DE3442809C2 - - Google Patents

Info

Publication number
DE3442809C2
DE3442809C2 DE19843442809 DE3442809A DE3442809C2 DE 3442809 C2 DE3442809 C2 DE 3442809C2 DE 19843442809 DE19843442809 DE 19843442809 DE 3442809 A DE3442809 A DE 3442809A DE 3442809 C2 DE3442809 C2 DE 3442809C2
Authority
DE
Germany
Prior art keywords
brazing filler
layer
metal
line connection
composite structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE19843442809
Other languages
German (de)
English (en)
Other versions
DE3442809A1 (de
Inventor
Hirofumi Sendai Jp Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of DE3442809A1 publication Critical patent/DE3442809A1/de
Application granted granted Critical
Publication of DE3442809C2 publication Critical patent/DE3442809C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
DE19843442809 1983-11-24 1984-11-23 Verbundstruktur eines externen leitungsanschlusses und verfahren zur herstellung desselben Granted DE3442809A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22178583A JPS60113450A (ja) 1983-11-24 1983-11-24 外部リ−ド端子の接合構造

Publications (2)

Publication Number Publication Date
DE3442809A1 DE3442809A1 (de) 1985-06-05
DE3442809C2 true DE3442809C2 (zh) 1993-08-19

Family

ID=16772161

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843442809 Granted DE3442809A1 (de) 1983-11-24 1984-11-23 Verbundstruktur eines externen leitungsanschlusses und verfahren zur herstellung desselben

Country Status (2)

Country Link
JP (1) JPS60113450A (zh)
DE (1) DE3442809A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763083B2 (ja) * 1985-04-22 1995-07-05 日本特殊陶業株式会社 端子接続構造およびその接続方法

Also Published As

Publication number Publication date
DE3442809A1 (de) 1985-06-05
JPS60113450A (ja) 1985-06-19

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Legal Events

Date Code Title Description
8128 New person/name/address of the agent

Representative=s name: DIEHL, H., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 800

8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition