US4969038A
(en)
*
|
1963-03-11 |
1990-11-06 |
Lemelson Jerome H |
Method for scanning image information
|
US5128753A
(en)
*
|
1954-12-24 |
1992-07-07 |
Lemelson Jerome H |
Method and apparatus for scaning objects and generating image information
|
US5144421A
(en)
*
|
1954-12-24 |
1992-09-01 |
Lemelson Jerome H |
Methods and apparatus for scanning objects and generating image information
|
US4984073A
(en)
*
|
1954-12-24 |
1991-01-08 |
Lemelson Jerome H |
Methods and systems for scanning and inspecting images
|
EP0186874B1
(de)
*
|
1984-12-26 |
1994-06-08 |
Hitachi, Ltd. |
Verfahren und Gerät zum Prüfen der Geometrie von Mehrschichtmustern für integrierte Schaltungsstrukturen
|
JPS61176807A
(ja)
*
|
1985-02-01 |
1986-08-08 |
Hitachi Ltd |
回路パターン検査装置
|
US4794647A
(en)
*
|
1985-04-08 |
1988-12-27 |
Northern Telecom Limited |
Automatic optical inspection system
|
JP2602201B2
(ja)
*
|
1985-04-12 |
1997-04-23 |
株式会社日立製作所 |
被検査パターンの欠陥検査方法
|
JPH0621769B2
(ja)
*
|
1985-12-13 |
1994-03-23 |
大日本スクリ−ン製造株式会社 |
パタ−ン欠陥検出方法およびその装置
|
US5046109A
(en)
*
|
1986-03-12 |
1991-09-03 |
Nikon Corporation |
Pattern inspection apparatus
|
US4969198A
(en)
*
|
1986-04-17 |
1990-11-06 |
International Business Machines Corporation |
System for automatic inspection of periodic patterns
|
US4771468A
(en)
*
|
1986-04-17 |
1988-09-13 |
International Business Machines Corporation |
System for automatic inspection of periodic patterns
|
US4918627A
(en)
*
|
1986-08-04 |
1990-04-17 |
Fmc Corporation |
Computer integrated gaging system
|
US4872052A
(en)
*
|
1986-12-03 |
1989-10-03 |
View Engineering, Inc. |
Semiconductor device inspection system
|
US4949390A
(en)
*
|
1987-04-16 |
1990-08-14 |
Applied Vision Systems, Inc. |
Interconnect verification using serial neighborhood processors
|
US4829373A
(en)
*
|
1987-08-03 |
1989-05-09 |
Vexcel Corporation |
Stereo mensuration apparatus
|
US4841455A
(en)
*
|
1987-08-03 |
1989-06-20 |
Vexcel Corporation |
Reseau apparatus for photogrammetry devices
|
US4928169A
(en)
*
|
1987-08-03 |
1990-05-22 |
Vexcel Corp. |
Mensuration frame grabbing apparatus
|
US4924505A
(en)
*
|
1987-08-03 |
1990-05-08 |
Vexcel Corporation |
Method of mensuration of an image on an object
|
US4897678A
(en)
*
|
1987-08-03 |
1990-01-30 |
Vexcel Corporation |
Double z-axis translational mounting apparatus for camera in photogrammetry mensuration systems
|
US5040059A
(en)
*
|
1987-08-03 |
1991-08-13 |
Vexcel Corporation |
Method and apparatus of image mensuration with selectively visible and invisible reseau grid marks
|
US5081656A
(en)
*
|
1987-10-30 |
1992-01-14 |
Four Pi Systems Corporation |
Automated laminography system for inspection of electronics
|
US4926452A
(en)
*
|
1987-10-30 |
1990-05-15 |
Four Pi Systems Corporation |
Automated laminography system for inspection of electronics
|
US5097492A
(en)
*
|
1987-10-30 |
1992-03-17 |
Four Pi Systems Corporation |
Automated laminography system for inspection of electronics
|
US5621811A
(en)
*
|
1987-10-30 |
1997-04-15 |
Hewlett-Packard Co. |
Learning method and apparatus for detecting and controlling solder defects
|
US5561696A
(en)
*
|
1987-10-30 |
1996-10-01 |
Hewlett-Packard Company |
Method and apparatus for inspecting electrical connections
|
US4985927A
(en)
*
|
1988-03-25 |
1991-01-15 |
Texas Instruments Incorporated |
Method of detecting and reviewing pattern defects
|
JPH01269035A
(ja)
*
|
1988-04-21 |
1989-10-26 |
Ibiden Co Ltd |
プリント回路基板の検査装置
|
US5564012A
(en)
*
|
1989-03-29 |
1996-10-08 |
Fuji Photo Film Co., Ltd. |
Support apparatus for use with radiation image information processing system
|
US5651362A
(en)
*
|
1989-03-29 |
1997-07-29 |
Fuji Photo Film Co., Ltd. |
Support apparatus for use with radiation image information processing system
|
JP3132565B2
(ja)
*
|
1989-08-30 |
2001-02-05 |
株式会社日立製作所 |
欠陥検査方法及びその装置
|
US5259012A
(en)
*
|
1990-08-30 |
1993-11-02 |
Four Pi Systems Corporation |
Laminography system and method with electromagnetically directed multipath radiation source
|
JPH04177111A
(ja)
*
|
1990-11-13 |
1992-06-24 |
Mitsubishi Electric Corp |
位相シフトマスク検査装置
|
FR2669420B1
(fr)
*
|
1990-11-21 |
1993-01-15 |
Hispano Suiza Sa |
Procede de controle de mesures dimensionnelles de pieces de fonderie.
|
IL125217A
(en)
*
|
1990-12-04 |
1999-10-28 |
Orbot Instr Ltd |
Apparatus and method for microscopic inspection of articles
|
US5586058A
(en)
*
|
1990-12-04 |
1996-12-17 |
Orbot Instruments Ltd. |
Apparatus and method for inspection of a patterned object by comparison thereof to a reference
|
JP2985323B2
(ja)
*
|
1991-03-04 |
1999-11-29 |
株式会社日立製作所 |
パターン検査方法及びその装置
|
KR960002145B1
(ko)
*
|
1991-07-30 |
1996-02-13 |
가부시기가이샤 히다찌세이사구쇼 |
박막트랜지스터 액정기판의 검사방법 및 그 장치
|
US5590060A
(en)
*
|
1992-03-20 |
1996-12-31 |
Metronics, Inc. |
Apparatus and method for an object measurement system
|
JP2991593B2
(ja)
*
|
1993-08-19 |
1999-12-20 |
株式会社東京精密 |
ダイシング装置の半導体ウェハ形状認識装置
|
JP3392573B2
(ja)
*
|
1994-03-31 |
2003-03-31 |
株式会社東芝 |
試料検査装置及び方法
|
US5784484A
(en)
*
|
1995-03-30 |
1998-07-21 |
Nec Corporation |
Device for inspecting printed wiring boards at different resolutions
|
US5583904A
(en)
*
|
1995-04-11 |
1996-12-10 |
Hewlett-Packard Co. |
Continuous linear scan laminography system and method
|
US5687209A
(en)
*
|
1995-04-11 |
1997-11-11 |
Hewlett-Packard Co. |
Automatic warp compensation for laminographic circuit board inspection
|
ATE211549T1
(de)
*
|
1995-10-25 |
2002-01-15 |
Infineon Technologies Ag |
Verfahren zur kontrolle von scheiben
|
JPH09199551A
(ja)
*
|
1996-01-12 |
1997-07-31 |
Mitsubishi Electric Corp |
インライン検査用検査データ解析処理装置
|
US6021380A
(en)
*
|
1996-07-09 |
2000-02-01 |
Scanis, Inc. |
Automatic semiconductor wafer sorter/prober with extended optical inspection
|
JP3566470B2
(ja)
*
|
1996-09-17 |
2004-09-15 |
株式会社日立製作所 |
パターン検査方法及びその装置
|
JPH10141929A
(ja)
*
|
1996-11-12 |
1998-05-29 |
Hitachi Ltd |
はんだ付け検査装置
|
US6400838B2
(en)
*
|
1997-07-29 |
2002-06-04 |
Kabushiki Kaisha Toshiba |
Pattern inspection equipment, pattern inspection method, and storage medium storing pattern inspection program
|
JP3998334B2
(ja)
*
|
1997-09-22 |
2007-10-24 |
株式会社東芝 |
欠陥検査方法
|
US6091845A
(en)
*
|
1998-02-24 |
2000-07-18 |
Micron Technology, Inc. |
Inspection technique of photomask
|
US6297879B1
(en)
*
|
1998-02-27 |
2001-10-02 |
Micron Technology, Inc. |
Inspection method and apparatus for detecting defects on photomasks
|
JP3028945B2
(ja)
*
|
1998-04-17 |
2000-04-04 |
日本電気株式会社 |
多階調丸め補正処理方法およびパターン検査装置
|
US6366690B1
(en)
*
|
1998-07-07 |
2002-04-02 |
Applied Materials, Inc. |
Pixel based machine for patterned wafers
|
IL127720A0
(en)
*
|
1998-12-24 |
1999-10-28 |
Oramir Semiconductor Ltd |
Local particle cleaning
|
JP3488127B2
(ja)
*
|
1999-03-31 |
2004-01-19 |
エヌイーシーマシナリー株式会社 |
微小ワーク片の認識方法及びそれを用いたピックアップ装置
|
US6516085B1
(en)
*
|
1999-05-03 |
2003-02-04 |
Kla-Tencor |
Apparatus and methods for collecting global data during a reticle inspection
|
JP2001005166A
(ja)
|
1999-06-17 |
2001-01-12 |
Nec Corp |
パターン検査方法及びパターン検査装置
|
US6369888B1
(en)
|
1999-11-17 |
2002-04-09 |
Applied Materials, Inc. |
Method and apparatus for article inspection including speckle reduction
|
US6510398B1
(en)
*
|
2000-06-22 |
2003-01-21 |
Intel Corporation |
Constrained signature-based test
|
JP3671822B2
(ja)
|
2000-07-26 |
2005-07-13 |
株式会社日立製作所 |
欠陥検査方法および欠陥検査システム
|
GB2388428A
(en)
*
|
2000-09-10 |
2003-11-12 |
Orbotech Ltd |
Reduction of false alarms in PCB inspection
|
JP3479838B2
(ja)
*
|
2000-10-19 |
2003-12-15 |
日本電気株式会社 |
パターン修正方法及びパターン修正装置
|
US6898305B2
(en)
*
|
2001-02-22 |
2005-05-24 |
Hitachi, Ltd. |
Circuit pattern inspection method and apparatus
|
US6973208B2
(en)
|
2001-05-18 |
2005-12-06 |
Tokyo Seimitsu Co., Ltd. |
Method and apparatus for inspection by pattern comparison
|
US7096397B2
(en)
*
|
2001-09-17 |
2006-08-22 |
Intel Corporation |
Dft technique for avoiding contention/conflict in logic built-in self-test
|
US6829035B2
(en)
*
|
2002-11-12 |
2004-12-07 |
Applied Materials Israel, Ltd. |
Advanced mask cleaning and handling
|
US6864458B2
(en)
*
|
2003-01-21 |
2005-03-08 |
Applied Materials, Inc. |
Iced film substrate cleaning
|
US7551769B2
(en)
*
|
2003-02-18 |
2009-06-23 |
Marena Systems Corporation |
Data structures and algorithms for precise defect location by analyzing artifacts
|
JP4018642B2
(ja)
*
|
2004-01-05 |
2007-12-05 |
株式会社東芝 |
参照データ生成方法、パターン欠陥検査装置、パターン欠陥検査方法、及び参照データ生成プログラム
|
CN101300473B
(zh)
*
|
2004-03-05 |
2012-10-31 |
以色列商奥宝科技股份有限公司 |
图案检视中偶生缺陷的验证
|
JP4585926B2
(ja)
*
|
2005-06-17 |
2010-11-24 |
株式会社日立ハイテクノロジーズ |
パターンレイヤーデータ生成装置、それを用いたパターンレイヤーデータ生成システム、半導体パターン表示装置、パターンレイヤーデータ生成方法、及びコンピュータプログラム
|
JP4174504B2
(ja)
*
|
2005-08-31 |
2008-11-05 |
アドバンスド・マスク・インスペクション・テクノロジー株式会社 |
試料検査装置、試料検査方法及びプログラム
|
JP2008249921A
(ja)
*
|
2007-03-30 |
2008-10-16 |
Advanced Mask Inspection Technology Kk |
レチクル欠陥検査装置およびレチクル欠陥検査方法
|
US11301748B2
(en)
*
|
2018-11-13 |
2022-04-12 |
International Business Machines Corporation |
Automatic feature extraction from aerial images for test pattern sampling and pattern coverage inspection for lithography
|
CN113109348B
(zh)
*
|
2021-03-12 |
2022-03-29 |
华南理工大学 |
一种基于机器视觉的桨影移印缺陷识别方法
|