DE3527818A1 - Gehaeuse fuer einen hybridschaltkreis - Google Patents

Gehaeuse fuer einen hybridschaltkreis

Info

Publication number
DE3527818A1
DE3527818A1 DE19853527818 DE3527818A DE3527818A1 DE 3527818 A1 DE3527818 A1 DE 3527818A1 DE 19853527818 DE19853527818 DE 19853527818 DE 3527818 A DE3527818 A DE 3527818A DE 3527818 A1 DE3527818 A1 DE 3527818A1
Authority
DE
Germany
Prior art keywords
housing
contact pins
housing according
edge
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19853527818
Other languages
German (de)
English (en)
Other versions
DE3527818C2 (https=
Inventor
Elmar Prof Dipl Ing Sieben
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technotron Elektrotechnische Geraete und Komponent
Original Assignee
Rose Elektrotechnik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rose Elektrotechnik GmbH and Co KG filed Critical Rose Elektrotechnik GmbH and Co KG
Priority to DE19853527818 priority Critical patent/DE3527818A1/de
Priority to GB8618777A priority patent/GB2188773B/en
Priority to FR868611207A priority patent/FR2585881B1/fr
Publication of DE3527818A1 publication Critical patent/DE3527818A1/de
Application granted granted Critical
Publication of DE3527818C2 publication Critical patent/DE3527818C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE19853527818 1985-08-02 1985-08-02 Gehaeuse fuer einen hybridschaltkreis Granted DE3527818A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE19853527818 DE3527818A1 (de) 1985-08-02 1985-08-02 Gehaeuse fuer einen hybridschaltkreis
GB8618777A GB2188773B (en) 1985-08-02 1986-07-31 Housing for a hybrid circuit
FR868611207A FR2585881B1 (fr) 1985-08-02 1986-08-01 Boitier pour un circuit hybride

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853527818 DE3527818A1 (de) 1985-08-02 1985-08-02 Gehaeuse fuer einen hybridschaltkreis

Publications (2)

Publication Number Publication Date
DE3527818A1 true DE3527818A1 (de) 1987-02-26
DE3527818C2 DE3527818C2 (https=) 1993-08-05

Family

ID=6277555

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853527818 Granted DE3527818A1 (de) 1985-08-02 1985-08-02 Gehaeuse fuer einen hybridschaltkreis

Country Status (3)

Country Link
DE (1) DE3527818A1 (https=)
FR (1) FR2585881B1 (https=)
GB (1) GB2188773B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3811313A1 (de) * 1988-04-02 1989-10-19 Messerschmitt Boelkow Blohm Gehaeuse fuer hybrid-schaltungen
DE3936613A1 (de) * 1989-11-03 1991-05-08 Technotron Gmbh & Co Kg Mehrfach verschliessbarers hybridschaltkreisgehaeuse
US5093282A (en) * 1988-04-13 1992-03-03 Kabushiki Kaisha Toshiba Method of making a semiconductor device having lead pins and a metal shell

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4218112B4 (de) * 1992-01-21 2012-03-01 Robert Bosch Gmbh Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge
DE4322034A1 (de) * 1992-08-06 1994-02-10 Deutsche Aerospace Kontaktierung und Verkapselung von integrierten Schaltungsmodulen
US5311400A (en) * 1993-06-16 1994-05-10 Gec-Marconi Electronic Systems Corp. Low profile header assembly for an encapsulated instrument
US5668408A (en) * 1996-04-12 1997-09-16 Hewlett-Packard Company Pin grid array solution for microwave multi-chip modules
US7361844B2 (en) 2002-11-25 2008-04-22 Vlt, Inc. Power converter package and thermal management

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3235945A (en) * 1962-10-09 1966-02-22 Philco Corp Connection of semiconductor elements to thin film circuits using foil ribbon
DE2233298B1 (de) * 1972-07-06 1973-04-05 Standard Elektrik Lorenz Ag, 7000 Stuttgart Metallgehaeuse fuer elektronische bauelemente

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3235945A (en) * 1962-10-09 1966-02-22 Philco Corp Connection of semiconductor elements to thin film circuits using foil ribbon
DE2233298B1 (de) * 1972-07-06 1973-04-05 Standard Elektrik Lorenz Ag, 7000 Stuttgart Metallgehaeuse fuer elektronische bauelemente

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3811313A1 (de) * 1988-04-02 1989-10-19 Messerschmitt Boelkow Blohm Gehaeuse fuer hybrid-schaltungen
US5093282A (en) * 1988-04-13 1992-03-03 Kabushiki Kaisha Toshiba Method of making a semiconductor device having lead pins and a metal shell
DE3936613A1 (de) * 1989-11-03 1991-05-08 Technotron Gmbh & Co Kg Mehrfach verschliessbarers hybridschaltkreisgehaeuse

Also Published As

Publication number Publication date
FR2585881A1 (fr) 1987-02-06
FR2585881B1 (fr) 1989-12-01
GB2188773A (en) 1987-10-07
GB8618777D0 (en) 1986-09-10
DE3527818C2 (https=) 1993-08-05
GB2188773B (en) 1989-08-16

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: INFINA BETEILIGUNGSGESELLSCHAFT MBH, ZWEIGNIEDERLA

8127 New person/name/address of the applicant

Owner name: TECHNOTRON ELEKTROTECHNISCHE GERAETE UND KOMPONENT

8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: TECHNOTRON ELEKTROTECHNISCHE GERAETE UND KOMPONENT

8339 Ceased/non-payment of the annual fee