EP0132784A2 - Process for metallizing a compact body - Google Patents
Process for metallizing a compact body Download PDFInfo
- Publication number
- EP0132784A2 EP0132784A2 EP84108494A EP84108494A EP0132784A2 EP 0132784 A2 EP0132784 A2 EP 0132784A2 EP 84108494 A EP84108494 A EP 84108494A EP 84108494 A EP84108494 A EP 84108494A EP 0132784 A2 EP0132784 A2 EP 0132784A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- metallizing
- metal
- solid body
- indium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
Definitions
- the invention relates to a method for metallizing a solid body according to the preamble of patent claim 1.
- Solid bodies are metallized in order to change, improve and / or expand their functional properties, for example the electrical conductivity, the corrosion resistance, the wear resistance and / or also decorative properties. With such metallizations, their adhesive strength is generally of great importance.
- the layer adhesion can be caused, for example, by a relatively weak interaction between the layer and substrate material (so-called Van der Waals forces), by chemical bonding or by mechanical anchoring and / or a combination of these contributions.
- the layer adhesion can be improved.
- adhesion-promoting intermediate layers in the form of adhesives or vapor deposition and / or sputter layers are deposited.
- Better layer adhesion is achieved by roughening the substrate, e.g. by a grinding process, and / or by swelling and roughening of the surface by chemical etching and / or by embedding foreign substances that can be removed in the adhesion promoter.
- Adhesion promoters consist of a material that differs from the substrate and the desired coating, so that unsuitable properties occur or the desired layer properties are restricted.
- Adhesion promoter made of adhesive layers the thermal strength of the coated body.
- Uneconomical coating processes are required for inorganic adhesion promoters. Roughening of the substrate surfaces is a problem wherever very fine metallization structures are required or where special optical properties (reflection, gloss) are required.
- the object of the invention is to provide a generic method which, in particular, is a cost-effective method enables very fine structurable and adherent metallization on glassy and / or glassy bodies and in which a reaming of the surface of the body and the deposition of a special adhesion promoter is avoided.
- a disk-shaped body made of soda-lime glass is vaporized after the application of currently familiar cleaning and degreasing methods in a cathode sputtering system with a first layer of an indium-tin alloy layer with a thickness of 120 nm.
- a treatment in a palladium chloride solution and subsequent thorough rinsing in demineralized water produces a catalytic seed layer on which a very uniform copper layer can be deposited in a currently commercially available chemical copper bath. After annealing, it is galvanically reinforced with copper.
- 1mm wide strips are prepared, which require a tensile force of 0.2 N for vertical peeling.
- a borosilicate glass pane is pretreated as in Example 1 and vapor-coated with an indium-tin alloy layer. Through a tempering process in air, the layer is converted into a translucent layer by oxidation. After gas phase pickling and subsequent hydrolysis, a catalytic seed layer is formed with palladium chloride solution. After deposition of a 0.3 ⁇ m thick copper layer from a currently commercially available chemical copper bath, tempering is carried out in the absence of oxygen. After a galvanic reinforcement of the layer and a peeling strip preparation according to Example 1, a peel strength of 0.45 N / mm is measured.
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
- Surface Treatment Of Glass (AREA)
- Physical Vapour Deposition (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Zur haftfesten Metallisierung eines vorzugsweise glasartigen Körpers wird nach einer dünnen Beschichtung mit einer Indium-Zinn-Legierung eine für die stromlos-chemische Metallabscheidung katalytische Keimschicht erzeugt, indem eine Katalysatormentallverbindung durch die Indium-Zinn-Schicht direkt oder nach einer Salzbildung und Hydrolyse der Indium-Zinn-Schicht durch diese zum Katalysatormetall reduziert wird. Nach der stromlos-chemischen Metallisierung kann mit derzeit üblichen Metallen galvanisch weiterverstärkt werden.For the adherent metallization of a preferably glass-like body, after a thin coating with an indium-tin alloy, a seed layer catalytic for the electroless chemical metal deposition is generated by a catalyst metal compound through the indium-tin layer directly or after salt formation and hydrolysis of the indium Tin layer is reduced by this to the catalyst metal. After the electroless chemical metallization, galvanic amplification can be carried out with currently customary metals.
Description
Die Erfindung betrifft ein Verfahren zur Metallisierung eines festen Körpers nach dem Oberbegriff des Patentanspruchs 1.The invention relates to a method for metallizing a solid body according to the preamble of patent claim 1.
Feste Körper werden metallisiert, um deren funktionelle Eigenschaften, z.B. die elektrische Leitfähigkeit, die Korrosionsbeständigkeit, die Verschleißfestigkeit und/oder auch dekorative Eigenschaften zu verändern, zu verbessern und/oder zu erweitern. Bei derartigen Metallisierungen ist im allgemeinen deren Haftfestigkeit von großer Bedeutung. Die Schichthaftung kann z.B. durch relativ schwache Wechselwirkung zwischen Schicht- und Substratmaterial (sogenannten Van der Waals-Kräfte), durch chemische Bindungen oder durch mechanische Verankerungen und/oder durch eine Kombination dieser Beiträge bewirkt werden.Solid bodies are metallized in order to change, improve and / or expand their functional properties, for example the electrical conductivity, the corrosion resistance, the wear resistance and / or also decorative properties. With such metallizations, their adhesive strength is generally of great importance. The layer adhesion can be caused, for example, by a relatively weak interaction between the layer and substrate material (so-called Van der Waals forces), by chemical bonding or by mechanical anchoring and / or a combination of these contributions.
Es sind Verfahren bekannt, mit deren Hilfe sich die Schichthaftung verbessern läßt. So können z.B. haftvermittelnde Zwischenschichten in Form von Klebern oder Aufdampf- und/oder Sputter-Schichten abgeschieden werden. Eine bessere Schichthaftung wird erreicht durch eine Substrataufrauhung, z.B. durch einen Schleifprozeß, und/oder durch Anquellen sowie Aufrauhen der Oberfläche durch chemisches Ätzen und/oder durch eine Einbettung herauslösbarer Fremdstoffe in den Haftvermittler.Methods are known by means of which the layer adhesion can be improved. For example, adhesion-promoting intermediate layers in the form of adhesives or vapor deposition and / or sputter layers are deposited. Better layer adhesion is achieved by roughening the substrate, e.g. by a grinding process, and / or by swelling and roughening of the surface by chemical etching and / or by embedding foreign substances that can be removed in the adhesion promoter.
Diese bekannten Verfahren sind auf bestimmte Anwendungsfälle und spezielle Materialkombinationen beschränkt. Haftvermittler bestehen aus einem Material, das vom Substrat und der gewünschten Beschichtung verschieden ist, so daß unpassende Eigenschaften auftreten oder eine Einschränkung der gewünschten Schichteigenschaften erfolgt. So verringern z.B. Haftvermittler aus Klebeschichten die thermische Belastbarkeit des beschichteten Körpers. Für anorganische Haftvermittler werden unwirtschaftliche Beschichtungsverfahren benötigt. Eine Aufrauhung der Substratoberflächen stört überall dort, wo sehr feine Metallisierungsstrukturen benötigt werden oder wo spezielle optische Eigenschaften (Reflexion, Glanz) verlangt werden.These known methods are limited to certain applications and special material combinations. Adhesion promoters consist of a material that differs from the substrate and the desired coating, so that unsuitable properties occur or the desired layer properties are restricted. For example, Adhesion promoter made of adhesive layers the thermal strength of the coated body. Uneconomical coating processes are required for inorganic adhesion promoters. Roughening of the substrate surfaces is a problem wherever very fine metallization structures are required or where special optical properties (reflection, gloss) are required.
Aufgabe der Erfindung ist es ein gattungsgemäßes Verfahren anzugeben, das in kostengünstiger Weise insbesondere eine sehr fein strukturierbare und haftfeste Metallisierung auf glasigen und/oder glasartigen Körpern ermöglicht und bei dem eine Aufrahung der Oberfläche des Körpers sowie die Abscheidung eines speziellen Haftvermittlers vermieden wird.The object of the invention is to provide a generic method which, in particular, is a cost-effective method enables very fine structurable and adherent metallization on glassy and / or glassy bodies and in which a reaming of the surface of the body and the deposition of a special adhesion promoter is avoided.
Die Aufgabe wird erfindungsgemäß gelöst durch die im kennzeichnenden Teil des Patentanspruchs 1 angegebenen Merkmale. Zweckmäßige Ausgestaltungen und Weiterbildungen sind den Unteransprüchen entnehmbar.The object is achieved by the features specified in the characterizing part of patent claim 1. Appropriate refinements and developments can be found in the subclaims.
Die Erfindung wird im folgenden anhand von Ausführungsbeispielen näher erläutert.The invention is explained in more detail below on the basis of exemplary embodiments.
Ein scheibenförmiger Körper aus Natronkalkglas wird nach der Anwendung derzeit geläufiger Reinigungs- und Entfettungsmethoden in einer Kathodenzerstäubungsanlage mit einer ersten Schicht aus einer Indium-Zinn-Legierungsschicht mit einer Dicke von 120nm bedampft. Durch eine Behandlung in einer Palladiumchloridlösung und anschliessendem gründlichem Spülen in demineralisiertem Wasser wird eine katalytische Keimschicht erzeugt, auf der sih in einem derzeit handelsüblichen chemischen Kupferbad eine sehr gleichmäßige Kupferschicht abscheiden läßt. Nach einer Temperung wird diese galvanisch mit Kupfer verstärkt. Mit Hilfe eines derzeit üblichen Fotolack- und Ätzverfahrens werden 1mm breite Streifen präpariert, die zum senkrechten Abschälen eine Zugkraft von 0,2 N erfordern.A disk-shaped body made of soda-lime glass is vaporized after the application of currently familiar cleaning and degreasing methods in a cathode sputtering system with a first layer of an indium-tin alloy layer with a thickness of 120 nm. A treatment in a palladium chloride solution and subsequent thorough rinsing in demineralized water produces a catalytic seed layer on which a very uniform copper layer can be deposited in a currently commercially available chemical copper bath. After annealing, it is galvanically reinforced with copper. With the help of a currently customary photoresist and etching process, 1mm wide strips are prepared, which require a tensile force of 0.2 N for vertical peeling.
Eine Borsilikatglasscheibe wird wie in Beispiel 1 vorbehandelt und mit einer Indium-Zinn-Legierungsschicht bedampft. Durch einen Temperprozeß in Luft wird die Schicht durch Oxidation in eine lichtdurchlässige Schicht umgewandelt. Nach einer Gasphasenbeizung sowie nach einer anschließenden Hydrolyse wird mit Palladiumchloridlösung eine katalytische Keimschicht gebildet. Nach Abscheidung einer 0,3µm dicken Kupferschicht aus einem derzeit handelsüblichen chemischen Kupferbad wird eine Temperung unter Ausschluß von Sauerstoff durchgeführt. Nach einer galvanischen Verstärkung der Schicht und einer Schälstreifenpräperation gemäß Beispiel 1, wird eine Schälfestigkeit von 0,45 N/mm gemessen.A borosilicate glass pane is pretreated as in Example 1 and vapor-coated with an indium-tin alloy layer. Through a tempering process in air, the layer is converted into a translucent layer by oxidation. After gas phase pickling and subsequent hydrolysis, a catalytic seed layer is formed with palladium chloride solution. After deposition of a 0.3 µm thick copper layer from a currently commercially available chemical copper bath, tempering is carried out in the absence of oxygen. After a galvanic reinforcement of the layer and a peeling strip preparation according to Example 1, a peel strength of 0.45 N / mm is measured.
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3326253 | 1983-07-21 | ||
DE19833326253 DE3326253A1 (en) | 1983-07-21 | 1983-07-21 | METHOD FOR METALLIZING A SOLID BODY |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0132784A2 true EP0132784A2 (en) | 1985-02-13 |
EP0132784A3 EP0132784A3 (en) | 1985-03-20 |
Family
ID=6204509
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP84108494A Pending EP0132784A3 (en) | 1983-07-21 | 1984-07-18 | Process for metallizing a compact body |
EP84902802A Expired EP0149662B1 (en) | 1983-07-21 | 1984-07-18 | Process for the metallization of a solid body |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP84902802A Expired EP0149662B1 (en) | 1983-07-21 | 1984-07-18 | Process for the metallization of a solid body |
Country Status (6)
Country | Link |
---|---|
US (1) | US4692356A (en) |
EP (2) | EP0132784A3 (en) |
JP (1) | JPS60501858A (en) |
DE (2) | DE3326253A1 (en) |
DK (1) | DK42585A (en) |
WO (1) | WO1985000623A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0220541A1 (en) * | 1985-10-16 | 1987-05-06 | Nokia Unterhaltungselektronik (Deutschland) GmbH | Process for metallizing transparent conducting strips |
EP0279432A2 (en) * | 1987-02-19 | 1988-08-24 | Nokia (Deutschland) GmbH | Method of the production of a currentlessly deposited solderable metal layer |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3518766A1 (en) * | 1985-05-24 | 1986-11-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | METHOD FOR METALLIZING A SUBSTRATE |
US4965101A (en) * | 1987-12-10 | 1990-10-23 | Swiss Aluminium Ltd. | Ceramic foam for filters for cleaning exhaust gases of diesel engines |
DE4035362A1 (en) * | 1990-11-07 | 1992-05-14 | Licentia Gmbh | LCD support panel with improved electrode structure - uses internal electrodes of indium, tin and palladium oxide(s) and an external array strengthened by additional metal deposition |
DE4138214A1 (en) * | 1991-11-21 | 1993-05-27 | Daimler Benz Ag | Metallisation of aluminium nitride ceramic - involves ceramic treatment to remove glass surface film |
DE4220621A1 (en) * | 1992-06-24 | 1994-01-05 | Daimler Benz Ag | Electroless chemical prodn. of metal layer on substrate - comprises forming palladium@ layer before metallising and producing tin oxide on substrate |
US20050242656A1 (en) * | 2004-04-30 | 2005-11-03 | Hogan Scott A | Plated covers for vehicle wheel assemblies |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3427197A (en) * | 1965-01-27 | 1969-02-11 | Lockheed Aircraft Corp | Method for plating thin titanium films |
DE1621367A1 (en) * | 1967-10-18 | 1971-05-06 | Telefunken Patent | Method for activating a metallization layer |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3889017A (en) * | 1971-02-02 | 1975-06-10 | Ppg Industries Inc | Chemical filming solution and process for plating therewith |
US4307168A (en) * | 1977-05-05 | 1981-12-22 | Eastman Kodak Company | Amplification of developed electrographic image patterns |
US4322457A (en) * | 1978-01-25 | 1982-03-30 | Western Electric Co., Inc. | Method of selectively depositing a metal on a surface |
US4354911A (en) * | 1981-08-07 | 1982-10-19 | Western Electric Company Inc. | Method of selectively depositing a metal on a surface by means of sputtering |
US4444848A (en) * | 1982-01-04 | 1984-04-24 | Western Electric Co., Inc. | Adherent metal coatings on rubber-modified epoxy resin surfaces |
-
1983
- 1983-07-21 DE DE19833326253 patent/DE3326253A1/en not_active Withdrawn
-
1984
- 1984-07-18 EP EP84108494A patent/EP0132784A3/en active Pending
- 1984-07-18 US US06/703,679 patent/US4692356A/en not_active Expired - Fee Related
- 1984-07-18 WO PCT/EP1984/000223 patent/WO1985000623A1/en active IP Right Grant
- 1984-07-18 EP EP84902802A patent/EP0149662B1/en not_active Expired
- 1984-07-18 JP JP59502863A patent/JPS60501858A/en active Pending
- 1984-07-18 DE DE8484902802T patent/DE3476820D1/en not_active Expired
-
1985
- 1985-01-31 DK DK42585A patent/DK42585A/en not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3427197A (en) * | 1965-01-27 | 1969-02-11 | Lockheed Aircraft Corp | Method for plating thin titanium films |
DE1621367A1 (en) * | 1967-10-18 | 1971-05-06 | Telefunken Patent | Method for activating a metallization layer |
Non-Patent Citations (1)
Title |
---|
IBM TECHNICAL DISCLOSURE BULLETIN, Band 23, Nr. 10, April 1981, Seite 4914, New York, USA; E. D'ANTONIO et al.: "Process for cleaning and activating molybdenum for electroless nickel plating" * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0220541A1 (en) * | 1985-10-16 | 1987-05-06 | Nokia Unterhaltungselektronik (Deutschland) GmbH | Process for metallizing transparent conducting strips |
US4726965A (en) * | 1985-10-16 | 1988-02-23 | Standard Elektrik Lorenz Ag | Metallizing transparent conductive paths |
EP0279432A2 (en) * | 1987-02-19 | 1988-08-24 | Nokia (Deutschland) GmbH | Method of the production of a currentlessly deposited solderable metal layer |
EP0279432A3 (en) * | 1987-02-19 | 1990-05-09 | Nokia Unterhaltungselektronik (Deutschland) Gmbh | Method of the production of a currentlessly deposited solderable metal layer |
Also Published As
Publication number | Publication date |
---|---|
WO1985000623A1 (en) | 1985-02-14 |
US4692356A (en) | 1987-09-08 |
DK42585A (en) | 1985-03-22 |
DK42585D0 (en) | 1985-01-31 |
EP0149662B1 (en) | 1989-02-22 |
DE3326253A1 (en) | 1985-01-31 |
JPS60501858A (en) | 1985-10-31 |
EP0149662A1 (en) | 1985-07-31 |
DE3476820D1 (en) | 1989-03-30 |
EP0132784A3 (en) | 1985-03-20 |
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Legal Events
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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PUAL | Search report despatched |
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AK | Designated contracting states |
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Effective date: 19850502 |
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XX | Miscellaneous |
Free format text: VERFAHREN ABGESCHLOSSEN INFOLGE VERBINDUNG MIT 84902802.2/0149662 (EUROPAEISCHE ANMELDENUMMER/VEROEFFENTLICHUNGSNUMMER) VOM 07.10.85. |
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Free format text: STATUS: EXAMINATION IS IN PROGRESS |
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Effective date: 19871216 |
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RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: VOIT, GABRIELE Inventor name: OSTWALD, ROBERT, DR. |