DE3484561D1 - Verfahren zum automatischen bestuecken mit integrierten schaltungen und vorrichtung zur ausfuehrung des verfahrens. - Google Patents

Verfahren zum automatischen bestuecken mit integrierten schaltungen und vorrichtung zur ausfuehrung des verfahrens.

Info

Publication number
DE3484561D1
DE3484561D1 DE8484116422T DE3484561T DE3484561D1 DE 3484561 D1 DE3484561 D1 DE 3484561D1 DE 8484116422 T DE8484116422 T DE 8484116422T DE 3484561 T DE3484561 T DE 3484561T DE 3484561 D1 DE3484561 D1 DE 3484561D1
Authority
DE
Germany
Prior art keywords
implementing
integrated circuits
automatic equipment
automatic
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8484116422T
Other languages
German (de)
English (en)
Inventor
Toshikatsu Hino
Fumio Arase
Takashi Ohshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3484561D1 publication Critical patent/DE3484561D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work
    • Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE8484116422T 1983-12-29 1984-12-28 Verfahren zum automatischen bestuecken mit integrierten schaltungen und vorrichtung zur ausfuehrung des verfahrens. Expired - Lifetime DE3484561D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58247691A JPS60142600A (ja) 1983-12-29 1983-12-29 Ｉｃ自動装着システム

Publications (1)

Publication Number Publication Date
DE3484561D1 true DE3484561D1 (de) 1991-06-13

Family

ID=17167204

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484116422T Expired - Lifetime DE3484561D1 (de) 1983-12-29 1984-12-28 Verfahren zum automatischen bestuecken mit integrierten schaltungen und vorrichtung zur ausfuehrung des verfahrens.

Country Status (5)

Country Link
US (1) US4621419A (enExample)
EP (1) EP0147864B1 (enExample)
JP (1) JPS60142600A (enExample)
CA (1) CA1221471A (enExample)
DE (1) DE3484561D1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0214030A3 (en) * 1985-08-12 1987-05-13 Digital Equipment Corporation Surface mount technology automated repair system
JPS62271689A (ja) * 1986-05-14 1987-11-25 オムロン株式会社 部品組込装置
US4858062A (en) 1986-06-04 1989-08-15 Canon Kabushiki Kaisha Charging device
JP2541220B2 (ja) * 1987-05-19 1996-10-09 ソニー株式会社 電子部品装着装置
JPH01160098A (ja) * 1987-12-17 1989-06-22 Matsushita Electric Ind Co Ltd 電子部品挿入方法
US5084962A (en) * 1988-08-24 1992-02-04 Tdk Corporation Apparatus for and method of automatically mounting electronic component on printed circuit board
KR910011109A (ko) * 1989-11-28 1991-06-29 이헌조 부품 자동삽입기의 삽입 에러부품 제거장치
KR940002680B1 (ko) * 1991-08-17 1994-03-30 삼성전자 주식회사 이형 부품 삽입 시스템의 삽입 제어장치 및 제어방법
US5307555A (en) * 1993-02-12 1994-05-03 Ford Motor Company Part pitch independent electrical component feeder
US5794329A (en) * 1995-02-27 1998-08-18 Mpm Corporation Support apparatus for circuit board
JP2000252684A (ja) * 1999-02-27 2000-09-14 Mirae Corp トレイフィーダー部が設置された表面実装機
US9668356B2 (en) * 2013-10-01 2017-05-30 Sierra Wireless, Inc. Method and apparatus for electrical keying of an integrated circuit package having rotationally symmetric footprint
CN108100593A (zh) * 2018-01-31 2018-06-01 湖北航嘉麦格纳座椅系统有限公司 托盘流水线

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE147451C (enExample) *
US3508315A (en) * 1967-07-26 1970-04-28 Essington Metal Works Inc Apparatus for inserting and for securing preformed electronic components to printed circuit boards
US3550238A (en) * 1968-03-28 1970-12-29 Usm Corp Multi-lead component inserter
US4367584A (en) * 1980-09-15 1983-01-11 Universal Instruments Corporation Method and apparatus for straightening leads and verifying the orientation and functionality of components
JPS57103399A (en) * 1980-12-18 1982-06-26 Matsushita Electric Industrial Co Ltd Device for mounting and inspecting leadless electronic part
JPS57164310A (en) * 1981-04-03 1982-10-08 Hitachi Ltd Automatic assembling device

Also Published As

Publication number Publication date
EP0147864A3 (en) 1988-07-06
EP0147864A2 (en) 1985-07-10
JPH0219640B2 (enExample) 1990-05-02
EP0147864B1 (en) 1991-05-08
US4621419A (en) 1986-11-11
JPS60142600A (ja) 1985-07-27
CA1221471A (en) 1987-05-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee