DE3483637D1 - Kontinuierliche zerstaeubungsvorrichtung. - Google Patents
Kontinuierliche zerstaeubungsvorrichtung.Info
- Publication number
- DE3483637D1 DE3483637D1 DE8484110398T DE3483637T DE3483637D1 DE 3483637 D1 DE3483637 D1 DE 3483637D1 DE 8484110398 T DE8484110398 T DE 8484110398T DE 3483637 T DE3483637 T DE 3483637T DE 3483637 D1 DE3483637 D1 DE 3483637D1
- Authority
- DE
- Germany
- Prior art keywords
- spraying device
- continuous spraying
- continuous
- spraying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58160388A JPS6052574A (ja) | 1983-09-02 | 1983-09-02 | 連続スパツタ装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3483637D1 true DE3483637D1 (de) | 1991-01-03 |
Family
ID=15713879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484110398T Expired - Lifetime DE3483637D1 (de) | 1983-09-02 | 1984-08-31 | Kontinuierliche zerstaeubungsvorrichtung. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4675096A (de) |
EP (1) | EP0136562B1 (de) |
JP (1) | JPS6052574A (de) |
KR (1) | KR890002837B1 (de) |
DE (1) | DE3483637D1 (de) |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4806225A (en) * | 1982-05-28 | 1989-02-21 | Advanced Plasma Systems, Inc. | Desmearing and plated-through-hole apparatus |
US4863577A (en) * | 1982-05-28 | 1989-09-05 | Advanced Plasma Systems, Inc. | Desmearing and plated-through-hole method |
JPH0613751B2 (ja) * | 1986-03-07 | 1994-02-23 | 株式会社日立製作所 | 連続スパッタ装置 |
JPS62234539A (ja) * | 1986-04-04 | 1987-10-14 | Hitachi Ltd | 真空処理装置 |
US6103055A (en) * | 1986-04-18 | 2000-08-15 | Applied Materials, Inc. | System for processing substrates |
EP0246453A3 (de) * | 1986-04-18 | 1989-09-06 | General Signal Corporation | Kontaminierungsfreie Plasma-Ätzvorrichtung mit mehreren Behandlungsstellen |
US5308431A (en) * | 1986-04-18 | 1994-05-03 | General Signal Corporation | System providing multiple processing of substrates |
US5102495A (en) * | 1986-04-18 | 1992-04-07 | General Signal Corporation | Method providing multiple-processing of substrates |
JPS63192865A (ja) * | 1987-02-05 | 1988-08-10 | Tokio Nakada | 多層/多元薄膜形成スパッタリング装置およびその運転方法 |
DE3735284A1 (de) * | 1987-10-17 | 1989-04-27 | Leybold Ag | Vorrichtung nach dem karussell-prinzip zum beschichten von substraten |
US5225057A (en) * | 1988-02-08 | 1993-07-06 | Optical Coating Laboratory, Inc. | Process for depositing optical films on both planar and non-planar substrates |
US5798027A (en) * | 1988-02-08 | 1998-08-25 | Optical Coating Laboratory, Inc. | Process for depositing optical thin films on both planar and non-planar substrates |
US4851095A (en) * | 1988-02-08 | 1989-07-25 | Optical Coating Laboratory, Inc. | Magnetron sputtering apparatus and process |
US5618388A (en) * | 1988-02-08 | 1997-04-08 | Optical Coating Laboratory, Inc. | Geometries and configurations for magnetron sputtering apparatus |
US4911810A (en) * | 1988-06-21 | 1990-03-27 | Brown University | Modular sputtering apparatus |
JPH02107757A (ja) * | 1988-10-15 | 1990-04-19 | Koji Hashimoto | アモルファス超格子合金の作製法 |
US5019233A (en) * | 1988-10-31 | 1991-05-28 | Eaton Corporation | Sputtering system |
US6989228B2 (en) | 1989-02-27 | 2006-01-24 | Hitachi, Ltd | Method and apparatus for processing samples |
US6375741B2 (en) | 1991-03-06 | 2002-04-23 | Timothy J. Reardon | Semiconductor processing spray coating apparatus |
JP2644912B2 (ja) | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
US5237756A (en) * | 1990-08-28 | 1993-08-24 | Materials Research Corporation | Method and apparatus for reducing particulate contamination |
US5205051A (en) * | 1990-08-28 | 1993-04-27 | Materials Research Corporation | Method of preventing condensation of air borne moisture onto objects in a vessel during pumping thereof |
USRE39756E1 (en) | 1990-08-29 | 2007-08-07 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
USRE39823E1 (en) | 1990-08-29 | 2007-09-11 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
JP2525284B2 (ja) * | 1990-10-22 | 1996-08-14 | ティーディーケイ株式会社 | クリ―ン搬送方法及び装置 |
DE4110490C2 (de) * | 1991-03-30 | 2002-02-28 | Unaxis Deutschland Holding | Kathodenzerstäubungsanlage |
US5154730A (en) * | 1991-05-17 | 1992-10-13 | Materials Research Corporation | Semiconductor wafer processing module having an inclined rotating wafer handling turret and a method of using the module |
DE4117969C2 (de) * | 1991-05-31 | 2000-11-09 | Balzers Ag Liechtenstein | Vakuumkammer |
AU4652993A (en) | 1992-06-26 | 1994-01-24 | Materials Research Corporation | Transport system for wafer processing line |
US5248371A (en) * | 1992-08-13 | 1993-09-28 | General Signal Corporation | Hollow-anode glow discharge apparatus |
US5482607A (en) * | 1992-09-21 | 1996-01-09 | Nissin Electric Co., Ltd. | Film forming apparatus |
EP1179611B1 (de) | 1992-10-06 | 2004-09-15 | Unaxis Balzers Aktiengesellschaft | Kammer für den Transport von Werkstücken |
CH691377A5 (de) * | 1992-10-06 | 2001-07-13 | Unaxis Balzers Ag | Kammeranordnung für den Transport von Werkstücken und deren Verwendung. |
DE4235677C2 (de) * | 1992-10-22 | 1996-10-31 | Balzers Hochvakuum | Vakuumkammer, Vakuumbehandlungsanlage mit einer solchen Kammer sowie Transportverfahren |
DE4235674C2 (de) * | 1992-10-22 | 2000-12-28 | Balzers Ag Liechtenstein | Kammer für den Transport von Werkstücken in Vakuumatmosphäre, Kammerkombination und Verfahren zum Transportieren eines Werkstückes |
US5295777A (en) * | 1992-12-23 | 1994-03-22 | Materials Research Corporation | Wafer transport module with rotatable and horizontally extendable wafer holder |
US5738767A (en) * | 1994-01-11 | 1998-04-14 | Intevac, Inc. | Substrate handling and processing system for flat panel displays |
JP2676678B2 (ja) * | 1994-11-28 | 1997-11-17 | 株式会社日立製作所 | 連続スパッタ処理方法 |
NL1000138C2 (nl) * | 1995-04-13 | 1996-10-15 | Od & Me Bv | Inrichtingen voor het bewerken van een substraat alsmede werkwijze geschikt voor toepassing bij dergelijke inrichtingen. |
US5709785A (en) * | 1995-06-08 | 1998-01-20 | First Light Technology Inc. | Metallizing machine |
CH691376A5 (de) * | 1995-10-17 | 2001-07-13 | Unaxis Balzers Ag | Vakuumanlage zur Oberflächenbearbeitung von Werkstücken. |
US6299404B1 (en) | 1995-10-27 | 2001-10-09 | Brooks Automation Inc. | Substrate transport apparatus with double substrate holders |
US6481956B1 (en) | 1995-10-27 | 2002-11-19 | Brooks Automation Inc. | Method of transferring substrates with two different substrate holding end effectors |
US6062798A (en) | 1996-06-13 | 2000-05-16 | Brooks Automation, Inc. | Multi-level substrate processing apparatus |
DE19642852A1 (de) * | 1996-10-17 | 1998-04-23 | Leybold Systems Gmbh | Vakuumbehandlungsanlage zum Aufbringen dünner Schichten auf dreidimensionale, schalenförmige oder prismatische Substrate |
DE19645104B4 (de) * | 1996-10-31 | 2007-12-20 | Pfeiffer Vacuum Gmbh | Verfahren zur Durchführung eines Prozesses in einem mit Unterdruck beaufschlagten Prozessraum |
AU7874198A (en) * | 1996-12-23 | 1998-07-17 | Balzers Aktiengesellschaft | Vacuum treatment equipment |
DE59706031D1 (de) | 1996-12-23 | 2002-02-21 | Unaxis Balzers Ag | Vakuumbehandlungsanlage |
US6905578B1 (en) * | 1998-04-27 | 2005-06-14 | Cvc Products, Inc. | Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure |
DE19826949A1 (de) * | 1998-06-17 | 1999-12-23 | Georg Kunkel | Vorrichtung zum Transport von plattenartigen Substraten, beispielsweise von Glasplatten für Flachbildschirme |
JP2001209981A (ja) * | 1999-02-09 | 2001-08-03 | Ricoh Co Ltd | 光ディスク基板成膜装置、光ディスク基板成膜方法、基板ホルダーの製造方法、基板ホルダー、光ディスクおよび相変化記録型光ディスク |
US7381638B1 (en) | 1999-06-09 | 2008-06-03 | National Semiconductor Corporation | Fabrication technique using sputter etch and vacuum transfer |
US6927160B1 (en) | 1999-06-09 | 2005-08-09 | National Semiconductor Corporation | Fabrication of copper-containing region such as electrical interconnect |
US6669824B2 (en) | 2000-07-10 | 2003-12-30 | Unaxis Usa, Inc. | Dual-scan thin film processing system |
US6495010B2 (en) | 2000-07-10 | 2002-12-17 | Unaxis Usa, Inc. | Differentially-pumped material processing system |
US6652656B2 (en) * | 2001-07-24 | 2003-11-25 | Tokyo Electron Limited | Semiconductor wafer holding assembly |
US6835414B2 (en) * | 2001-07-27 | 2004-12-28 | Unaxis Balzers Aktiengesellschaft | Method for producing coated substrates |
US6843883B2 (en) * | 2001-08-31 | 2005-01-18 | Tdk Corporation | Vacuum processing apparatus and method for producing an object to be processed |
EP1617456B1 (de) * | 2004-05-28 | 2006-10-18 | Applied Films GmbH & Co. KG | Antriebsmechanismus für eine Vakuum-Behandlungsanlage |
EP2006411A1 (de) * | 2007-06-19 | 2008-12-24 | Applied Materials, Inc. | Verdampfungsvorrichtung mit einem drehbaren Verdampfungseinheitsbehälter |
US8785235B2 (en) * | 2012-02-10 | 2014-07-22 | Tsmc Solar Ltd. | Apparatus and method for producing solar cells |
US9029737B2 (en) * | 2013-01-04 | 2015-05-12 | Tsmc Solar Ltd. | Method and system for forming absorber layer on metal coated glass for photovoltaic devices |
WO2019096515A1 (en) * | 2017-11-15 | 2019-05-23 | Evatec Ag | Vacuum treatment apparatus and method of vacuum treating substrates |
WO2020035219A1 (de) * | 2018-08-17 | 2020-02-20 | Vat Holding Ag | Anordnung mit zumindest zwei kammern und zumindest einem transferventil |
CN117626214A (zh) * | 2024-01-25 | 2024-03-01 | 沈阳松陵三航机械制造有限公司 | 用于铝合金表面的镀膜装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3981791A (en) * | 1975-03-10 | 1976-09-21 | Signetics Corporation | Vacuum sputtering apparatus |
GB1505822A (en) * | 1975-05-07 | 1978-03-30 | Lucas Industries Ltd | Apparatus for handling sheets of rigid material |
US4274936A (en) * | 1979-04-30 | 1981-06-23 | Advanced Coating Technology, Inc. | Vacuum deposition system and method |
US4756815A (en) * | 1979-12-21 | 1988-07-12 | Varian Associates, Inc. | Wafer coating system |
US4311427A (en) * | 1979-12-21 | 1982-01-19 | Varian Associates, Inc. | Wafer transfer system |
JPS5729577A (en) * | 1980-07-30 | 1982-02-17 | Anelva Corp | Automatic continuous sputtering apparatus |
US4405435A (en) * | 1980-08-27 | 1983-09-20 | Hitachi, Ltd. | Apparatus for performing continuous treatment in vacuum |
JPS59179786A (ja) * | 1983-03-30 | 1984-10-12 | Hitachi Ltd | 連続スパツタ装置 |
-
1983
- 1983-09-02 JP JP58160388A patent/JPS6052574A/ja active Granted
-
1984
- 1984-08-30 KR KR1019840005318A patent/KR890002837B1/ko not_active IP Right Cessation
- 1984-08-30 US US06/645,671 patent/US4675096A/en not_active Expired - Fee Related
- 1984-08-31 DE DE8484110398T patent/DE3483637D1/de not_active Expired - Lifetime
- 1984-08-31 EP EP84110398A patent/EP0136562B1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0136562A2 (de) | 1985-04-10 |
JPS6337186B2 (de) | 1988-07-25 |
EP0136562B1 (de) | 1990-11-22 |
JPS6052574A (ja) | 1985-03-25 |
EP0136562A3 (en) | 1987-10-28 |
US4675096A (en) | 1987-06-23 |
KR890002837B1 (ko) | 1989-08-04 |
KR850002686A (ko) | 1985-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |