DE3483637D1 - Kontinuierliche zerstaeubungsvorrichtung. - Google Patents

Kontinuierliche zerstaeubungsvorrichtung.

Info

Publication number
DE3483637D1
DE3483637D1 DE8484110398T DE3483637T DE3483637D1 DE 3483637 D1 DE3483637 D1 DE 3483637D1 DE 8484110398 T DE8484110398 T DE 8484110398T DE 3483637 T DE3483637 T DE 3483637T DE 3483637 D1 DE3483637 D1 DE 3483637D1
Authority
DE
Germany
Prior art keywords
spraying device
continuous spraying
continuous
spraying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8484110398T
Other languages
English (en)
Inventor
Hideki Tateishi
Tamotsu Shimizu
Susumu Aiuchi
Katsuhiro Iwashita
Hiroshi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3483637D1 publication Critical patent/DE3483637D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • ing And Chemical Polishing (AREA)
DE8484110398T 1983-09-02 1984-08-31 Kontinuierliche zerstaeubungsvorrichtung. Expired - Lifetime DE3483637D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58160388A JPS6052574A (ja) 1983-09-02 1983-09-02 連続スパツタ装置

Publications (1)

Publication Number Publication Date
DE3483637D1 true DE3483637D1 (de) 1991-01-03

Family

ID=15713879

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484110398T Expired - Lifetime DE3483637D1 (de) 1983-09-02 1984-08-31 Kontinuierliche zerstaeubungsvorrichtung.

Country Status (5)

Country Link
US (1) US4675096A (de)
EP (1) EP0136562B1 (de)
JP (1) JPS6052574A (de)
KR (1) KR890002837B1 (de)
DE (1) DE3483637D1 (de)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4806225A (en) * 1982-05-28 1989-02-21 Advanced Plasma Systems, Inc. Desmearing and plated-through-hole apparatus
US4863577A (en) * 1982-05-28 1989-09-05 Advanced Plasma Systems, Inc. Desmearing and plated-through-hole method
JPH0613751B2 (ja) * 1986-03-07 1994-02-23 株式会社日立製作所 連続スパッタ装置
JPS62234539A (ja) * 1986-04-04 1987-10-14 Hitachi Ltd 真空処理装置
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
EP0246453A3 (de) * 1986-04-18 1989-09-06 General Signal Corporation Kontaminierungsfreie Plasma-Ätzvorrichtung mit mehreren Behandlungsstellen
US5308431A (en) * 1986-04-18 1994-05-03 General Signal Corporation System providing multiple processing of substrates
US5102495A (en) * 1986-04-18 1992-04-07 General Signal Corporation Method providing multiple-processing of substrates
JPS63192865A (ja) * 1987-02-05 1988-08-10 Tokio Nakada 多層／多元薄膜形成スパッタリング装置およびその運転方法
DE3735284A1 (de) * 1987-10-17 1989-04-27 Leybold Ag Vorrichtung nach dem karussell-prinzip zum beschichten von substraten
US5618388A (en) * 1988-02-08 1997-04-08 Optical Coating Laboratory, Inc. Geometries and configurations for magnetron sputtering apparatus
US5798027A (en) * 1988-02-08 1998-08-25 Optical Coating Laboratory, Inc. Process for depositing optical thin films on both planar and non-planar substrates
US5225057A (en) * 1988-02-08 1993-07-06 Optical Coating Laboratory, Inc. Process for depositing optical films on both planar and non-planar substrates
US4851095A (en) * 1988-02-08 1989-07-25 Optical Coating Laboratory, Inc. Magnetron sputtering apparatus and process
US4911810A (en) * 1988-06-21 1990-03-27 Brown University Modular sputtering apparatus
JPH02107757A (ja) * 1988-10-15 1990-04-19 Koji Hashimoto アモルファス超格子合金の作製法
US5019233A (en) * 1988-10-31 1991-05-28 Eaton Corporation Sputtering system
US6989228B2 (en) 1989-02-27 2006-01-24 Hitachi, Ltd Method and apparatus for processing samples
US6375741B2 (en) * 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
JP2644912B2 (ja) 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
US5205051A (en) * 1990-08-28 1993-04-27 Materials Research Corporation Method of preventing condensation of air borne moisture onto objects in a vessel during pumping thereof
US5237756A (en) * 1990-08-28 1993-08-24 Materials Research Corporation Method and apparatus for reducing particulate contamination
USRE39756E1 (en) 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39823E1 (en) 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
JP2525284B2 (ja) * 1990-10-22 1996-08-14 ティーディーケイ株式会社 クリ―ン搬送方法及び装置
DE4110490C2 (de) * 1991-03-30 2002-02-28 Unaxis Deutschland Holding Kathodenzerstäubungsanlage
US5154730A (en) * 1991-05-17 1992-10-13 Materials Research Corporation Semiconductor wafer processing module having an inclined rotating wafer handling turret and a method of using the module
DE4117969C2 (de) * 1991-05-31 2000-11-09 Balzers Ag Liechtenstein Vakuumkammer
WO1994000868A1 (en) 1992-06-26 1994-01-06 Materials Research Corporation Transport system for wafer processing line
US5248371A (en) * 1992-08-13 1993-09-28 General Signal Corporation Hollow-anode glow discharge apparatus
US5482607A (en) * 1992-09-21 1996-01-09 Nissin Electric Co., Ltd. Film forming apparatus
CH691377A5 (de) * 1992-10-06 2001-07-13 Unaxis Balzers Ag Kammeranordnung für den Transport von Werkstücken und deren Verwendung.
EP1179611B1 (de) * 1992-10-06 2004-09-15 Unaxis Balzers Aktiengesellschaft Kammer für den Transport von Werkstücken
DE4235674C2 (de) * 1992-10-22 2000-12-28 Balzers Ag Liechtenstein Kammer für den Transport von Werkstücken in Vakuumatmosphäre, Kammerkombination und Verfahren zum Transportieren eines Werkstückes
DE4235677C2 (de) * 1992-10-22 1996-10-31 Balzers Hochvakuum Vakuumkammer, Vakuumbehandlungsanlage mit einer solchen Kammer sowie Transportverfahren
US5295777A (en) * 1992-12-23 1994-03-22 Materials Research Corporation Wafer transport module with rotatable and horizontally extendable wafer holder
US5738767A (en) * 1994-01-11 1998-04-14 Intevac, Inc. Substrate handling and processing system for flat panel displays
JP2676678B2 (ja) * 1994-11-28 1997-11-17 株式会社日立製作所 連続スパッタ処理方法
NL1000138C2 (nl) * 1995-04-13 1996-10-15 Od & Me Bv Inrichtingen voor het bewerken van een substraat alsmede werkwijze geschikt voor toepassing bij dergelijke inrichtingen.
US5709785A (en) * 1995-06-08 1998-01-20 First Light Technology Inc. Metallizing machine
CH691376A5 (de) * 1995-10-17 2001-07-13 Unaxis Balzers Ag Vakuumanlage zur Oberflächenbearbeitung von Werkstücken.
US6299404B1 (en) * 1995-10-27 2001-10-09 Brooks Automation Inc. Substrate transport apparatus with double substrate holders
US6481956B1 (en) 1995-10-27 2002-11-19 Brooks Automation Inc. Method of transferring substrates with two different substrate holding end effectors
US6062798A (en) 1996-06-13 2000-05-16 Brooks Automation, Inc. Multi-level substrate processing apparatus
DE19642852A1 (de) * 1996-10-17 1998-04-23 Leybold Systems Gmbh Vakuumbehandlungsanlage zum Aufbringen dünner Schichten auf dreidimensionale, schalenförmige oder prismatische Substrate
DE19645104B4 (de) * 1996-10-31 2007-12-20 Pfeiffer Vacuum Gmbh Verfahren zur Durchführung eines Prozesses in einem mit Unterdruck beaufschlagten Prozessraum
EP0946781A1 (de) * 1996-12-23 1999-10-06 Balzers Aktiengesellschaft Vakuumbehandlungsanlage
EP0946780B1 (de) * 1996-12-23 2002-01-16 Unaxis Balzers Aktiengesellschaft Vakuumbehandlungsanlage
US6905578B1 (en) * 1998-04-27 2005-06-14 Cvc Products, Inc. Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure
DE19826949A1 (de) * 1998-06-17 1999-12-23 Georg Kunkel Vorrichtung zum Transport von plattenartigen Substraten, beispielsweise von Glasplatten für Flachbildschirme
JP2001209981A (ja) * 1999-02-09 2001-08-03 Ricoh Co Ltd 光ディスク基板成膜装置、光ディスク基板成膜方法、基板ホルダーの製造方法、基板ホルダー、光ディスクおよび相変化記録型光ディスク
US6927160B1 (en) 1999-06-09 2005-08-09 National Semiconductor Corporation Fabrication of copper-containing region such as electrical interconnect
US7381638B1 (en) 1999-06-09 2008-06-03 National Semiconductor Corporation Fabrication technique using sputter etch and vacuum transfer
US6669824B2 (en) 2000-07-10 2003-12-30 Unaxis Usa, Inc. Dual-scan thin film processing system
US6495010B2 (en) 2000-07-10 2002-12-17 Unaxis Usa, Inc. Differentially-pumped material processing system
US6652656B2 (en) * 2001-07-24 2003-11-25 Tokyo Electron Limited Semiconductor wafer holding assembly
US6835414B2 (en) * 2001-07-27 2004-12-28 Unaxis Balzers Aktiengesellschaft Method for producing coated substrates
US6843883B2 (en) * 2001-08-31 2005-01-18 Tdk Corporation Vacuum processing apparatus and method for producing an object to be processed
DE502004001811D1 (de) 2004-05-28 2006-11-30 Applied Films Gmbh & Co Kg Antriebsmechanismus für eine Vakuum-Behandlungsanlage
EP2006411A1 (de) * 2007-06-19 2008-12-24 Applied Materials, Inc. Verdampfungsvorrichtung mit einem drehbaren Verdampfungseinheitsbehälter
US8785235B2 (en) * 2012-02-10 2014-07-22 Tsmc Solar Ltd. Apparatus and method for producing solar cells
US9029737B2 (en) * 2013-01-04 2015-05-12 Tsmc Solar Ltd. Method and system for forming absorber layer on metal coated glass for photovoltaic devices
TW201922604A (zh) * 2017-11-15 2019-06-16 瑞士商艾維太克股份有限公司 真空處理設備及真空處理基板的方法
CN112567158B (zh) * 2018-08-17 2023-05-12 Vat控股公司 具有至少两个腔和至少一个转移阀的装置
CN117626214A (zh) * 2024-01-25 2024-03-01 沈阳松陵三航机械制造有限公司 用于铝合金表面的镀膜装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3981791A (en) * 1975-03-10 1976-09-21 Signetics Corporation Vacuum sputtering apparatus
GB1505822A (en) * 1975-05-07 1978-03-30 Lucas Industries Ltd Apparatus for handling sheets of rigid material
US4274936A (en) * 1979-04-30 1981-06-23 Advanced Coating Technology, Inc. Vacuum deposition system and method
US4756815A (en) * 1979-12-21 1988-07-12 Varian Associates, Inc. Wafer coating system
US4311427A (en) * 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system
JPS5729577A (en) * 1980-07-30 1982-02-17 Anelva Corp Automatic continuous sputtering apparatus
US4405435A (en) * 1980-08-27 1983-09-20 Hitachi, Ltd. Apparatus for performing continuous treatment in vacuum
JPS59179786A (ja) * 1983-03-30 1984-10-12 Hitachi Ltd 連続スパツタ装置

Also Published As

Publication number Publication date
EP0136562A3 (en) 1987-10-28
KR850002686A (ko) 1985-05-15
US4675096A (en) 1987-06-23
JPS6337186B2 (de) 1988-07-25
KR890002837B1 (ko) 1989-08-04
EP0136562A2 (de) 1985-04-10
JPS6052574A (ja) 1985-03-25
EP0136562B1 (de) 1990-11-22

Similar Documents

Publication Publication Date Title
DE3483637D1 (de) Kontinuierliche zerstaeubungsvorrichtung.
DE3682954D1 (de) Zerstaeubungsvorrichtung.
ES542423A0 (es) Aparato aspersor.
FI841727A (fi) Vattenloeslig modifierad polyuretan.
NO166825C (no) Hoeyspennings-tilkoplingsanordning.
DE3381593D1 (de) Zerstaeubungsvorrichtung.
FI854642A (fi) Maskin foer rengoering av foeretraedesvis haorda underlag.
NL191491C (nl) Spuitapparaat.
DK69584A (da) Sproejteapparat
NL193986B (nl) Applicatietype aërosolinrichting.
DK162259C (da) Haandsproejte
ATE49404T1 (de) Cyanopyrazol-herbizide.
DE3483342D1 (de) Entbeinungsvorrichtung.
FI862577A0 (fi) Spray foer homogen mikroaerosol.
FI841498A0 (fi) Maskin foer upparbetning av traed.
DE3575877D1 (de) Zerstaeubungsvorrichtung.
AR228495A1 (es) Aparato rociador
FI842878A0 (fi) Modifierad antibiotresistensgen.
NL178744C (nl) Sproei-inrichting.
BR8203730A (pt) Dispositivo pulverizador
AR231951A1 (es) Aparato rociador
FI843369A (fi) Elektrisk maskin.
AT376569B (de) Spritzgeraet
FI831138L (fi) Maskin foer plantering av sticklingar.
AR228824A1 (es) Dispositivo aspersor

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee