DE3467661D1 - Semiconductor device, in particular a transistor including a protection means against overvoltage - Google Patents

Semiconductor device, in particular a transistor including a protection means against overvoltage

Info

Publication number
DE3467661D1
DE3467661D1 DE8484201177T DE3467661T DE3467661D1 DE 3467661 D1 DE3467661 D1 DE 3467661D1 DE 8484201177 T DE8484201177 T DE 8484201177T DE 3467661 T DE3467661 T DE 3467661T DE 3467661 D1 DE3467661 D1 DE 3467661D1
Authority
DE
Germany
Prior art keywords
semiconductor device
transistor including
protection means
means against
against overvoltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484201177T
Other languages
English (en)
Inventor
Bernard Roger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Koninklijke Philips NV
Original Assignee
Radiotechnique Compelec RTC SA
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA, Philips Gloeilampenfabrieken NV filed Critical Radiotechnique Compelec RTC SA
Application granted granted Critical
Publication of DE3467661D1 publication Critical patent/DE3467661D1/de
Expired legal-status Critical Current

Links

Classifications

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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
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    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
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Landscapes

  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Die Bonding (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Fuses (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Bipolar Transistors (AREA)
  • Noodles (AREA)
DE8484201177T 1983-08-17 1984-08-15 Semiconductor device, in particular a transistor including a protection means against overvoltage Expired DE3467661D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8313372A FR2550886B1 (fr) 1983-08-17 1983-08-17 Procede de realisation de transistors de puissance incluant des moyens de protection contre les surcharges et dispositifs ainsi obtenus

Publications (1)

Publication Number Publication Date
DE3467661D1 true DE3467661D1 (en) 1987-12-23

Family

ID=9291651

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484201177T Expired DE3467661D1 (en) 1983-08-17 1984-08-15 Semiconductor device, in particular a transistor including a protection means against overvoltage

Country Status (5)

Country Link
US (1) US4635091A (de)
EP (1) EP0135230B1 (de)
JP (1) JPS6074541A (de)
DE (1) DE3467661D1 (de)
FR (1) FR2550886B1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4922366A (en) * 1988-05-12 1990-05-01 Transnational Energy Systems, Inc., Dba Tesco Meltable conductor to be used in series with voltage suppressors
US5260604A (en) * 1988-09-27 1993-11-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with improved immunity to contact and conductor defects
US5047833A (en) * 1990-10-17 1991-09-10 International Rectifier Corporation Solderable front metal contact for MOS devices
JP2944840B2 (ja) * 1993-03-12 1999-09-06 株式会社日立製作所 電力用半導体装置
US5477409A (en) * 1993-11-24 1995-12-19 Vlsi Technology Inc. Fusion heat sink for integrated circuit
US5424901A (en) * 1994-01-26 1995-06-13 Illinois Tool Works Inc. Sidactor fail-safe device
US5488535A (en) * 1994-01-26 1996-01-30 Illinois Tool Works Inc. Arc suppressor for sidactors
US6337507B1 (en) * 1995-09-29 2002-01-08 Intel Corporation Silicide agglomeration fuse device with notches to enhance programmability
US5708291A (en) 1995-09-29 1998-01-13 Intel Corporation Silicide agglomeration fuse device
JP3352360B2 (ja) * 1996-07-19 2002-12-03 シャープ株式会社 電力制御素子
US6288437B1 (en) * 1999-02-26 2001-09-11 Micron Technology, Inc. Antifuse structures methods and applications
DE19936112A1 (de) 1999-07-31 2001-02-01 Mannesmann Vdo Ag Halbleiterschalter
US6166421A (en) * 1999-08-18 2000-12-26 National Semiconductor Corporation Polysilicon fuse that provides an open current path when programmed without exposing the fuse to the environment
DE10334433B4 (de) * 2003-07-28 2009-10-22 Infineon Technologies Ag Vorrichtung zur Unterbrechung des Stromflusses zu einem oder von einem Halbleiterkörper eines Halbleiterbauelements
DE102006009236A1 (de) * 2006-02-28 2007-09-06 Infineon Technologies Ag Vorrichtung und Verfahren zur temperaturunterbrechenden Absicherung eines elektrischen Bauelements
KR100976650B1 (ko) * 2007-12-07 2010-08-18 주식회사 케이이씨 다이 본딩 구조 및 그 방법
US8319596B2 (en) * 2009-05-20 2012-11-27 GM Global Technology Operations LLC Active material circuit protector
US8816390B2 (en) 2012-01-30 2014-08-26 Infineon Technologies Ag System and method for an electronic package with a fail-open mechanism
US9082737B2 (en) 2012-11-15 2015-07-14 Infineon Technologies Ag System and method for an electronic package with a fail-open mechanism

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3461462A (en) * 1965-12-02 1969-08-12 United Aircraft Corp Method for bonding silicon semiconductor devices
FR2230078B1 (de) * 1973-05-18 1977-07-29 Radiotechnique Compelec
US3925808A (en) * 1974-08-08 1975-12-09 Westinghouse Electric Corp Silicon semiconductor device with stress-free electrodes
DE2649773A1 (de) * 1976-10-29 1978-05-11 Bosch Gmbh Robert Halbleiteranordnung
US4392010A (en) * 1979-01-16 1983-07-05 Solarex Corporation Photovoltaic cells having contacts and method of applying same

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EP0135230B1 (de) 1987-11-19
FR2550886B1 (fr) 1986-10-24
JPS6074541A (ja) 1985-04-26
US4635091A (en) 1987-01-06
FR2550886A1 (fr) 1985-02-22
JPH0160950B2 (de) 1989-12-26
EP0135230A1 (de) 1985-03-27

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