DE3375964D1 - Transparent container for electrostatic sensitive electronic components - Google Patents

Transparent container for electrostatic sensitive electronic components

Info

Publication number
DE3375964D1
DE3375964D1 DE8383304261T DE3375964T DE3375964D1 DE 3375964 D1 DE3375964 D1 DE 3375964D1 DE 8383304261 T DE8383304261 T DE 8383304261T DE 3375964 T DE3375964 T DE 3375964T DE 3375964 D1 DE3375964 D1 DE 3375964D1
Authority
DE
Germany
Prior art keywords
electronic components
transparent container
sensitive electronic
electrostatic sensitive
electrostatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383304261T
Other languages
English (en)
Inventor
Gerald E Minnesota Min Mueller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Application granted granted Critical
Publication of DE3375964D1 publication Critical patent/DE3375964D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67396—Closed carriers characterised by the presence of antistatic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
DE8383304261T 1982-08-26 1983-07-22 Transparent container for electrostatic sensitive electronic components Expired DE3375964D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/411,348 US4553190A (en) 1982-08-26 1982-08-26 Transparent container for electrostatic sensitive electronic components

Publications (1)

Publication Number Publication Date
DE3375964D1 true DE3375964D1 (en) 1988-04-14

Family

ID=23628562

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383304261T Expired DE3375964D1 (en) 1982-08-26 1983-07-22 Transparent container for electrostatic sensitive electronic components

Country Status (12)

Country Link
US (1) US4553190A (de)
EP (1) EP0102185B1 (de)
JP (1) JPS5957500A (de)
KR (1) KR840005923A (de)
AU (1) AU560846B2 (de)
BR (1) BR8304596A (de)
CA (1) CA1224445A (de)
DE (1) DE3375964D1 (de)
IE (1) IE54566B1 (de)
MX (1) MX153423A (de)
PH (1) PH20288A (de)
ZA (1) ZA836309B (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0134911A3 (de) * 1983-07-26 1986-04-02 Alfred Lemmer IC-Stangenmagazin
GB8417978D0 (en) * 1984-07-14 1984-08-15 Abeco Ltd Circuit board assembly
GB8529355D0 (en) * 1985-11-28 1986-01-02 Yen Wei Hsiung Packaging of electrical components
EP0262431B1 (de) * 1986-09-29 1991-01-02 BBC Brown Boveri AG Wärmeschutzgehäuse
GB8712338D0 (en) * 1987-05-26 1987-07-01 Yen W H Packaging of electrical components
US4792042A (en) * 1987-11-24 1988-12-20 Minnesota Mining And Manufacturing Company Transparent box for protecting against damage from electrostatic discharge and sheet material to be cut into a box blank for forming same
DE3810594A1 (de) * 1988-03-29 1989-10-12 Heigl Helmuth Anordnung zum schutz integrierter bauelemente vor beschaedigung durch unkontrollierte elektrostatische entladung in handhabungssystemen
GB2216875B (en) * 1988-04-06 1992-01-08 Motorola Ltd Container
US5017260A (en) * 1989-04-12 1991-05-21 Bradford Company Anti-static coated paperboard or similar rigid material
US5205406A (en) * 1988-05-04 1993-04-27 Bradford Company Anti-static coated paperboard or similar rigid material
US4966280B1 (en) * 1988-05-04 1997-03-25 Bradford Co Multiple-ply anti-static paperboard
US5613610A (en) * 1988-05-04 1997-03-25 Bradford Company Naturally degradable and recyclable static-dissipative packaging material
US5143253A (en) * 1988-09-02 1992-09-01 Tdk Corporation Chip packaging means and supply mechanism for supplying chips by using the chip packaging means
US5180615A (en) * 1989-12-13 1993-01-19 W.R. Grace & Co.-Conn. Metallized bag for static protection of electronic components
US5175033A (en) * 1990-06-22 1992-12-29 W. R. Grace & Co.-Conn. Metallized bag with improved interlayer adhesion for static protection of electronic components
JPH04354363A (ja) * 1991-05-31 1992-12-08 Fujitsu Ltd 半導体装置ユニット
DE4206727C2 (de) * 1992-03-04 1997-08-14 Wolfgang Warmbier Systeme Gege Mehrschichtige Werkstoffbahn für einen Verpackungsbehälter
JPH0622436A (ja) * 1992-07-02 1994-01-28 Hitachi Ltd ガス絶縁機器用絶縁物
US5375709A (en) * 1993-06-04 1994-12-27 Siemens Medical Systems, Inc. Printed circuit board carrier and reusable transport packaging
US5417842A (en) * 1993-08-30 1995-05-23 Texas Instruments Incorporated End lock magazine for semiconductor devices
US5441809A (en) * 1993-10-28 1995-08-15 Brady U.S.A., Inc. Dissipative cover tape surface mount device packaging
DE19603268A1 (de) * 1996-01-30 1997-07-31 Riedel Manfred Dipl Ing Fh Elektrisch leitfähige Montage-Verpackungen für elektonische Bauteile (SMD-Verpackungen bzw. Blistergurte)
US5914191A (en) * 1996-05-03 1999-06-22 Eastman Chemical Company Multilayered packaging materials for electrostatic applications
US5910878A (en) * 1997-06-26 1999-06-08 International Business Machines Corporation Method and apparatus for protecting electrical devices from static electricity
DE10057788A1 (de) * 2000-11-22 2002-06-06 Siemens Production & Logistics Abdeckung für elektrostatisch gefährdete Bauelemente
US6730401B2 (en) 2001-03-16 2004-05-04 Eastman Chemical Company Multilayered packaging materials for electrostatic applications
AU2003275341A1 (en) * 2002-10-01 2004-04-23 Microtome Precision, Inc. Reduction of electric-field-induced damage in field-sensitive articles
US7525047B2 (en) * 2004-07-28 2009-04-28 International Business Machines Corporation Cable having translucent, semi-transparent or transparent ESD dissipative layer and/or metallic layer
US10500705B2 (en) * 2017-04-07 2019-12-10 Chad A. French Fastener holder and dispenser
JP6578033B2 (ja) * 2018-01-29 2019-09-18 ウォン ユン、セ 電子部品の容器の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL106520C (de) * 1956-09-01 1900-01-01
US3801418A (en) * 1972-03-16 1974-04-02 Atomic Energy Commission Transparent anti-static device
JPS5254583A (en) * 1975-10-29 1977-05-04 Hitachi Ltd Method of encasing electronic parts in magazine
US4037267A (en) * 1976-05-24 1977-07-19 Rca Corporation Package for semiconductor components
US4154344A (en) * 1976-11-09 1979-05-15 Minnesota Mining And Manufacturing Company Material for forming envelopes used to protect electronic components
US4166876A (en) * 1977-03-28 1979-09-04 Teijin Limited Transparent, electrically conductive laminated structure and process for production thereof
JPS5465694A (en) * 1977-11-04 1979-05-26 Teijin Ltd Film for packing
JPS5647953U (de) * 1979-09-20 1981-04-28
US4327832A (en) * 1980-06-26 1982-05-04 Thielex Plastics Corporation Container for packaging semiconductor components
JPS5726457A (en) * 1980-07-23 1982-02-12 Hitachi Ltd Magazine
JPS5762597A (en) * 1980-10-01 1982-04-15 Hitachi Ltd Magazine for preventing electrostatic breakdown

Also Published As

Publication number Publication date
IE831989L (en) 1984-02-26
AU560846B2 (en) 1987-04-16
CA1224445A (en) 1987-07-21
ZA836309B (en) 1984-04-25
KR840005923A (ko) 1984-11-19
PH20288A (en) 1986-11-18
BR8304596A (pt) 1984-04-03
IE54566B1 (en) 1989-11-22
AU1842283A (en) 1984-03-01
US4553190A (en) 1985-11-12
EP0102185A1 (de) 1984-03-07
EP0102185B1 (de) 1988-03-09
MX153423A (es) 1986-10-07
JPS5957500A (ja) 1984-04-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee