EP0149662B1 - Process for the metallization of a solid body - Google Patents

Process for the metallization of a solid body Download PDF

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Publication number
EP0149662B1
EP0149662B1 EP84902802A EP84902802A EP0149662B1 EP 0149662 B1 EP0149662 B1 EP 0149662B1 EP 84902802 A EP84902802 A EP 84902802A EP 84902802 A EP84902802 A EP 84902802A EP 0149662 B1 EP0149662 B1 EP 0149662B1
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EP
European Patent Office
Prior art keywords
layer
metal layer
solid body
metallising
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP84902802A
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German (de)
French (fr)
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EP0149662A1 (en
Inventor
Robert Ostwald
Gabriele Voit
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Licentia Patent Verwaltungs GmbH
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Licentia Patent Verwaltungs GmbH
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Publication date
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Priority to AT84902802T priority Critical patent/ATE40904T1/en
Publication of EP0149662A1 publication Critical patent/EP0149662A1/en
Application granted granted Critical
Publication of EP0149662B1 publication Critical patent/EP0149662B1/en
Expired legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals

Definitions

  • the invention relates to a method for metallizing a solid body according to the preamble of patent claim 1.
  • Solid bodies are metallized in order to improve their functional properties, e.g. B. change, improve and / or expand the electrical conductivity, corrosion resistance, wear resistance and / or decorative properties. With such metallizations, their adhesive strength is generally of great importance.
  • the layer liability can e.g. B. by relatively weak interaction between layer and substrate material (so-called Van der Waals forces), by chemical bonds or by mechanical anchoring and / or by a combination of these contributions.
  • Adhesion promoters consist of a material that differs from the substrate and the desired coating, so that unsuitable properties occur or the desired layer properties are restricted. So reduce z.
  • a method is known in which on a body, for. B. a so-called substrate, ceramic is first melted a thin metal layer, preferably a titanium layer, from a corresponding metal salt.
  • This titanium layer is then structured, e.g. B. corresponding to an electronic circuit to be produced.
  • the titanium layer is then cleaned and chemically treated in such a way that any oxide layer which may be present is removed.
  • the titanium layer is then chemically activated in such a way that a second metal layer, preferably a nickel layer, can be chemically electrolessly deposited thereon.
  • the object of the invention is to provide a generic method which, in a cost-effective manner, enables in particular a very finely structured and adherent metallization on a body which consists of a silicate glass and in which roughening of the surface and the deposition of a special adhesion promoter is avoided.
  • a disk-shaped body made of soda-lime glass is steamed with a first layer of an indium-tin alloy layer with a thickness of 120 nm after the use of currently known cleaning and degreasing methods in a cathode sputtering system.
  • a treatment in a palladium chloride solution and subsequent thorough rinsing in demineralized water produces a catalytic seed layer on which a very uniform copper layer can be deposited in a currently commercially available chemical copper bath. After annealing, it is galvanically reinforced with copper. With the help of a photoresist and etching process that is currently common, strips 1 mm wide are prepared, which require a tensile force of 0.2 N for vertical peeling.
  • a borosilicate glass pane is pretreated as in the comparative example and vapor-deposited with an indium-tin alloy layer.
  • the layer is converted into a translucent layer by oxidation.
  • a catalytic seed layer is formed with palladium chloride solution.
  • tempering is carried out in the absence of oxygen.
  • galvanic amplification of the Layer and a peeling strip preparation according to Example 1 a peeling strength of 0.45 N / mm is measured.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Surface Treatment Of Glass (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

For the secure adherence of the metallization of a preferably glass-like body, a catalytic germination layer, for the chemical currentless separation of metal after a first thin layer of an indium-tin alloy, is produced by reducing a catalyst metal combination to the catalyst metal directly through the indium-tin layer or after a salt formation and hydrolysis of the indium-tin layer. After the chemical currentless metallization it is possible to proceed with the metallization by galvanization using the presently usual metals.

Description

Die Erfindung betrifft ein Verfahren zur Metallisierung eines festen Körpers nach dem Oberbegriff des Patentanspruchs 1.The invention relates to a method for metallizing a solid body according to the preamble of patent claim 1.

Feste Körper werden metallisiert, um deren funktionelle Eigenschaften, z. B. die elektrische Leitfähigkeit, die Korrosionsbeständigkeit, die Verschleißfestigkeit und/oder auch dekorative Eigenschaften zu verändern, zu verbessern und/ oder zu erweitern. Bei derartigen Metallisierungen ist im allgemeinen deren Haftfestigkeit von großer Bedeutung. Die Schichthaftung kann z. B. durch relativ schwache Wechselwirkung zwischen Schicht- und Substratmaterial (sogenannten Van der Waals-Kräfte), durch chemische Bindungen oder durch mechanische Verankerungen und/ oder durch eine Kombination dieser Beiträge bewirkt werden.Solid bodies are metallized in order to improve their functional properties, e.g. B. change, improve and / or expand the electrical conductivity, corrosion resistance, wear resistance and / or decorative properties. With such metallizations, their adhesive strength is generally of great importance. The layer liability can e.g. B. by relatively weak interaction between layer and substrate material (so-called Van der Waals forces), by chemical bonds or by mechanical anchoring and / or by a combination of these contributions.

Es sind Verfahren bekannt, mit deren Hilfe sich die Schichthaftung verbessern läßt. So können z. B. haftvermittelnde Zwischenschichten in Form von Klebern oder Aufdampf- und/oder Sputter-Schichten abgeschieden werden. Eine bessere Schichthaftung wird erreicht durch eine Substrataufrauhung, z. B. durch einen Schleifprozeß, und/oder durch Anquellen sowie Aufrauhen der Oberfläche durch chemisches Ätzen und/oder durch eine Einbettung herauslösbarer Fremdstoffe in den Haftvermittler.Methods are known by means of which the layer adhesion can be improved. So z. B. intermediate layers in the form of adhesives or vapor deposition and / or sputter layers are deposited. Better layer adhesion is achieved by roughening the substrate, e.g. B. by a grinding process, and / or by swelling and roughening the surface by chemical etching and / or by embedding foreign substances that can be removed in the adhesion promoter.

Diese bekannten Verfahren sind auf bestimmte Anwendungsfälle und spezielle Materialkombinationen beschränkt. Haftvermittler bestehen aus einem Material, das vom Substrat und der gewünschten Beschichtung verschieden ist, so daß unpassende Eigenschaften auftreten oder eine Einschränkung der gewünschten Schichteigenschaften erfolgt. So verringern z. B. Haftvermittler aus Klebeschichten die thermische Belastbarkeit des beschichteten Körpers. Für anorganische Haftvermittler werden unwirtschaftliche Beschichtungsverfahren benötigt. Eine Aufrauhung der Substratoberflächen stört überall dort, wo sehr feine Metallisierungsstrukturen benötigt werden oder wo spezielle optische Eigenschaften (Reflexion, Glanz) verlangt werden.These known methods are limited to certain applications and special material combinations. Adhesion promoters consist of a material that differs from the substrate and the desired coating, so that unsuitable properties occur or the desired layer properties are restricted. So reduce z. B. Adhesion promoter from adhesive layers, the thermal resistance of the coated body. Uneconomical coating processes are required for inorganic adhesion promoters. Roughening of the substrate surfaces is a problem wherever very fine metallization structures are required or where special optical properties (reflection, gloss) are required.

Aus der US-A-3 427 197 ist ein Verfahren bekannt, bei dem auf einen Körper, z. B. ein sogenanntes Substrat, aus Keramik zunächst eine dünne Metallschicht, vorzugsweise eine Titanschicht, aus einem entsprechenden Metallsalz aufgeschmolzen wird. Diese Titanschicht wird anschließend strukturiert, z. B. entsprechend einer herzustellenden elektronischen Schaltung. Die Titanschicht wird anschließend gereinigt und chemisch derart behandelt, daß eine möglicherweise vorhandene Oxidschicht entfernt wird. Daraufhin erfolgt eine chemische Aktivierung der Titanschicht derart, daß darauf stromlos chemisch eine zweite Metallschicht, vorzugsweise eine Nickelschicht, abgeschieden werden kann.From US-A-3 427 197 a method is known in which on a body, for. B. a so-called substrate, ceramic is first melted a thin metal layer, preferably a titanium layer, from a corresponding metal salt. This titanium layer is then structured, e.g. B. corresponding to an electronic circuit to be produced. The titanium layer is then cleaned and chemically treated in such a way that any oxide layer which may be present is removed. The titanium layer is then chemically activated in such a way that a second metal layer, preferably a nickel layer, can be chemically electrolessly deposited thereon.

Aus der Druckschrift IBM Techn. Disci. Bull., Band 23, Nr. 10, Seite 4914, sowie aus der DE-A-1621367 ist es weiterhin bekannt, auf ein Keramiksubstrat zunächst eine molybdänhaltige erste Metallschicht aufzuschmelzen oder aufzusintern und diese erste Metallschicht dann derart chemisch zu aktivieren, daß darauf stromlos chemisch eine Nickelschicht abgeschieden werden kann.From the publication IBM Techn. Disci. Bull., Volume 23, No. 10, page 4914, as well as from DE-A-1621367, it is also known to first melt or sinter a molybdenum-containing first metal layer onto a ceramic substrate and then to chemically activate this first metal layer in such a way that it is de-energized a nickel layer can be chemically deposited.

Bei derartigen Verfahren wird also immer von einem Keramikkörper ausgegangen, auf den zunächst eine erste Metallschicht aufgeschmolzen und/oder aufgesintert wird.In such methods, a ceramic body is therefore always assumed, onto which a first metal layer is first melted and / or sintered.

Aufgabe der Erfindung ist es ein gattungsgemäßes Verfahren anzugeben, das in kostengünstiger Weise insbesondere eine sehr fein strukturierbare und haftfeste Metallisierung auf einem Körper ermöglicht, der aus einem Silikatglas besteht und bei dem eine Aufrauhung der Oberfläche sowie die Abscheidung eines speziellen Haftvermittlers vermieden wird.The object of the invention is to provide a generic method which, in a cost-effective manner, enables in particular a very finely structured and adherent metallization on a body which consists of a silicate glass and in which roughening of the surface and the deposition of a special adhesion promoter is avoided.

Die Aufgabe wird erfindungsgemäß gelöst durch die im kennzeichnenden Teil des Patentanspruchs 1 angegebenen Merkmale. Zweckmäßige Ausgestaltungen und Weiterbildungen sind den Unteransprüchen entnehmbar.The object is achieved by the features specified in the characterizing part of patent claim 1. Appropriate refinements and developments can be found in the subclaims.

Die Erfindung wird im folgenden anhand eines Vergleichsbeispieles und eines Ausführungsbeispieles näher erläutert.The invention is explained below with reference to a comparative example and an embodiment.

VergleichsbeispielComparative example

Ein scheibenförmiger Körper aus Natronkalkglas wird nach der Anwendung derzeit geläufiger Reinigungs- und Entfettungsmethoden in einer Kathodenzerstäubungsanlage mit einer ersten Schicht aus einer Indium-Zinn-Legierungsschicht mit einer Dicke von 120 nm bedampft. Durch eine Behandlung in einer Palladiumchloridlösung und anschliessendem gründlichem Spülen in demineralisiertem Wasser wird eine katalytische Keimschicht erzeugt, auf der sich in einem derzeit handelsüblichen chemischen Kupferbad eine sehr gleichmäßige Kupferschicht abscheiden läßt. Nach einer Temperung wird diese galvanisch mit Kupfer verstärkt. Mit Hilfe eines derzeit üblichen Fotolack- und Ätzverfahrens werden 1 mm breite Streifen präpariert, die zum senkrechten Abschälen eine Zugkraft von 0,2 N erfordern.A disk-shaped body made of soda-lime glass is steamed with a first layer of an indium-tin alloy layer with a thickness of 120 nm after the use of currently known cleaning and degreasing methods in a cathode sputtering system. A treatment in a palladium chloride solution and subsequent thorough rinsing in demineralized water produces a catalytic seed layer on which a very uniform copper layer can be deposited in a currently commercially available chemical copper bath. After annealing, it is galvanically reinforced with copper. With the help of a photoresist and etching process that is currently common, strips 1 mm wide are prepared, which require a tensile force of 0.2 N for vertical peeling.

Beispielexample

Eine Borsilikatglasscheibe wird wie im Vergleichsbeispiel vorbehandelt und mit einer Indium-Zinn-Legierungsschicht bedampft. Durch einen Temperprozeß in Luft wird die Schicht durch Oxidation in eine lichtdurchlässige Schicht umgewandelt. Nach einer Gasphasenbeizung sowie nach einer anschließenden Hydrolyse wird mit Palladiumchloridlösung eine katalytische Keimschicht gebildet. Nach Abscheidung einer 0,3 f.Lm dicken Kupferschicht aus einem derzeit handelsüblichen chemischen Kupferbad wird eine Temperung unter Ausschluß von Sauerstoff durchgeführt. Nach einer galvanischen Verstärkung der Schicht und einer Schälstreifenpräparation gemäß Beispiel 1, wird eine Schälfestigkeit von 0,45 N/mm gemessen.A borosilicate glass pane is pretreated as in the comparative example and vapor-deposited with an indium-tin alloy layer. Through a tempering process in air, the layer is converted into a translucent layer by oxidation. After gas phase pickling and subsequent hydrolysis, a catalytic seed layer is formed with palladium chloride solution. After a 0.3 f.Lm thick copper layer has been deposited from a currently commercially available chemical copper bath, tempering is carried out in the absence of oxygen. After galvanic amplification of the Layer and a peeling strip preparation according to Example 1, a peeling strength of 0.45 N / mm is measured.

Claims (6)

1. Method for the metallising of a solid body, which consists of a silicate material, in which method
- a first metal layer, which contains a base metal, is applied initially onto the cleaned surface of the body,
- the first metal layer is subsequently activated in such a manner that a catalytic seed layer arises through a reduction process out of a palladium chloride solution applied later and
- a second metal layer is precipitated later on the catalytic seed layer by a current-free chemical precipitation of metal, characterised thereby,
- that the silicate material is a silicate glass,
- that the first metal layer consists of an indium-tin alloy,
- that the first metal layer is subsequently oxidised into a light-permeable layer containing metal oxide,
- that the layer containing metal oxide is at least partially converted into a metallic salt layer by chemical reaction with an acid,
- that the metallic salt layer is converted by a subsequent hydrolysis into a layer containing hydroxide and
- that the layer containing hydroxide is converted through reaction with a palladium chloride solution into the catalytic seed layer, on which the second metal layer is precipitated chemically and free of current.
2. Method for the metallising of a solid body according to claim 1, characterised thereby, that a soda lime glass or a borosilicate glass is used as silicate glass.
3. Method for the metallising of a solid body according to claim 1 or claim 2, characterised thereby, that an indium-tin alloy, the indium-tin ratio of which lies in a range from 100 to 0.01, is used for the first metal layer.
4. Method for the metallising of a solid body according to one of the preceding claims, characterised thereby, that the first metal layer is applied in a thickness which lies in the range of 10 nanometres to 1 000 nanometres.
5. Method for the metallising of a solid body according to one of the preceding claims, characterised thereby, that the chemical reaction takes place through an acid or a gas phase pickling.
6. Method for the metallising of a solid body according to one of the preceding claims, characterised thereby, that a copper layer is precipitated as second metal layer.
EP84902802A 1983-07-21 1984-07-18 Process for the metallization of a solid body Expired EP0149662B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT84902802T ATE40904T1 (en) 1983-07-21 1984-07-18 METHOD OF METALLIZING A SOLID BODY.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3326253 1983-07-21
DE19833326253 DE3326253A1 (en) 1983-07-21 1983-07-21 METHOD FOR METALLIZING A SOLID BODY

Publications (2)

Publication Number Publication Date
EP0149662A1 EP0149662A1 (en) 1985-07-31
EP0149662B1 true EP0149662B1 (en) 1989-02-22

Family

ID=6204509

Family Applications (2)

Application Number Title Priority Date Filing Date
EP84108494A Pending EP0132784A3 (en) 1983-07-21 1984-07-18 Process for metallizing a compact body
EP84902802A Expired EP0149662B1 (en) 1983-07-21 1984-07-18 Process for the metallization of a solid body

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP84108494A Pending EP0132784A3 (en) 1983-07-21 1984-07-18 Process for metallizing a compact body

Country Status (6)

Country Link
US (1) US4692356A (en)
EP (2) EP0132784A3 (en)
JP (1) JPS60501858A (en)
DE (2) DE3326253A1 (en)
DK (1) DK42585A (en)
WO (1) WO1985000623A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3518766A1 (en) * 1985-05-24 1986-11-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt METHOD FOR METALLIZING A SUBSTRATE
DE3536821A1 (en) * 1985-10-16 1987-04-16 Standard Elektrik Lorenz Ag METHOD FOR PRODUCING A CURRENTLY DEPOSITABLE, SOLBABLE METAL LAYER
DE3705251A1 (en) * 1987-02-19 1988-09-01 Standard Elektrik Lorenz Ag METHOD FOR PRODUCING A CURRENTLY DEPOSITABLE, SOLBABLE METAL LAYER
US4965101A (en) * 1987-12-10 1990-10-23 Swiss Aluminium Ltd. Ceramic foam for filters for cleaning exhaust gases of diesel engines
DE4035362A1 (en) * 1990-11-07 1992-05-14 Licentia Gmbh LCD support panel with improved electrode structure - uses internal electrodes of indium, tin and palladium oxide(s) and an external array strengthened by additional metal deposition
DE4138214A1 (en) * 1991-11-21 1993-05-27 Daimler Benz Ag Metallisation of aluminium nitride ceramic - involves ceramic treatment to remove glass surface film
DE4220621A1 (en) * 1992-06-24 1994-01-05 Daimler Benz Ag Electroless chemical prodn. of metal layer on substrate - comprises forming palladium@ layer before metallising and producing tin oxide on substrate
US20050242656A1 (en) * 2004-04-30 2005-11-03 Hogan Scott A Plated covers for vehicle wheel assemblies

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3427197A (en) * 1965-01-27 1969-02-11 Lockheed Aircraft Corp Method for plating thin titanium films
DE1621367A1 (en) * 1967-10-18 1971-05-06 Telefunken Patent Method for activating a metallization layer
US3889017A (en) * 1971-02-02 1975-06-10 Ppg Industries Inc Chemical filming solution and process for plating therewith
US4307168A (en) * 1977-05-05 1981-12-22 Eastman Kodak Company Amplification of developed electrographic image patterns
US4322457A (en) * 1978-01-25 1982-03-30 Western Electric Co., Inc. Method of selectively depositing a metal on a surface
US4354911A (en) * 1981-08-07 1982-10-19 Western Electric Company Inc. Method of selectively depositing a metal on a surface by means of sputtering
US4444848A (en) * 1982-01-04 1984-04-24 Western Electric Co., Inc. Adherent metal coatings on rubber-modified epoxy resin surfaces

Also Published As

Publication number Publication date
WO1985000623A1 (en) 1985-02-14
US4692356A (en) 1987-09-08
DK42585A (en) 1985-03-22
DK42585D0 (en) 1985-01-31
DE3326253A1 (en) 1985-01-31
JPS60501858A (en) 1985-10-31
EP0149662A1 (en) 1985-07-31
EP0132784A2 (en) 1985-02-13
DE3476820D1 (en) 1989-03-30
EP0132784A3 (en) 1985-03-20

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