EP0132784A2 - Process for metallizing a compact body - Google Patents

Process for metallizing a compact body Download PDF

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Publication number
EP0132784A2
EP0132784A2 EP84108494A EP84108494A EP0132784A2 EP 0132784 A2 EP0132784 A2 EP 0132784A2 EP 84108494 A EP84108494 A EP 84108494A EP 84108494 A EP84108494 A EP 84108494A EP 0132784 A2 EP0132784 A2 EP 0132784A2
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EP
European Patent Office
Prior art keywords
layer
metallizing
metal
solid body
indium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP84108494A
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German (de)
French (fr)
Other versions
EP0132784A3 (en
Inventor
Robert Dr. Ostwald
Gabriele Voit
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Licentia Patent Verwaltungs GmbH
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Licentia Patent Verwaltungs GmbH
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Publication of EP0132784A2 publication Critical patent/EP0132784A2/en
Publication of EP0132784A3 publication Critical patent/EP0132784A3/en
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals

Definitions

  • the invention relates to a method for metallizing a solid body according to the preamble of patent claim 1.
  • Solid bodies are metallized in order to change, improve and / or expand their functional properties, for example the electrical conductivity, the corrosion resistance, the wear resistance and / or also decorative properties. With such metallizations, their adhesive strength is generally of great importance.
  • the layer adhesion can be caused, for example, by a relatively weak interaction between the layer and substrate material (so-called Van der Waals forces), by chemical bonding or by mechanical anchoring and / or a combination of these contributions.
  • the layer adhesion can be improved.
  • adhesion-promoting intermediate layers in the form of adhesives or vapor deposition and / or sputter layers are deposited.
  • Better layer adhesion is achieved by roughening the substrate, e.g. by a grinding process, and / or by swelling and roughening of the surface by chemical etching and / or by embedding foreign substances that can be removed in the adhesion promoter.
  • Adhesion promoters consist of a material that differs from the substrate and the desired coating, so that unsuitable properties occur or the desired layer properties are restricted.
  • Adhesion promoter made of adhesive layers the thermal strength of the coated body.
  • Uneconomical coating processes are required for inorganic adhesion promoters. Roughening of the substrate surfaces is a problem wherever very fine metallization structures are required or where special optical properties (reflection, gloss) are required.
  • the object of the invention is to provide a generic method which, in particular, is a cost-effective method enables very fine structurable and adherent metallization on glassy and / or glassy bodies and in which a reaming of the surface of the body and the deposition of a special adhesion promoter is avoided.
  • a disk-shaped body made of soda-lime glass is vaporized after the application of currently familiar cleaning and degreasing methods in a cathode sputtering system with a first layer of an indium-tin alloy layer with a thickness of 120 nm.
  • a treatment in a palladium chloride solution and subsequent thorough rinsing in demineralized water produces a catalytic seed layer on which a very uniform copper layer can be deposited in a currently commercially available chemical copper bath. After annealing, it is galvanically reinforced with copper.
  • 1mm wide strips are prepared, which require a tensile force of 0.2 N for vertical peeling.
  • a borosilicate glass pane is pretreated as in Example 1 and vapor-coated with an indium-tin alloy layer. Through a tempering process in air, the layer is converted into a translucent layer by oxidation. After gas phase pickling and subsequent hydrolysis, a catalytic seed layer is formed with palladium chloride solution. After deposition of a 0.3 ⁇ m thick copper layer from a currently commercially available chemical copper bath, tempering is carried out in the absence of oxygen. After a galvanic reinforcement of the layer and a peeling strip preparation according to Example 1, a peel strength of 0.45 N / mm is measured.

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Surface Treatment Of Glass (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Zur haftfesten Metallisierung eines vorzugsweise glasartigen Körpers wird nach einer dünnen Beschichtung mit einer Indium-Zinn-Legierung eine für die stromlos-chemische Metallabscheidung katalytische Keimschicht erzeugt, indem eine Katalysatormentallverbindung durch die Indium-Zinn-Schicht direkt oder nach einer Salzbildung und Hydrolyse der Indium-Zinn-Schicht durch diese zum Katalysatormetall reduziert wird. Nach der stromlos-chemischen Metallisierung kann mit derzeit üblichen Metallen galvanisch weiterverstärkt werden.For the adherent metallization of a preferably glass-like body, after a thin coating with an indium-tin alloy, a seed layer catalytic for the electroless chemical metal deposition is generated by a catalyst metal compound through the indium-tin layer directly or after salt formation and hydrolysis of the indium Tin layer is reduced by this to the catalyst metal. After the electroless chemical metallization, galvanic amplification can be carried out with currently customary metals.

Description

Die Erfindung betrifft ein Verfahren zur Metallisierung eines festen Körpers nach dem Oberbegriff des Patentanspruchs 1.The invention relates to a method for metallizing a solid body according to the preamble of patent claim 1.

Feste Körper werden metallisiert, um deren funktionelle Eigenschaften, z.B. die elektrische Leitfähigkeit, die Korrosionsbeständigkeit, die Verschleißfestigkeit und/oder auch dekorative Eigenschaften zu verändern, zu verbessern und/oder zu erweitern. Bei derartigen Metallisierungen ist im allgemeinen deren Haftfestigkeit von großer Bedeutung. Die Schichthaftung kann z.B. durch relativ schwache Wechselwirkung zwischen Schicht- und Substratmaterial (sogenannten Van der Waals-Kräfte), durch chemische Bindungen oder durch mechanische Verankerungen und/oder durch eine Kombination dieser Beiträge bewirkt werden.Solid bodies are metallized in order to change, improve and / or expand their functional properties, for example the electrical conductivity, the corrosion resistance, the wear resistance and / or also decorative properties. With such metallizations, their adhesive strength is generally of great importance. The layer adhesion can be caused, for example, by a relatively weak interaction between the layer and substrate material (so-called Van der Waals forces), by chemical bonding or by mechanical anchoring and / or a combination of these contributions.

Es sind Verfahren bekannt, mit deren Hilfe sich die Schichthaftung verbessern läßt. So können z.B. haftvermittelnde Zwischenschichten in Form von Klebern oder Aufdampf- und/oder Sputter-Schichten abgeschieden werden. Eine bessere Schichthaftung wird erreicht durch eine Substrataufrauhung, z.B. durch einen Schleifprozeß, und/oder durch Anquellen sowie Aufrauhen der Oberfläche durch chemisches Ätzen und/oder durch eine Einbettung herauslösbarer Fremdstoffe in den Haftvermittler.Methods are known by means of which the layer adhesion can be improved. For example, adhesion-promoting intermediate layers in the form of adhesives or vapor deposition and / or sputter layers are deposited. Better layer adhesion is achieved by roughening the substrate, e.g. by a grinding process, and / or by swelling and roughening of the surface by chemical etching and / or by embedding foreign substances that can be removed in the adhesion promoter.

Diese bekannten Verfahren sind auf bestimmte Anwendungsfälle und spezielle Materialkombinationen beschränkt. Haftvermittler bestehen aus einem Material, das vom Substrat und der gewünschten Beschichtung verschieden ist, so daß unpassende Eigenschaften auftreten oder eine Einschränkung der gewünschten Schichteigenschaften erfolgt. So verringern z.B. Haftvermittler aus Klebeschichten die thermische Belastbarkeit des beschichteten Körpers. Für anorganische Haftvermittler werden unwirtschaftliche Beschichtungsverfahren benötigt. Eine Aufrauhung der Substratoberflächen stört überall dort, wo sehr feine Metallisierungsstrukturen benötigt werden oder wo spezielle optische Eigenschaften (Reflexion, Glanz) verlangt werden.These known methods are limited to certain applications and special material combinations. Adhesion promoters consist of a material that differs from the substrate and the desired coating, so that unsuitable properties occur or the desired layer properties are restricted. For example, Adhesion promoter made of adhesive layers the thermal strength of the coated body. Uneconomical coating processes are required for inorganic adhesion promoters. Roughening of the substrate surfaces is a problem wherever very fine metallization structures are required or where special optical properties (reflection, gloss) are required.

Aufgabe der Erfindung ist es ein gattungsgemäßes Verfahren anzugeben, das in kostengünstiger Weise insbesondere eine sehr fein strukturierbare und haftfeste Metallisierung auf glasigen und/oder glasartigen Körpern ermöglicht und bei dem eine Aufrahung der Oberfläche des Körpers sowie die Abscheidung eines speziellen Haftvermittlers vermieden wird.The object of the invention is to provide a generic method which, in particular, is a cost-effective method enables very fine structurable and adherent metallization on glassy and / or glassy bodies and in which a reaming of the surface of the body and the deposition of a special adhesion promoter is avoided.

Die Aufgabe wird erfindungsgemäß gelöst durch die im kennzeichnenden Teil des Patentanspruchs 1 angegebenen Merkmale. Zweckmäßige Ausgestaltungen und Weiterbildungen sind den Unteransprüchen entnehmbar.The object is achieved by the features specified in the characterizing part of patent claim 1. Appropriate refinements and developments can be found in the subclaims.

Die Erfindung wird im folgenden anhand von Ausführungsbeispielen näher erläutert.The invention is explained in more detail below on the basis of exemplary embodiments.

Beispiel 1:Example 1:

Ein scheibenförmiger Körper aus Natronkalkglas wird nach der Anwendung derzeit geläufiger Reinigungs- und Entfettungsmethoden in einer Kathodenzerstäubungsanlage mit einer ersten Schicht aus einer Indium-Zinn-Legierungsschicht mit einer Dicke von 120nm bedampft. Durch eine Behandlung in einer Palladiumchloridlösung und anschliessendem gründlichem Spülen in demineralisiertem Wasser wird eine katalytische Keimschicht erzeugt, auf der sih in einem derzeit handelsüblichen chemischen Kupferbad eine sehr gleichmäßige Kupferschicht abscheiden läßt. Nach einer Temperung wird diese galvanisch mit Kupfer verstärkt. Mit Hilfe eines derzeit üblichen Fotolack- und Ätzverfahrens werden 1mm breite Streifen präpariert, die zum senkrechten Abschälen eine Zugkraft von 0,2 N erfordern.A disk-shaped body made of soda-lime glass is vaporized after the application of currently familiar cleaning and degreasing methods in a cathode sputtering system with a first layer of an indium-tin alloy layer with a thickness of 120 nm. A treatment in a palladium chloride solution and subsequent thorough rinsing in demineralized water produces a catalytic seed layer on which a very uniform copper layer can be deposited in a currently commercially available chemical copper bath. After annealing, it is galvanically reinforced with copper. With the help of a currently customary photoresist and etching process, 1mm wide strips are prepared, which require a tensile force of 0.2 N for vertical peeling.

Beispiel 2:Example 2:

Eine Borsilikatglasscheibe wird wie in Beispiel 1 vorbehandelt und mit einer Indium-Zinn-Legierungsschicht bedampft. Durch einen Temperprozeß in Luft wird die Schicht durch Oxidation in eine lichtdurchlässige Schicht umgewandelt. Nach einer Gasphasenbeizung sowie nach einer anschließenden Hydrolyse wird mit Palladiumchloridlösung eine katalytische Keimschicht gebildet. Nach Abscheidung einer 0,3µm dicken Kupferschicht aus einem derzeit handelsüblichen chemischen Kupferbad wird eine Temperung unter Ausschluß von Sauerstoff durchgeführt. Nach einer galvanischen Verstärkung der Schicht und einer Schälstreifenpräperation gemäß Beispiel 1, wird eine Schälfestigkeit von 0,45 N/mm gemessen.A borosilicate glass pane is pretreated as in Example 1 and vapor-coated with an indium-tin alloy layer. Through a tempering process in air, the layer is converted into a translucent layer by oxidation. After gas phase pickling and subsequent hydrolysis, a catalytic seed layer is formed with palladium chloride solution. After deposition of a 0.3 µm thick copper layer from a currently commercially available chemical copper bath, tempering is carried out in the absence of oxygen. After a galvanic reinforcement of the layer and a peeling strip preparation according to Example 1, a peel strength of 0.45 N / mm is measured.

Claims (11)

1. Verfahren zur Metallisierung eines festen Körpers, der insbesondere eine Silikatwerkstoff enthaltende glasige und/oder glasartige Oberfläche besitzt, gekennzeichnet durch folgende Merkmale: a) auf die gereinigte Oberfläche wird zunächst eine erste Schicht aufgebracht, die mindestens eine Metall und/oder dessen Oxid enthält derart, daß eine nachfolgend aufgebrachte Katalysatormetallverbindung zum Katalysatormetall reduziert wird durch das in der ersten Schicht enthaltene Metall und/oder durch dessen Metallsalzschicht und/oder durch die hydrolisierte Metallsalzschicht und/oder durch dessen Oxid b) auf der durch das Katalysatormetall gebildeten katalytischen Keimschicht wird eine stromlos-chemische und/oder galvanische Metallabscheidung durchgeführt. 1. Method for metallizing a solid body, which in particular has a glassy and / or glassy surface containing silicate material, characterized by the following features: a) a first layer is first applied to the cleaned surface, which contains at least one metal and / or its oxide in such a way that a subsequently applied catalyst metal compound is reduced to the catalyst metal by the metal contained in the first layer and / or by its metal salt layer and / or through the hydrolyzed metal salt layer and / or through its oxide b) an electroless chemical and / or galvanic metal deposition is carried out on the catalytic seed layer formed by the catalyst metal. 2. Verfahren zur Metallisierung eines festen Körpers, nach Anspruch 1, dadurch gekennzeichnet, daß in der ersten Schicht mindestens ein Metall aus den Gruppen IIb bis Vb des Periodensystems der Elemente verwendet wird.2. A method for metallizing a solid body, according to claim 1, characterized in that in the first layer at least one metal from groups IIb to Vb of the periodic table of the elements is used. 3. Verfahren zur Metallisierung eines festen Körpers nach Anspruch 1 oder Anspruch 2, dadurch gekennzeichnet, daß die erste Schicht durch eine chemische Reaktion in eine lichtdurchlässige Schicht umgewandelt wird.3. A method for metallizing a solid body according to claim 1 or claim 2, characterized in that the first layer is converted into a transparent layer by a chemical reaction. 4. Verfahren zur Metallisierung eines festen Körpers nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß der Silikatwerkstoff als Natronkalkglas und/oder Borsilikatglas ausgebildet wird.4. A method for metallizing a solid body according to one of the preceding claims, characterized in that the silicate material is formed as soda-lime glass and / or borosilicate glass. 5. Verfahren zur Metallisierung eines festen Körpers nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß für die erste Schicht als Metall und/oder dessen Oxid eine Legierung aus Indium-Zinn und/oder dessen Oxid gewählt wird.5. A method for metallizing a solid body according to one of the preceding claims, characterized in that an alloy of indium tin and / or its oxide is selected for the first layer as metal and / or its oxide. 6. Verfahren zur Metallisierung eines festen Körpers nach Anspruch 5, dadurch gekennzeichnet, daß in der Legierung aus Indium-Zinn ein Indium-Zinn-Verhältnis gewählt wird, das im Bereich von 100 bis 0,01 liegt.6. A method for metallizing a solid body according to claim 5, characterized in that an indium-tin ratio is selected in the alloy of indium-tin, which is in the range of 100 to 0.01. 7. Verfahren zur Metallisierung eines festen Körpers nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die erste Schicht in einer Dicke aufgebracht wird, die im Bereich von 10 nm bis 1000 nm liegt.7. A method for metallizing a solid body according to one of the preceding claims, characterized in that the first layer is applied in a thickness which is in the range from 10 nm to 1000 nm. 8. Verfahren zur Metallisierung eines festen Körpers, nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß das Katalysatormetall eine stromlos-chemische Metallabscheidung in Gang setzt.8. A method for metallizing a solid body, according to one of the preceding claims, characterized in that the catalyst metal initiates an electroless chemical metal deposition. 9. Verfahren zur Metallisierung eines festen Körpers, nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die dünne Metallbeschichtung die Katalysatormetallverbindung in einer chemischen Reaktion zum Katalysatormetall reduziert.9. A method for metallizing a solid body, according to one of the preceding claims, characterized in that the thin metal coating reduces the catalyst metal compound in a chemical reaction to the catalyst metal. 10. Verfahren zur Metallisierung eines festen Körpers, nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die dünne Metallbeschichtung durch chemische Reaktion mit einer Säure wenigstens teilweise in eine Metallsalzschicht umgewandelt wird.10. A method for metallizing a solid body according to any one of the preceding claims, characterized in that the thin metal coating is at least partially converted into a metal salt layer by chemical reaction with an acid. 11. Verfahren zur Metallisierung eines festen Körpers, nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Metallsalz-haltige Schicht durch chemische Reaktion mit Wasser in eine Hydroxid-haltige Schicht umgewandelt wird.11. A method for metallizing a solid body, according to one of the preceding claims, characterized in that the metal salt-containing layer is converted into a hydroxide-containing layer by chemical reaction with water.
EP84108494A 1983-07-21 1984-07-18 Process for metallizing a compact body Pending EP0132784A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3326253 1983-07-21
DE19833326253 DE3326253A1 (en) 1983-07-21 1983-07-21 METHOD FOR METALLIZING A SOLID BODY

Publications (2)

Publication Number Publication Date
EP0132784A2 true EP0132784A2 (en) 1985-02-13
EP0132784A3 EP0132784A3 (en) 1985-03-20

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EP84108494A Pending EP0132784A3 (en) 1983-07-21 1984-07-18 Process for metallizing a compact body
EP84902802A Expired EP0149662B1 (en) 1983-07-21 1984-07-18 Process for the metallization of a solid body

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EP84902802A Expired EP0149662B1 (en) 1983-07-21 1984-07-18 Process for the metallization of a solid body

Country Status (6)

Country Link
US (1) US4692356A (en)
EP (2) EP0132784A3 (en)
JP (1) JPS60501858A (en)
DE (2) DE3326253A1 (en)
DK (1) DK42585A (en)
WO (1) WO1985000623A1 (en)

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EP0220541A1 (en) * 1985-10-16 1987-05-06 Nokia Unterhaltungselektronik (Deutschland) GmbH Process for metallizing transparent conducting strips
EP0279432A2 (en) * 1987-02-19 1988-08-24 Nokia (Deutschland) GmbH Method of the production of a currentlessly deposited solderable metal layer

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DE3518766A1 (en) * 1985-05-24 1986-11-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt METHOD FOR METALLIZING A SUBSTRATE
US4965101A (en) * 1987-12-10 1990-10-23 Swiss Aluminium Ltd. Ceramic foam for filters for cleaning exhaust gases of diesel engines
DE4035362A1 (en) * 1990-11-07 1992-05-14 Licentia Gmbh LCD support panel with improved electrode structure - uses internal electrodes of indium, tin and palladium oxide(s) and an external array strengthened by additional metal deposition
DE4138214A1 (en) * 1991-11-21 1993-05-27 Daimler Benz Ag Metallisation of aluminium nitride ceramic - involves ceramic treatment to remove glass surface film
DE4220621A1 (en) * 1992-06-24 1994-01-05 Daimler Benz Ag Electroless chemical prodn. of metal layer on substrate - comprises forming palladium@ layer before metallising and producing tin oxide on substrate
US20050242656A1 (en) * 2004-04-30 2005-11-03 Hogan Scott A Plated covers for vehicle wheel assemblies

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0220541A1 (en) * 1985-10-16 1987-05-06 Nokia Unterhaltungselektronik (Deutschland) GmbH Process for metallizing transparent conducting strips
US4726965A (en) * 1985-10-16 1988-02-23 Standard Elektrik Lorenz Ag Metallizing transparent conductive paths
EP0279432A2 (en) * 1987-02-19 1988-08-24 Nokia (Deutschland) GmbH Method of the production of a currentlessly deposited solderable metal layer
EP0279432A3 (en) * 1987-02-19 1990-05-09 Nokia Unterhaltungselektronik (Deutschland) Gmbh Method of the production of a currentlessly deposited solderable metal layer

Also Published As

Publication number Publication date
WO1985000623A1 (en) 1985-02-14
DE3476820D1 (en) 1989-03-30
EP0149662A1 (en) 1985-07-31
JPS60501858A (en) 1985-10-31
DE3326253A1 (en) 1985-01-31
US4692356A (en) 1987-09-08
DK42585D0 (en) 1985-01-31
DK42585A (en) 1985-03-22
EP0132784A3 (en) 1985-03-20
EP0149662B1 (en) 1989-02-22

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