Hielscher Gmbh Anordnung zur Wärmeableitung, insbesondere für Ultraschallwandler mit hoher Leistung
DE19854642A1 (de) * 1998-11-26 2000-06-15 Vacuumschmelze Gmbh Bauelement mit verbesserter Wärmesenke
WO2024149749A1 (en) * 2023-01-10 2024-07-18 Signify Holding B.V. Sustainable cooling for high power led drivers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1803395A1 (de) * 1968-04-08 1969-10-16 Siemens Ag Baueinheit fuer Geraete der Fernmeldetechnik
DE1615985A1 (de) * 1967-09-22 1970-06-04 Vitrohm Gmbh Co Kg Hochbelastbarer Drahtwiderstand
DE1773448A1 (de) * 1968-05-16 1971-09-23 Whitlock Inc Kapazitaetspegel
DE2638702A1 (de) * 1976-08-27 1978-03-02 Siemens Ag Kuehlvorrichtung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1615985A1 (de) * 1967-09-22 1970-06-04 Vitrohm Gmbh Co Kg Hochbelastbarer Drahtwiderstand
DE1803395A1 (de) * 1968-04-08 1969-10-16 Siemens Ag Baueinheit fuer Geraete der Fernmeldetechnik
DE1773448A1 (de) * 1968-05-16 1971-09-23 Whitlock Inc Kapazitaetspegel
DE2638702A1 (de) * 1976-08-27 1978-03-02 Siemens Ag Kuehlvorrichtung

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0552538A1 (en) * 1991-12-16 1993-07-28 AT&T Corp. Narrow channel finned heat sinking for cooling high power electronic components
US5294831A (en) * 1991-12-16 1994-03-15 At&T Bell Laboratories Circuit pack layout with improved dissipation of heat produced by high power electronic components
US5304846A (en) * 1991-12-16 1994-04-19 At&T Bell Laboratories Narrow channel finned heat sinking for cooling high power electronic components
EP0683624A3 (en) * 1991-12-16 1995-12-06 AT&T Corp. Narrow channel finned heat sinking for cooling high power electronic components
EP0551726A1 (en) * 1991-12-16 1993-07-21 AT&T Corp. Circuit pack layout with improved dissipation of heat produced by high power electronic components
EP0831684A3 (de) * 1996-09-23 1998-05-13 D-Tech GmbH Antriebstechnik und Mikroelektronik Verpackung für Leistungselektronik
EP0877541A3 (de) * 1997-04-10 1999-03-17 Georg Schlomka Gehäuse für hochfrequent lärm- und wärmeemittierende Baugruppen
DE19739591A1 (de) * 1997-09-10 1999-03-11 Wuerth Elektronik Gmbh & Co Kg Recyclingfähige Leiterplatte, bestehend aus einem Folien- und Trägersystem
DE19836229C1 (de) * 1998-08-04 2000-03-23 Hielscher Gmbh Anordnung zur Wärmeableitung, insbesondere für Ultraschallwandler mit hoher Leistung
US6481493B1 (en) 1998-08-04 2002-11-19 Dr. Heilscher Gmbh Arrangement for heat discharge, particularly for ultrasonic transducers with high performance
DE19854642A1 (de) * 1998-11-26 2000-06-15 Vacuumschmelze Gmbh Bauelement mit verbesserter Wärmesenke
DE19854642C2 (de) * 1998-11-26 2003-02-20 Vacuumschmelze Gmbh Bauelement mit verbesserter Wärmesenke
WO2024149749A1 (en) * 2023-01-10 2024-07-18 Signify Holding B.V. Sustainable cooling for high power led drivers

Also Published As

Publication number Publication date
DE3528291C2 (enExample) 1988-07-07

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee