DE3469608D1 - Photosensitive polyamic acid derivative, method of manufacturing polyimide pattern on a substrate, and semiconductor device comprising a polyimide pattern obtained by using the said method - Google Patents
Photosensitive polyamic acid derivative, method of manufacturing polyimide pattern on a substrate, and semiconductor device comprising a polyimide pattern obtained by using the said methodInfo
- Publication number
- DE3469608D1 DE3469608D1 DE8484200943T DE3469608T DE3469608D1 DE 3469608 D1 DE3469608 D1 DE 3469608D1 DE 8484200943 T DE8484200943 T DE 8484200943T DE 3469608 T DE3469608 T DE 3469608T DE 3469608 D1 DE3469608 D1 DE 3469608D1
- Authority
- DE
- Germany
- Prior art keywords
- polyimide pattern
- substrate
- semiconductor device
- acid derivative
- polyamic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8302338 | 1983-07-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3469608D1 true DE3469608D1 (en) | 1988-04-07 |
Family
ID=19842095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484200943T Expired DE3469608D1 (en) | 1983-07-01 | 1984-06-29 | Photosensitive polyamic acid derivative, method of manufacturing polyimide pattern on a substrate, and semiconductor device comprising a polyimide pattern obtained by using the said method |
Country Status (4)
Country | Link |
---|---|
US (1) | US4661435A (de) |
EP (1) | EP0131992B1 (de) |
JP (1) | JPS6026033A (de) |
DE (1) | DE3469608D1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3411714A1 (de) * | 1984-03-29 | 1985-10-10 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von polyimidazol- und polyimidazopyrrolon-reliefstrukturen |
CN1004490B (zh) * | 1985-04-27 | 1989-06-14 | 旭化成工业株式会社 | 可固化组合物 |
DE3717933A1 (de) * | 1987-05-27 | 1988-12-08 | Hoechst Ag | Photopolymerisierbares gemisch, dieses enthaltendes aufzeichnungsmaterial und verfahren zur herstellung von hochwaermebestaendigen reliefstrukturen |
US4883744A (en) * | 1988-05-17 | 1989-11-28 | International Business Machines Corporation | Forming a polymide pattern on a substrate |
US5021487A (en) * | 1988-05-27 | 1991-06-04 | Loctite Corporation | Thermally stabilized acrylic adhesive compositions and novel methacrylated malemide compounds useful therein |
DE68921146T2 (de) * | 1988-11-11 | 1995-06-14 | Fuji Photo Film Co Ltd | Lichtempfindliche Zusammensetzung. |
US5206117A (en) * | 1991-08-14 | 1993-04-27 | Labadie Jeffrey W | Photosensitive polyamic alkyl ester composition and process for its use |
ES2146128B1 (es) * | 1995-03-31 | 2001-03-16 | Consejo Superior Investigacion | Procedimiento de fotoenmascaramiento de poliimidas fotosensibles con compuestos organometalicos para procesos fotolitograficos en tecnologia de silicio. |
US20080071269A1 (en) * | 2006-09-18 | 2008-03-20 | Cytyc Corporation | Curved Endoscopic Medical Device |
TW201026513A (en) * | 2009-01-08 | 2010-07-16 | Univ Nat Cheng Kung | Imprinting process of polyimide |
WO2017023677A1 (en) | 2015-08-03 | 2017-02-09 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning composition |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4163097A (en) * | 1975-06-18 | 1979-07-31 | Ciba-Geigy Corporation | Crosslinkable polymeric compounds |
JPS5946380B2 (ja) * | 1977-04-13 | 1984-11-12 | 株式会社日立製作所 | 画像の形成方法 |
WO1980000706A1 (en) * | 1978-09-29 | 1980-04-17 | Hitachi Ltd | Light-sensitive polymer composition |
DE2919840A1 (de) * | 1979-05-16 | 1980-11-20 | Siemens Ag | Verfahren zur phototechnischen herstellung von reliefstrukturen |
JPS606368B2 (ja) * | 1979-08-01 | 1985-02-18 | 東レ株式会社 | 感光性ポリイミド前駆体 |
DE2933871A1 (de) * | 1979-08-21 | 1981-03-12 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung hochwaermebestaendiger reliefstrukturen und deren verwendung. |
DE3021787A1 (de) * | 1980-06-10 | 1981-12-17 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung hochwaermebestaendiger reliefstrukturen und deren verwendung |
US4329419A (en) * | 1980-09-03 | 1982-05-11 | E. I. Du Pont De Nemours And Company | Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors |
GB2092164B (en) * | 1980-12-17 | 1984-12-05 | Hitachi Ltd | Loght or radiation-sensitive polymer composition |
JPS57102936A (en) * | 1980-12-17 | 1982-06-26 | Osaka Soda Co Ltd | Chlorinated polyethylene composition having improved rubber processability |
-
1984
- 1984-06-29 JP JP59133435A patent/JPS6026033A/ja active Pending
- 1984-06-29 EP EP84200943A patent/EP0131992B1/de not_active Expired
- 1984-06-29 DE DE8484200943T patent/DE3469608D1/de not_active Expired
-
1986
- 1986-02-10 US US06/828,093 patent/US4661435A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0131992B1 (de) | 1988-03-02 |
JPS6026033A (ja) | 1985-02-08 |
US4661435A (en) | 1987-04-28 |
EP0131992A1 (de) | 1985-01-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL |
|
8339 | Ceased/non-payment of the annual fee |