DE3435807A1 - Metallisation capable of adhesion and bonding on ceramic for piezo-transducers - Google Patents

Metallisation capable of adhesion and bonding on ceramic for piezo-transducers

Info

Publication number
DE3435807A1
DE3435807A1 DE19843435807 DE3435807A DE3435807A1 DE 3435807 A1 DE3435807 A1 DE 3435807A1 DE 19843435807 DE19843435807 DE 19843435807 DE 3435807 A DE3435807 A DE 3435807A DE 3435807 A1 DE3435807 A1 DE 3435807A1
Authority
DE
Germany
Prior art keywords
nickel
layer
bonding
gold
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19843435807
Other languages
German (de)
Inventor
Hans Dr. 8013 Haar Meixner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19843435807 priority Critical patent/DE3435807A1/en
Publication of DE3435807A1 publication Critical patent/DE3435807A1/en
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/91—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

To obtain good adhesion of a gold used for bonding to nickel (4), a part (41) is removed from the nickel surface by resputtering, before the further layers are applied, preferably by sputtering. <IMAGE>

Description

Haft- und bondfähige Metallisierung auf Keramik für Piezo-Adhesive and bondable metallization on ceramic for piezo

wandler.converter.

Die vorliegende Erfindung bezieht sich auf ein Verfahren nach dem Oberbegriff des Patentanspruchs 1.The present invention relates to a method according to the Preamble of claim 1.

Piezokeramische Wandler werden in der Technik weitverbreitet verwendet. Mit Rücksicht auf mechanische Bewegungen, insbesondere Schwingbewegungen, die derartige Wandler bestimmungsgemäß ausführen, stellen sich besondere Anforderungen an die jeweilige Verbindung mit der Elektrode bzw. mit dem Kontakt der Elektrode des Wandlers. Es ist bekannt, aus Nickel bestehende, insbesondere galvanisch verstärkte, Elektroden bzw. Elektrodenkontakte, die sich auf der Keramikoberfläche befinden, zu verwenden. Das Anschließen eines Zuleitungsdrahtes an eine derartige Elektrode bzw. einen solchen Kontakt erfolgt vorzugsweise durch Bonden, das jedoch ausreichende Haftfestigkeit bedingt. Um eine Haftfestigkeit von z.B. größer 7 Pond pro Nailhead(Y70 #m Durchmesser) zu erreichen, ist eine zusätzliche Oberflächenbelegung aus Gold verwendet worden.Piezoceramic transducers are widely used in the art. With regard to mechanical movements, in particular oscillating movements, such Executing converters as intended, there are special demands on the respective connection with the electrode or with the contact of the transducer electrode. It is known, in particular galvanically reinforced electrodes made of nickel or electrode contacts that are located on the ceramic surface. The connection of a lead wire to such an electrode or such Contact is preferably made by bonding, which, however, has sufficient adhesive strength conditional. To achieve an adhesive strength of e.g. greater than 7 pond per nail head (Y70 #m diameter) To achieve this, an additional surface covering made of gold has been used.

Die voranstehend genannte Lösung ist nicht zufriedenstellend, denn selbst bei sehr sorgfältig zuvor chemisch gereinigter Nickeloberfläche wird keine ausreichende Haftfestigkeit des Goldes auf dem Nickel erreicht. Auch durch Verwendung von Haftvermittler, z.B. Titan oder Chrom, konnte keine ausreichende Haftfestigkeit erzielt werden.The above solution is unsatisfactory because even if the nickel surface has been chemically cleaned very carefully beforehand, no Sufficient adhesive strength of the gold on the nickel is achieved. Also through use Adhesion promoters, e.g. titanium or chromium, could not have sufficient adhesive strength be achieved.

Aufgabe der vorliegenden Erfindung ist es, ein Verfahren anzugeben, mit dem den Anforderungen in bezug auf genügende Haftfestigkeit für das Anbonden auf Nickelelektroden bzw.The object of the present invention is to provide a method with the requirements for sufficient adhesive strength for bonding on nickel electrodes or

-kontakten Rechnung getragen werden kann.-contacts can be taken into account.

Diese Aufgabe wird mit den im Patentanspruch 1 angegebenen Merkmalen gelöst. Weitere Ausgestaltungen und Weiterbildungen der Erfindung gehen aus den Unteransprüchen hervor.This object is achieved with the features specified in claim 1 solved. Further refinements and developments of the invention can be found in FIGS Subclaims.

Der Erfindung liegt der Gedanke zugrunde, zufriedenstellende Haftfestigkeit zwischen dem vorzugsweise galvanisch verstärkten Nickel und der für das Bonden bevorzugten Goldschicht dadurch zu erreichen, daß dem Nickel der Elektrodenschicht eine höhere Tendenz für Anhaften anderen Metalles verliehen wird. Auch bei der vorliegenden Erfindung wird eine aufzusputternde Haftvermittler-Schicht, z.B. aus Chrom oder Titan, zwischen dem Nickel und dem Gold verwendet. Erfindungsgemäß ist aber vorgesehen, daß von der Oberfläche des Nickels ein Anteil durch Resputtern abgetragen wird. Zum Beispiel empfiehlt es sich, das Nickel in einer Dicke von 0,1 pm wegzusputtern. Nach diesem Arbeitsgang wird in derselben Sputter-Apparatur auf der frischen und nunmehr extrem sauberen Nickeloberfläche das Material der Haftvermittler-Schicht (z.B. Chrom oder Titan) mit vorzugsweise ca. 50 nm, und dann auf die Haftvermittler-Schicht eine Goldschicht mit vorzugsweise etw 0,1 {um Dicke aufgesputtert. Die Goldschicht kann gegebenenfalls durch Aufdampfen weiteren Goldes verstärkt werden.The invention is based on the idea of satisfactory adhesive strength between the preferably electroplated nickel and the one preferred for bonding To achieve gold layer by giving the nickel of the electrode layer a higher Tendency for other metal to adhere. Even with this one Invention is an adhesion promoter layer to be sputtered on, e.g. made of chrome or Titanium, used between the nickel and the gold. According to the invention, however, it is provided that a portion is removed from the surface of the nickel by sputtering. For example, it is advisable to sputter away the nickel to a thickness of 0.1 μm. After this operation is in the same sputtering apparatus on the fresh and now extremely clean nickel surface the material of the adhesion promoter layer (e.g. chromium or titanium) with preferably approx. 50 nm, and then on the adhesion promoter layer a layer of gold preferably about 0.1 µm thick is sputtered on. The gold layer can optionally be reinforced by vapor deposition of further gold.

Das erfindungsgemäße Verfahren ergibt entscheidend verbesserte Haftfestigkeit von über 10 Pond pro Nailhead. Das Verfahren ist auch nicht nennenswert aufwendiger, denn es wird ein und dieselbe Sputter-Apparatur in rasch aufeinander ablaufenden Verfahrensschritten des Resputterns und Aufsputterns des Haftvermittlers benutzt.The method according to the invention results in significantly improved adhesive strength of over 10 pond per nailhead. The process is also not significantly more complex, because it is one and the same sputtering apparatus in rapid succession Process steps of sputtering and sputtering of the adhesion promoter used.

Die beigefügte Figur zeigt einen erfindungsgemäßen Schichtaufbau. Mit 1 ist ein Anteil eines Körpers aus Piezokeramik, z.B. aus Bleititanat, bezeichnet. Auf der Keramikoberfläche befinden sich aufeinanderfolgend eine aufgesputterte Chromschicht (z.B. 0,05 #m) und eine aufgesputterte Platinschicht (z.B. etwa 0,05 pm). Es sind dies die Schichten 2 und 3. Die Schicht 4 ist das Nickel der Elektrode bzw. des Kontakts. Mit 41 ist der Anteil der Nickelschicht 4 bezeichnet, der im erfindungsgemäß vorzusehenden Resputter-Verfahren entfernt worden ist, ehe unmittelbar folgend die Schicht 6 aus dem Haftvermittler und die Goldschicht 7 aufgebracht worden sind. Für die Schicht 6 empfiehlt sich eine Dicke von z.B. 0,05 pm und für das Gold 0,1 gm.The attached figure shows a layer structure according to the invention. 1 denotes a part of a body made of piezoceramic, e.g. made of lead titanate. A sputtered chrome layer is located one after the other on the ceramic surface (e.g. 0.05 #m) and a sputtered platinum layer (e.g. about 0.05 μm). There are this is layers 2 and 3. Layer 4 is the nickel of the electrode or of the Contacts. The portion of the nickel layer 4 is denoted by 41, which is in accordance with the invention The resputter process to be provided has been removed before the immediately following Layer 6 of the adhesion promoter and the gold layer 7 have been applied. A thickness of e.g. 0.05 μm is recommended for layer 6 and 0.1 for the gold gm.

Claims (3)

Patentanspruche: 1. Verfahren zur Herstellung einer haft- und bondfähigen Metallisierung zwischen einem auf Piezokeramik befindlichen Kontakt aus Nickel und einer Goldschicht, wobei Haftvermittler zwischen dem Nickel und dem Gold verwendet wird, g e k e n n z e i c h n e t dadurch, daß vor dem Aufbringen des Materials der Haftschicht von der Oberfläche des Nickelkontakts (4) ein Anteil (41) durch Resputtern abgetragen wird.Claims: 1. Process for the production of an adhesive and bondable Metallization between a contact made of nickel and located on piezoceramic a gold layer, using adhesion promoters between the nickel and the gold is indicated by the fact that before the material is applied a portion (41) of the adhesive layer from the surface of the nickel contact (4) Resputtern is removed. 2. Verfahren nach Anspruch 1, g e k e n n z e i c h -n e t dadurch, daß das Abtragen des Anteils (41) in derselben Sputter-Apparatur erfolgt, in der die nachfolgende Schicht (6) des Haftvermittlers aufgesputtert wird.2. The method according to claim 1, g e k e n n z e i c h -n e t thereby, that the removal of the portion (41) takes place in the same sputtering apparatus in which the subsequent layer (6) of the adhesion promoter is sputtered on. 3. Verfahren nach Anspruch 1 oder 2, g e k e n n -z e i c h n e t dadurch, daß der Anteil (41) des von der Schicht (4) abgetragenen Nickels eine Dicke von etwa 0,1 pm hat.3. The method according to claim 1 or 2, g e k e n n -z e i c h n e t in that the portion (41) of the nickel removed from the layer (4) has a thickness of about 0.1 pm.
DE19843435807 1984-09-28 1984-09-28 Metallisation capable of adhesion and bonding on ceramic for piezo-transducers Withdrawn DE3435807A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19843435807 DE3435807A1 (en) 1984-09-28 1984-09-28 Metallisation capable of adhesion and bonding on ceramic for piezo-transducers

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Application Number Priority Date Filing Date Title
DE19843435807 DE3435807A1 (en) 1984-09-28 1984-09-28 Metallisation capable of adhesion and bonding on ceramic for piezo-transducers

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DE3435807A1 true DE3435807A1 (en) 1986-04-10

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2595349A1 (en) * 1986-03-05 1987-09-11 Murata Manufacturing Co PROCESS FOR METALLIZATION OF CERAMIC MATERIAL BY NON-ELECTROLYTIC DEPOSITION AND IMPROVEMENT IN PRETREATMENT BEFORE METALLIZATION
DE3830174A1 (en) * 1988-09-06 1990-03-15 Geesthacht Gkss Forschung CONDUCTIVE SURFACE LAYER
DE19742688C1 (en) * 1997-09-26 1999-03-18 Siemens Ag Stacked piezoelectric actuator manufacturing method e.g. for ultrasonic therapy device
DE19945934C1 (en) * 1999-09-24 2001-03-22 Epcos Ag Electroceramic component external contact manufacturing method uses 2-stage screen printing process for application of metallisation paste layers with optimum adhesion and good soldering characteristics
DE102005015112A1 (en) * 2005-04-01 2006-10-05 Siemens Ag Monolithic piezoelectric component with mechanical decoupling layer, method for manufacturing the component and use of the component
DE102009013125A1 (en) * 2009-03-13 2010-09-23 Epcos Ag Multi-layer piezoelectric actuator and method for mounting an outer electrode in a piezoelectric actuator
DE102010054589A1 (en) * 2010-12-15 2012-06-21 Epcos Ag Piezo actuator with protection against environmental influences

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2905133A1 (en) * 1979-02-10 1980-08-14 Degussa Pre-metallisation of ceramic pt. for electroplating - using palladium alloy with cobalt, iron and/or nickel to increase adhesion
DE2906888A1 (en) * 1979-02-22 1980-09-04 Degussa METHOD FOR THE PRODUCTION OF HARD SOLENOIDABLE METAL LAYERS ON CERAMICS
DE3118957A1 (en) * 1981-05-13 1982-12-09 Degussa Ag, 6000 Frankfurt Process for preparing a heat-resistant strongly adhering gold layer on an oxidic support material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2905133A1 (en) * 1979-02-10 1980-08-14 Degussa Pre-metallisation of ceramic pt. for electroplating - using palladium alloy with cobalt, iron and/or nickel to increase adhesion
DE2906888A1 (en) * 1979-02-22 1980-09-04 Degussa METHOD FOR THE PRODUCTION OF HARD SOLENOIDABLE METAL LAYERS ON CERAMICS
DE3118957A1 (en) * 1981-05-13 1982-12-09 Degussa Ag, 6000 Frankfurt Process for preparing a heat-resistant strongly adhering gold layer on an oxidic support material

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2595349A1 (en) * 1986-03-05 1987-09-11 Murata Manufacturing Co PROCESS FOR METALLIZATION OF CERAMIC MATERIAL BY NON-ELECTROLYTIC DEPOSITION AND IMPROVEMENT IN PRETREATMENT BEFORE METALLIZATION
DE3830174A1 (en) * 1988-09-06 1990-03-15 Geesthacht Gkss Forschung CONDUCTIVE SURFACE LAYER
DE19742688C1 (en) * 1997-09-26 1999-03-18 Siemens Ag Stacked piezoelectric actuator manufacturing method e.g. for ultrasonic therapy device
DE19945934C1 (en) * 1999-09-24 2001-03-22 Epcos Ag Electroceramic component external contact manufacturing method uses 2-stage screen printing process for application of metallisation paste layers with optimum adhesion and good soldering characteristics
DE102005015112A1 (en) * 2005-04-01 2006-10-05 Siemens Ag Monolithic piezoelectric component with mechanical decoupling layer, method for manufacturing the component and use of the component
DE102005015112B4 (en) * 2005-04-01 2007-05-24 Siemens Ag Monolithic piezoelectric component with mechanical decoupling layer, method for manufacturing the component and use of the component
US7795789B2 (en) 2005-04-01 2010-09-14 Siemens Aktiengesellschaft Monolithic piezoelectric component comprising a mechanical uncoupling, method for producing same and use thereof
DE102009013125A1 (en) * 2009-03-13 2010-09-23 Epcos Ag Multi-layer piezoelectric actuator and method for mounting an outer electrode in a piezoelectric actuator
DE102010054589A1 (en) * 2010-12-15 2012-06-21 Epcos Ag Piezo actuator with protection against environmental influences

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