DE3482271D1 - Verfahren zum stromlosen abscheiden von kupfer. - Google Patents

Verfahren zum stromlosen abscheiden von kupfer.

Info

Publication number
DE3482271D1
DE3482271D1 DE8484112876T DE3482271T DE3482271D1 DE 3482271 D1 DE3482271 D1 DE 3482271D1 DE 8484112876 T DE8484112876 T DE 8484112876T DE 3482271 T DE3482271 T DE 3482271T DE 3482271 D1 DE3482271 D1 DE 3482271D1
Authority
DE
Germany
Prior art keywords
depositing copper
electrically depositing
electrically
copper
depositing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8484112876T
Other languages
English (en)
Inventor
Robert John Capwell
Ronald Anthony Kaschak
Bride Donald Gene Mc
Robert George Rickert
Donald Phillip Seraphim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3482271D1 publication Critical patent/DE3482271D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE8484112876T 1983-10-31 1984-10-26 Verfahren zum stromlosen abscheiden von kupfer. Expired - Fee Related DE3482271D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54729883A 1983-10-31 1983-10-31

Publications (1)

Publication Number Publication Date
DE3482271D1 true DE3482271D1 (de) 1990-06-21

Family

ID=24184131

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484112876T Expired - Fee Related DE3482271D1 (de) 1983-10-31 1984-10-26 Verfahren zum stromlosen abscheiden von kupfer.

Country Status (3)

Country Link
EP (1) EP0144685B1 (de)
JP (1) JPS6096767A (de)
DE (1) DE3482271D1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4654126A (en) * 1985-10-07 1987-03-31 International Business Machines Corporation Process for determining the plating activity of an electroless plating bath
JP2664246B2 (ja) * 1989-05-29 1997-10-15 株式会社日立製作所 プリント基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3844799A (en) * 1973-12-17 1974-10-29 Ibm Electroless copper plating
ZA775495B (en) * 1976-11-22 1978-07-26 Kollmorgen Tech Corp Method and apparatus for control of electroless plating solutions
JPS5534725A (en) * 1978-08-31 1980-03-11 Matsushita Electric Ind Co Ltd Printer

Also Published As

Publication number Publication date
JPH0227436B2 (de) 1990-06-18
EP0144685B1 (de) 1990-05-16
EP0144685A1 (de) 1985-06-19
JPS6096767A (ja) 1985-05-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee